EF-Series - The Solder Connection

A L P H A 

ENABLING TECHNOLOGY LEADERSHIP 

ALPHA 

EF-Series 

Environmentally Friendly 

FLUXES 

Air. 

Earth. 

ALPHA 

EF-2202 

Flux 

Now you can protect the environment. 

• Remove VOCs 

• Transition to lead-free 

® 

Fire. 

Water. 

And your boards can survive heat and humidity. 

• Meet electrical reliability requirements 

Pass Bellcore 

Pass IPC 

Product Manual 

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ALPHA 



FLUXES 

EF-2202 Environmentally Friendly Flux 

Information Manual 

A L P H A 

EF-Series Introduction 

EF-2202 Product Manual 

1. Performance Summary 

2. Wide Process Window 

3. Technical Bulletin 

4. MSDS 

5. Process Guidelines 

6. Performance vs Competition 

7. Electrical Reliability Data 

8. Qualification Tools 




WELCOME TO THE ALPHA 

EF-2202 INTERACTIVE 

PRODUCT MANUAL. 

SIMPLY CLICK ON THE 

NAVIGATION BUTTONS TO 

QUICKLY LOCATE SPECIFIC 

PRODUCT INFORMATION. 

THERE ARE LINKS TO OTHER 

DOCUMENTS AND TO 

COOKSON’S WEB SITE, WHERE 

YOU CAN OBTAIN ADDITIONAL 

INFORMATION. (TO USE THIS 

FEATURE YOU MUST LAUNCH 

YOUR INTERNET BROWSER.) 

ALPHA EF-2202 meets the needs of 

telecommunications companies, and 

EMS companies involved in processing 

a variety of board types, usually in a highproduct-mix 

environment. 

EF-2202, a water-based flux, delivers 

excellent solderability and reliability 

providing excellent wetting/hole fill versus 

its leading competitor. EF-2202 exhibits 

very low solderballing versus the leading 

competitor. In applications where cosmetics 

are a major factor in board acceptance, 

EF-2202 offers a very clear appearance 

with exceptional joint and board cosmetics. 

In addition to being lead-free process 

capable, EF-2202 is very low in VOC 

content and has no resin/rosin content. 

® 

ALPHA 


Flux 

Troubleshooting Guide 

VOC Leadership 

Lead-Free Leadership 

EF-2202 is Bellcore compliant, provides 

excellent pin testability and minimizes 

equipment maintenance. 

ALPHA FLUX Product Line 

Global Availability 

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The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding 

the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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A L P H A 

ALPHA 



Fluxes 

1.1 1.2 

EF-2202 PRODUCT PERFORMANCE SUMMARY 

EF-2202 Performance Summary 





Process EF-2202 Attributes Performance Capability 

Benefit 

Solderballs 

On average 45% less micro solderballs than the 

leading competitor, dual wave; 60% less than NR-330 


4. MSDS 



Soldering 

Hole Fill (Lead-Free) 

Hole Fill (Sn/Pb) 

