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EF-Series - The Solder Connection

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➜<br />

A L P H A<br />

ALPHA<br />

<strong>EF</strong>-<strong>Series</strong><br />

Environmentally Friendly<br />

Fluxes<br />

<strong>EF</strong>-<strong>Series</strong> Introduction<br />

<strong>EF</strong>-2202 Product Manual<br />

1. Performance Summary<br />

2. Wide Process Window<br />

3. Technical Bulletin<br />

4. MSDS<br />

5. Process Guidelines<br />

6. Performance vs Competition<br />

7. Electrical Reliability Data<br />

8. Qualification Tools<br />

<strong>EF</strong>-3001 Product Manual<br />

<strong>EF</strong>-3215 Product Manual<br />

6.1 6.2 6.3<br />

<strong>EF</strong>-2202 PERFORMANCE VERSUS COMPETITION<br />

<strong>EF</strong>-2202 Flux Performance vs Competition<br />

Hole Fill<br />

Percentage Hole Fill<br />

60<br />

50<br />

40<br />

30<br />

20<br />

Hole Fill Comparison – SAC 305<br />

Single Wave<br />

<strong>EF</strong>-2202<br />

Leading<br />

Competitor<br />

<strong>EF</strong>-2202<br />

Dual Wave<br />

Leading<br />

Competitor<br />

<strong>EF</strong>-2202<br />

<strong>EF</strong>-4102 Product Manual<br />

Troubleshooting Guide<br />

VOC Leadership<br />

Lead-Free Leadership<br />

ALPHA FLUX Product Line<br />

Global Availability<br />

<strong>EF</strong>-2202 Enhanced Performance Attributes<br />

Wetting/Hole Fill (OSP on Cu finish) <strong>EF</strong>-2202 is clearly a significant<br />

improvement over the leading competitor.<br />

<strong>EF</strong>-2202 yields >12% more solderability for Sn/Pb versus the<br />

leading competitor.<br />

Conditions: Tested after single reflow with 160°C soak, 220°C peak, 55 sec TAL in air<br />

Leading Competitor<br />

➜<br />

<strong>The</strong> information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding<br />

the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.

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