Title of Presentation - iNEMI

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Tin Whisker Project: Seven Phases, continued • Phase 5 (2004 – 2007) Investigated the effects of temperature and humidity over a wide range of conditions on tin whisker growth – Matte Sn over Cu leadframes (C194). Multiple thicknesses (3 & 10 mm) and reflow conditions were included. 13 sample sets in total. – 10 Conditions: Tested 30 o C to 100 o C & 10% to 90% Humidity Storage – Durations Tested were up to 13000 hours for certain conditions. – Models are proposed for corrosion incubation, whisker incubation, and whisker growth rates. – Results were presented at 57th ECTC(2007) 11
Experimental Design - Phase 5 • Large experimental matrix of test conditions and tin platings 12
Page 1 and 2: iNEMI Tin Whisker Project: Overview
Page 3 and 4: Tin Film on Copper • Compressive
Page 5 and 6: Tin Whisker Formation in Electronic
Page 7 and 8: Yes, there are tin whisker problems
Page 9 and 10: Tin Whisker Project: Seven Phases
Page 11: Oxidation/Corrosion: Another Origin
Page 15 and 16: Phase 5 Publications • Results we
Page 17 and 18: Impact of Microstructure, cont. •
Page 19 and 20: EBSD Measurements - Grain Orientati
Page 21 and 22: Completion of Project: Open Questio
Page 23: www.inemi.org Email contacts: Bob P

Title of Presentation - iNEMI

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