14% more holes filled versus leading competitor, single wave 

31% more holes filled versus leading competitor, dual wave 

12% more hole fill by weight versus leading competitor 



Bridging 

Minimal bridging 





Cosmetics 

Solder Joint With 

Sn 63 and Lead-free Alloys 

Flux Residue 

Smooth shiny joints with full fusion 

Clear, transparent residues 



Selective 


Compatibility 

Effective for use when selective solder pallets are used 



In-Circuit 

Test Yield 

Pin Testability 

Full and reliable pin testability: no residue buildup 

Ease of Use Spray Fluxing Designed specifically for spray fluxing applications 

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A L P H A 

ALPHA 



Fluxes 

1.1 1.2 

EF-2202 Key Attribute Benefits 

EF-2202 PRODUCT PERFORMANCE SUMMARY 





Selective 


Wetting/Holefill 

100%* 

75% 

Bridging 


NR-330 

Leading Competitor 


4. MSDS 

50% 




Cleanability 

25% 

Pin Testability 






Conformal 

Coating 

0% 

EM 

EM, SIR 

Bellcore 





Joint Cosmetics 

Bulk Insulation 

Resistance 

* 100% = best-in-product-class performance 

Micro Solderballs 

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ALPHA 



Fluxes 

2.1 2.2 

EF-2202 Wide Process Window 

A L P H A 

EF-2202 WIDE PROCESS WINDOW 






4. MSDS 








Process 

Suggested Process Settings 

Parameters 

Sn/Pb Alloy System 

Lead-Free Alloy System 

Conveyor speed 1.0-1.5 m/min 1.0-1.5 m/min 

Flux loading 70-120 micrograms/cm2* 70-120 micrograms/cm2* 

Single Wave Topside preheat 100-113°C 100-115°C 

Solder pot temperature 240-260°C 255-265°C 

Wave height 1/2 to 2/3 of board thickness 1/2 to 2/3 of board thickness 



Dual Wave Topside preheat 100-113°C 100-115°C 








Note: 

These process parameters were used in product development work and are guidelines only. 

They may not be optimal for your process. You will need to optimize the process parameters for 

your particular application. 

* Flux weight after preheat. 


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ALPHA 



Fluxes 

3.1 

A L P H A 

EF-2202 TECHNICAL BULLETIN 






4. MSDS 










To view the EF-2202 Technical Bulletin, click here. 




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ALPHA 



Fluxes 

4.1 

A L P H A 

EF-2202 MSDS 






4. MSDS 










To view the EF-2202 MSDS, click here 




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A L P H A 

ALPHA 



Fluxes 






4. MSDS 













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5.1 

EF-2202 Wave Soldering Flux 

Recommended Process Guidelines 

Safety 

EF-2202 is a non-flammable, water 

based flux. Please refer to the 

EF-2202 Material Safety Data Sheet 

as the primary source of health and 

safety information. 

Storage 

Keep from freezing. If frozen, thaw 

and mix thoroughly before use. 

Shelf life 

Shelf life of material stored at a 

standard temperature of 25°C is 18 

months in a factory-sealed container. 


Compatibility with 

ALPHA Pastes 

EF-2202 is tested and is compatible 

with ALPHA no-clean solder pastes 

and water-soluble solder pastes 

after cleaning. 

Cleaning 

EF-2202 is a no-clean flux and the 

residues are designed to be left on 

the board. If desired, flux residues 

can be removed with ALPHA 

EC-Ultra semi-aqueous cleaner or 

with other commercially available 

solvents. 


the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 

EF-2202 PROCESS GUIDELINES 

Rework 

Use of the Cleanline Write Flux 

Applicator with NR-205 flux and 

Telecore Plus cored solder is 

recommended for hand soldering 

applications. 

For lead-free products, the following 

SAC 305 wires can be used: Telecore 

Plus and Fluitin1532. 

Wave soldering machines: Tested to work with convection and combination convection/IR preheat machines 

Process 

Suggested Process Settings 

Parameters SnPb Alloy System Lead-Free Alloy System 



Single Wave Topside preheat 100-113°C 100-115°C 





Dual Wave Topside preheat 100-113°C 100-115°C 



Note: These process parameters were used in product development work and are guidelines only. They may not be optimal for your process. 

You will need to optimize the process parameters for your particular application. 

* Flux weight after preheat.

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A L P H A 

ALPHA 



Fluxes 






4. MSDS 











6.1 6.2 6.3 

EF-2202 Flux Performance vs Competition 

Micro Solderballing Comparison 

Avg. Micro Solderballs / 100 Pins 

100 

80 

60 

40 

20 

0 

Micro Solderballing Comparison 

Enthone Mask Dual Wave 


Leading 

Competitor 

PSR4000 Mask Dual Wave 


EF-2202 Enhanced Performance Attributes 

EF-2202 PERFORMANCE VERSUS COMPETITION 

Leading 

Competitor 

Solderballing – EF-2202 yields fewer solderballs than the leading 

competition for dual wave on Cu OSP. 




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ALPHA 



Fluxes 






4. MSDS 




6.1 6.2 6.3 

EF-2202 Flux Performance 

Flux Residue Comparison 

A L P H A 

EF-2202 FLUX PERFORMANCE 











EF-2202 Enhanced Performance 

Attributes 

Selective Soldering Flux Residue Cosmetics – 

EF-2202 leaves no residue around the pallet 

edges in contrast to the white residues left 

by the leading competitors. 

