EF-Series - The Solder Connection
EF-Series - The Solder Connection
EF-Series - The Solder Connection
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➜<br />
A L P H A<br />
ALPHA<br />
<strong>EF</strong>-<strong>Series</strong><br />
Environmentally Friendly<br />
Fluxes<br />
<strong>EF</strong>-<strong>Series</strong> Introduction<br />
<strong>EF</strong>-2202 Product Manual<br />
1. Performance Summary<br />
2. Wide Process Window<br />
3. Technical Bulletin<br />
4. MSDS<br />
5. Process Guidelines<br />
6. Performance vs Competition<br />
7. Electrical Reliability Data<br />
8. Qualification Tools<br />
<strong>EF</strong>-3001 Product Manual<br />
<strong>EF</strong>-3215 Product Manual<br />
6.1 6.2 6.3<br />
<strong>EF</strong>-2202 PERFORMANCE VERSUS COMPETITION<br />
<strong>EF</strong>-2202 Flux Performance vs Competition<br />
Hole Fill<br />
Percentage Hole Fill<br />
60<br />
50<br />
40<br />
30<br />
20<br />
Hole Fill Comparison – SAC 305<br />
Single Wave<br />
<strong>EF</strong>-2202<br />
Leading<br />
Competitor<br />
<strong>EF</strong>-2202<br />
Dual Wave<br />
Leading<br />
Competitor<br />
<strong>EF</strong>-2202<br />
<strong>EF</strong>-4102 Product Manual<br />
Troubleshooting Guide<br />
VOC Leadership<br />
Lead-Free Leadership<br />
ALPHA FLUX Product Line<br />
Global Availability<br />
<strong>EF</strong>-2202 Enhanced Performance Attributes<br />
Wetting/Hole Fill (OSP on Cu finish) <strong>EF</strong>-2202 is clearly a significant<br />
improvement over the leading competitor.<br />
<strong>EF</strong>-2202 yields >12% more solderability for Sn/Pb versus the<br />
leading competitor.<br />
Conditions: Tested after single reflow with 160°C soak, 220°C peak, 55 sec TAL in air<br />
Leading Competitor<br />
➜<br />
<strong>The</strong> information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding<br />
the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.