ONYX29 - Air-Vac

ONYX29
THE FUTURE OF ROBOTIC LEAD-FREE REWORK AND LOW VOLUME
ASSEMBLY OF EMERGING & CURRENT TECHNOLOGY INCLUDING
0201, FLIP CHIP, MICRO BGA/CSP, MEMS, OPTOELECTRONICS,
MICROWAVE, MLF’S, BGA, CSP, LEADED DEVICES AND SURFACE
MOUNT CONNECTORS.
www.air-vac-eng.com

AUTOMATION
The ONYX29 has enhanced capability in part handling, micro-force pick and
place control, dispensing, alignment, placement accuracy, preheat and precision
reflow control; requirements far beyond the capability of current semiautomated
or manual processes. The ONYX29 provides seven axes of
automation which include X, Y, Z, theta, vision zoom, vision X and vision Y.
Multiple Field of View (MFOV) automatically indexes the camera to the four
corners of large components up to 75mm.
NOZZLE & DISPENSING TECHNOLOGY
Nozzle technology is critical to application success. Air-Vac’s internal nozzle
design and manufacturing capability is a major competitive advantage. The
ONYX29 adds integrated precision dispensing of solder paste, flux, epoxy or
underfill.
VISUAL MACHINES TM SOFTWARE
• Graphical user interface provides a visual representation of the board and
component locations to the operator. One or multiple component sites can
be reworked during a single cycle.
• Expanding component library includes ready-made process sequences and
thermal parameters for Tin/Lead and Lead-Free components.
AUTOMATED PRECISION COMPONENT PICK-UP
• Multi-position pick capability from large and small waffle trays, gel packs, tape
and reel, and single component nest.
• Precision Micro-Force sensing provides the extremely low force needed to pick
tiny, fragile devices.
LEAD-FREE REQUIREMENTS
• Powerful 2000 watt top heater.
• Infra-red (IR) bottom heating technology. The heating element provides
extremely uniform preheat over the entire surface. The bottom heating
panel is 19" x 19" and features four (4) independently programmable
heating zones (1400 watts per zone, 5600 watts total).
• Programmable cold air injection and linear air knife provide precise cool
down control to optimize time over reflow.
• Interactive thermal profiling provides "on-the-fly" adjustments.
SITE CLEANING
• NEW Micro Tip Site Clean Assembly (#1015.11.059) with a high temp,
non-abrasive, composite vacuum micro tip with an inside diameter of 0.063".
• Composite vacuum tip with automatic height adjustment, automatically
compensates for variable residual solder volume.
• Eliminates potential damage to pads or solder mask caused by contact-based
methods.
• Especially critical for removal of Lead-Free solder with higher reflow
temperature and for micro site cleaning of small, fragile pads/solder mask.
Programmable micro tips remove solder from small sites without affecting
adjacent devices.
• Powerful heat and vacuum, combined with high efficiency bottom heating,
can also remove solder from barrels of through hole and Mictor connectors.
• Conductive heating/vacuum tips remove solder from 0201 and other pads
where convective site cleaning can not be used.
TECHNICAL DATA
Contact Air-Vac directly.
HEADQUARTERS: 30 PROGRESS AVE • SEYMOUR, CT 06483 • 203-888-9900
AIR-VAC ENGINEERING
WEST COAST OFFICE: 2131 L AS PALMAS DRIVE, SUITE D • CARLSBAD, CA 92009
www.air-vac-eng.com