NR-330 

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PCB with pallet bottom 



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A L P H A 

ALPHA 



Fluxes 






4. MSDS 







6.1 6.2 6.3 

EF-2202 PERFORMANCE VERSUS COMPETITION 

EF-2202 Flux Performance vs Competition 

Hole Fill 

Percentage Hole Fill 

60 

50 

40 

30 

20 

Hole Fill Comparison – SAC 305 

Single Wave 


Leading 

Competitor 


Dual Wave 

Leading 

Competitor 








EF-2202 Enhanced Performance Attributes 

Wetting/Hole Fill (OSP on Cu finish) EF-2202 is clearly a significant 

improvement over the leading competitor. 

EF-2202 yields >12% more solderability for Sn/Pb versus the 

leading competitor. 

Conditions: Tested after single reflow with 160°C soak, 220°C peak, 55 sec TAL in air 

Leading Competitor 

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ALPHA 



Fluxes 

7.1 7.2 7.3 

EF-2202 Electrical Reliability 

A L P H A 

EF-2202 ELECTRICAL RELIABILITY DATA 


Bellcore SIR 

IPC SIR 

Electromigration 





4. MSDS 


SIR Test Report – Bellcore 

(per GR-78-CORE Issue 1, September 1997) 

Test: 0244-5b 

Date: 7/8/02 

T/H/B: 35/85/-48 

Material Tested/ SIR SIR 

Condition (1 day) (4 days) 

SIR Test Report – J-STD-004 

(per IPC-TM-650 Issue method 2.6.3.3) 

Test: 0244-5i 

Date: 7/26/02 

T/H/B: 85/85/-48 

Material Tested/ SIR SIR SIR 

Condition (1 day) (4 days) (7 days) 

EM – Bellcore 

(per GR-78-CORE Issue 1, September 1997) 

Test: 0244-5ep 

Date: 7/22/02 

T/H/B: 65/85/10V 

Material Tested/ SIR SIR 

Condition (96 hr) (500 hr bias) 






Comb Down 

Geometric Mean: 1.30E+11 3.00E+11 

Comb Up 


Control Boards 


Comb Down 

Arithmetic Mean: 8.90E+09 7.40E+09 6.80E+09 

Comb Up 


Control Boards 


With Pallets 


Without Pallets 

Geometric Mean: 3.20E+10 1.10E+11 Comb Up 

1.20E+11 1.40E+11 Comb Down 

Passed electrical and visual requirements 







Pass/Fail Limit: 1E+11 Ohms 

EF-2202 is Bellcore Compliant 

per GR-78-CORE. 

Pass/Fail Limit: 1E+08 Ohms 

EF-2202 meets the SIR 

requirement for J-STD-004. 

J-STD classification: 

ORL0 

Pass/Fail Limit: ≥0.1 Geometric Mean SIR Initial 

EF-2202 meets the 

GR-78-CORE and pending 

IPC J-STD-004 requirement 

for electromigration with and 

without pallets. 

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ALPHA 



Fluxes 

7.1 7.2 7.3 

EF-2202 In-Circuit Test Data 

A L P H A 

EF-2202 ICT DATA 






4. MSDS 










Material: EF-2202 wave flux 

Alloy: 

63/37 solder pot 

Process conditions: Wave soldered 105°C 

preheat, 1.1 m/min 

conveyor speed, 

250°C solder pot 

Process Date: 6/3/2002 

Pin Tip: 

Chisel 

Pin Force (oz.) = 3.5 


Resistance (ohms) Board A Board B Board C Board D 

< 5 1000 999 1000 998 

5 - 10 0 0 0 0 

10 - 20 0 0 0 0 

20 - 50 0 0 0 0 

50 - 100 0 0 0 0 

100 - 200 0 0 0 0 

200 - 500 0 0 0 0 

500 - 1000 0 0 0 0 

1000 - 2000 0 0 0 0 

> 2000 (miss) 0 1* 0 2* 

Average 0.46 0.36 0.43 0.65 

Standard deviation 0.17 0.18 0.15 0.46 

Maximum 0.96 1.55 1.54 2.83 




* Probe missed pad, producing no contact. Miss not related to flux. 

