Title of Presentation - iNEMI
Title of Presentation - iNEMI
Title of Presentation - iNEMI
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Impact <strong>of</strong> Microstructure, cont.<br />
• NIST supplied the tungsten substrates with sputtered Sn as a seed layer for plating<br />
• RamChem (Hong Kong Lab) performed the plating <strong>of</strong> the brass and tungsten<br />
coupons (03-2009)<br />
• Boeing did preliminary EBSD (Chris Meyers & Tom Woodrow) to develop the<br />
techniques needed for the 3 plating finishes.<br />
• Boeing and HP performed stress tests<br />
• Boeing and NIST (Maureen Williams) performed EBSD to quantify the tin grain<br />
structure<br />
• Purdue (Pylin Sarobol, Aaron Pedigo, Michael Jablonski) performed X-ray texture<br />
and EBSD measurements<br />
Raw Image and Normal Direction Inverse Pole Figure<br />
EBSD Scan: 25 X 25 µm, 0.1 µm step size:<br />
C. Meyer; Boeing<br />
Matte tin on brass #5, NIST EBSD; M. Williams<br />
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