• Excellent pin testability 

• No significant residue build-up on probe 

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ALPHA 



Fluxes 

8.1 8.2 8.3 

EF-2202 Product Demonstration 

A L P H A 

EF-2202 QUALIFICATION TOOLS 






4. MSDS 













Check List 

The intention of this 

check list is to act as a 

guide for setting up the 

equipment for running 

EF-2202 in a typical 

wave soldering 

process. 

1 Flush flux tank, hoses, and spray nozzles prior to any trial with appropriate solvent 

(DI water, ALPHA flux thinner or IPA). Perform final rinse with DI water. This is to 

avoid cross contamination from the prior flux. 

2 Check for uniform spray on the board and measure flux loading. Compare with 

recommended levels. 

3 Check fingers and pallets for cleanliness. 

4 Assure that the solder wave is free from dross. Remove dross if necessary. 

5 Check solder level in the pot. Make sure solder level is appropriate for the machine. 

6 Assure that the solder wave is level to the board. Use ALPHA Levchek, if necessary. 

7 Check the wave height to make sure it is set to 1/2 to 2/3 of the board thickness, 

including chip wave, if used. 

8 Set conveyor speed to the recommended level. 

9 Measure top side preheat with flux applied on the bottom side of the board. Adjust 

temperature settings on the machine to achieve the recommended temperature. 

Notes: 

1. Temperature tabs can be placed at multiple locations on the board (pick high density and 

low density areas to determine overall range of temperature). 

2. Thermocouple probes or moles can be used as well (choose high density and low density 

board areas to determine overall range of temperature). 

3. The highest and lowest measured top-side preheat temperatures should be within the 

recommended guidelines for EF-2202. 

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ALPHA 



Fluxes 

8.1 8.2 8.3 

EF-2202 Product Evaluation Guide 

A L P H A 







4. MSDS 











Product Focus and Key Features 

I. Exhibits minimum micro solderballs 

II. 

III. 

IV. 

Provides excellent board and solder-joint cosmetics 

Compatible with selective soldering pallets 

Provides for high yield production, minimum first pass defects 

V. Provides both single wave and dual wave capabilities 

Demonstration Procedure 

Run 5 boards with EF-2202 at suggested process parameters for either 

single wave or dual wave: 

I. Count micro solderballs on selected connectors 

• compare to current flux 

II. 

III. 

Evaluate residue 

• on board surface 

• at the edges where conveyor fingers or pallets were used 

• in areas where pallets were used for selective soldering 

- compare to current flux 

Count the number of bridges and icicles 

• compare to current flux 

m/min. 

1.75 

1.25 

0.75 

120 

°C 110 

100 

90 

micrograms/cm 2* 

240 

200 

160 

120 

80 

40 

280 

Conveyor Speed 

SnPb System Pb-Free System 

Single 

Single 

Dual 

Dual 

Single 

Single 

Dual 

Topside Preheat 


SnPb System 

Single 

Flux Loading 

Dual 

Single 

Dual 

Pb-Free System 

Dual 

Pot Temperature 



°C 

270 

260 


250 

240 

230 

Single 

Dual 

Single 

Dual 

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ALPHA 



Fluxes 

8.1 8.2 8.3 

EF-2202 Flux Loading Chart 

A L P H A 







4. MSDS 













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Single Wave 

Dual Wave 

Coverage Suggested Suggested Suggested Suggested 

Area* Lower Limit Upper Limit Lower Limit Upper Limit 

(70 µg/cm 2) (120 µg/cm 2) (140 µg/cm 2) (200µg/cm 2) 

cm2 grams grams grams grams 

100 0.175 0.300 0.350 0.500 

150 0.263 0.450 0.525 0.750 

200 0.350 0.600 0.700 1.000 

250 0.438 0.750 0.875 1.250 

300 0.525 0.900 1.050 1.500 

350 0.613 1.050 1.225 1.750 

400 0.700 1.200 1.400 2.000 

450 0.788 1.350 1.575 2.250 

500 0.875 1.500 1.750 2.500 

550 0.963 1.650 1.925 2.750 

600 1.050 1.800 2.100 3.000 

650 1.138 1.950 2.275 3.250 

700 1.225 2.100 2.450 3.500 

750 1.313 2.250 2.625 3.750 

800 1.400 2.400 2.800 4.000 

850 1.488 2.550 2.975 4.250 

900 1.575 2.700 3.150 4.500 

950 1.663 2.850 3.325 4.750 

1000 1.750 3.000 3.500 5.000 

1050 1.838 3.150 3.675 5.250 

1100 1.925 3.300 3.850 5.500 

1150 2.013 3.450 4.025 5.750 

1200 2.100 3.600 4.200 6.000 

1250 2.188 3.750 4.375 6.250 

1300 2.275 3.900 4.550 6.500 

1350 2.363 4.050 4.725 6.750 

1400 2.450 4.200 4.900 7.000 

Suggested Wet Flux Weight (micrograms/cm2) 

Single Wave 

Dual Wave 

Coverage Suggested Suggested Suggested Suggested 

Area* Lower Limit Upper Limit Lower Limit Upper Limit 

(70 µg/cm 2) (120 µg/cm 2) (140 µg/cm 2) (200µg/cm 2) 

cm2 grams grams grams grams 

1450 2.538 4.350 5.075 7.250 

1500 2.625 4.500 5.250 7.500 

1550 2.713 4.650 5.425 7.750 

1600 2.800 4.800 5.600 8.000 

1650 2.888 4.950 5.775 8.250 

1700 2.975 5.100 5.950 8.500 

1750 3.063 5.250 6.125 8.750 

1800 3.150 5.400 6.300 9.000 

1850 3.238 5.550 6.475 9.250 

1900 3.325 5.700 6.650 9.500 

1950 3.413 5.850 6.825 9.750 

2000 3.500 6.000 7.000 10.000 

2050 3.588 6.150 7.175 10.250 

2100 3.675 6.300 7.350 10.500 

2150 3.763 6.450 7.525 10.750 

2200 3.850 6.600 7.700 11.000 

* Surface area of board and any pallet used that has flux applied to it. 

Note: If the process uses multiple 

boards with open areas on a single 

pallet, the open areas must be deducted 

from the total coverage area. 


the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated. 

Pallet 

Board 

Flux coverage area 

(diagonal hatching)

A L P H A 

T E C H N I C A L B U L L E T I N 

ALPHA EF-2202 Low-VOC,No-Clean Flux 

GENERAL DESCRIPTION 

ALPHA EF-2202 is a low-VOC halide-free, rosin/resin-free, low 

solids no-clean flux which provides the highest activity of any 

low-VOC Bellcore compliant flux for defect-free soldering. It is 

formulated with a proprietary mixture of organic activators 

which deliver excellent wetting and top-side hole fill, even with 

OSP coated bare copper boards which have undergone prior 

thermal excursions. Several proprietary additives are also 

formulated into EF-2202 which act to reduce the surface 

tension between the solder mask and the solder; thereby, 

dramatically reducing the tendency of solderball generation. 

The formulation of EF-2202 is also designed to be more 

thermally stable; thereby, reducing the occurrence of solder 

bridging. 

FEATURES & BENEFITS 

• Bellcore compliant for assemblies requiring this standard. 

• Low-VOC to help meet air quality regulations. 

• Exceptional wetting for excellent hole-fill even with OSP 

coated bare copper boards, with prior reflows. 

• Thermally stable activators provide low solder bridging. 

• Reduces the surface tension between solder mask and solder 

to provide low solderball frequency. 

• Suitable for selective soldering process. 

• Very low level non-tacky residue to reduce interference with 

pin testing and good board cosmetics. 

APPLICATION GUIDELINES 

PREPARATION – In order to maintain consistent soldering 

performance and electrical reliability, it is important to begin 

the process with circuit boards and components that meet 

established requirements for solderability and ionic cleanliness. 

It is suggested that assemblers establish specifications on 

these items with their suppliers and that suppliers provide 

Certificates of Analysis with shipments and/or assemblers 

perform incoming inspection. A common specification for the 

ionic cleanliness of incoming boards and components is 

5mg/in 2 maximum, as measured by an Omegameter with 

heated solution. 

Care should be taken in handling the circuit boards throughout 

the process. Boards should always be held at the edges. The 

use of clean, lint-free gloves is also recommended. 

Conveyors, fingers and pallets should be cleaned. Bioact SC-10 

Solvent Cleaner has been found to be very useful for these 

cleaning applications. 

FLUX APPLICATION – EF-2202 is formulated to be applied by 

spray method. When spray fluxing, the uniformity of the 

coating can be visually checked by running a piece of 

cardboard over the spray fluxer or by processing a board-sized 

piece of tempered glass through the spray and then through 

the preheat section. 

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this 

data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. 

600 Route 440, Jersey City, New Jersey 07304, 800-638-7942, www.alphametals.com 

➜ 

RETURN TO PRODUCT MANUAL

ALPHA EF-2202 Low-VOC, No-Clean Flux 

OPERATING PARAMETER 

Amount of Flux Applied 

Top-Side Preheat Temperature 

Bottomside Preheat Temperature 

Recommended Preheat Profile 

Maximum Ramp Rate of Topside Temperature 

(to avoid component damage) 

Conveyor Angle 

Conveyor Speed 

GENERAL GUIDELINES FOR MACHINE SETTINGS 

TYPICAL LEVEL 

Contact Time in the Solder (includes Chip Wave and Primary Wave) 

Solder Pot Temperature: 

Sn63/Pb37 Alloy 

Lead-Free Alloys (99.3Sn/0.7Cu, 96.5/3.5Ag, 95.5Sn/4.0Ag/0.5Cu) 

Spray:

➜ 

ALPHA EF-2202 Low-VOC, No-Clean Flux 

TECHNICAL SPECIFICATIONS 

PHYSICAL PROPERTIES TYPICAL VALUES PARAMETERS/TEST METHOD TYPICAL VALUES 

Appearance Clear, Colorless Liquid pH, as is 2.4 

Solids Content, wt/wt 3.5 Recommended Thinner DI Water 

Specific Gravity @ 25°C (77°C) 1.012±0.003 Shelf Life 18 months 

Acid Number (mg KOH/g) 30.0 ± 2.0 VOC Content (ASTM D2369) 1.5% 

Flash Point (T.C.C.) NONE IPC J-STD-004 Designation ORL0 

CORROSION AND ELECTRICAL TESTING 

CORROSION TESTING 

TEST REQUIREMENT FOR ORL0 RESULTS 

Silver Chromate Paper 1 IPC-TM 650 Test Method 2.3.33 No detection of halide Pass 

Copper Mirror Tests 1 (Modified IPC/Bellcore Method) No complete removal of copper Pass 

Copper Corrosion Test IPC-TM 650 Test Method 2.6.15 No evidence of corrosion Pass 

J-STD-004 SURFACE INSULATION RESISTANCE 

TEST CONDITION REQUIREMENTS 3 RESULTS 3 

“Comb-Down” Uncleaned 85°C/85% RH, 7 days 1.0 x 10 8 minimum 6.8 x 10 9 

“Comb-Up” Uncleaned 85°C/85% RH, 7 days 1.0 x 10 8 minimum 6.2 x 10 9 

Control Boards 85°C/85% RH, 7 days 2.0 x 10 8 minimum 1.3 x 10 10 

IPC Test Condition (per J-STD-004): -50V, measurement @ 100V/IPC B-24 board (0.4mm lines, 0.5mm spacing). 

BELLCORE SURFACE INSULATION RESISTANCE 

TEST CONDITION REQUIREMENTS 2 RESULTS 2 

“Comb-Down” Uncleaned 35°C/85% RH, 5 days 1.0 x 10 11 minimum 3.0 x 10 11 

“Comb-Up” Uncleaned 35°C/85% RH, 5 days 1.0 x 10 11 minimum 2.2 x 10 12 

Control Boards 35°C/85% RH, 5 days 2.0 x 10 11 minimum 1.1 x 10 12 

Bellcore Test Condition (per GR 78-CORE, Issue 1): 48 Volts, measurement @ 100V/25 mil lines/50 mil spacing. 

BELLCORE ELECTROMIGRATION 

TEST CONDITION SIR (INITIAL) 2 SIR (FINAL) 2 REQUIREMENT RESULT VISUAL RESULT 

“Comb-Up” Uncleaned 3.2 x 10 10 1.1 x 10 11 SIR (Initial)/SIR (Final)

A L P H A 

M A T E R I A L S A F E T Y D A T A S H E E T 

ALPHA EF-2202 FLUX 



600 Route 440, Jersey City, New Jersey 07304, 800-638-7942, www.alphametals.com 

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EF-Series - The Solder Connection

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