o_19ggucgvpdedg0015j01sso1pf5a.pdf
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
Global and China IC Substrate Industry Report, 2015<br />
Global and China IC Substrate Industry Report, 2015 highlights the followings:<br />
Status quo of semiconductor and IC packaging industry Analysis on downstream market of IC substrate Development trend of IC substrate Analysis on IC<br />
substrate industry Research on 12 IC substrate vendors Research on 6 IC substrate peripheral companies IC substrate industry may be in a predicament in 2015,<br />
rooted in two aspects: first, the maturing of FOWLP; second, the tablet sales decline and sluggish smartphone growth. In addition, the prosperity of IC substrate<br />
industry in 2013 stimulated large-scale expansion of enterprises in 2014, thus leading to an insufficient rate of capacity utilization.<br />
For FC-CSP substrate with mobile phone and tablet PC as the core market facing strong competition from FOWLP that has overwhelming superiorities including<br />
low profile, higher speed, more I/O, higher integration, less processing step, especially needing no substrate which slashes cost as IC substrate accounts for more<br />
than half of the total cost of IC.<br />
Although it is in its infancy without obvious cost advantage, FOWLP has been an irresistible trend, the traditional FC-CSP substrate will have to reduce the price<br />
to enter a competition, and the demand for the latter will be sharply reduced by more than 60% once FOWLP matures. So in 2015, FC-CSP substrate vendors<br />
have to substantially reduce the price to gain market advantage in advance. It is expected that in 2015 the IC substrate market will encounter a 7% scale-down to<br />
USD7.12 billion.<br />
In the downstream market, large screen mobile phone squeezed the living space of tablet PC which declined significantly. And the single-functional tablet PC is<br />
mostly used as a toy for children with less demand for replacement. In the field of smartphone, China as the world’s largest smartphone market declined in<br />
2014.<br />
SiP packaging substrate will be the highlight for IC substrate market in 2015 as core components of high-end smart watches must adopt SiP packaging. Both the<br />
two core processors built in Apple Watch use SiP packaging technology. The most important SiP substrate of Apple Watch calls for the most difficult production,<br />
priced 4-5 times higher than FCCSP applied to general ARM processor. The orders are shared by Nanya, Kinsus and other Taiwanese vendors. ASE undertakes<br />
Apple Watch’s SI chip SiP packaging business.<br />
The PC market is also likely to recover in 2015 for tablet PC slump means the recovery of laptop computer market. Laptop computer market saw the first growth<br />
in 2014 after three consecutive years of decline and is expected to continue the trend in 2015. And laptop discrete graphics card accounts for a zooming<br />
proportion, signifying GPU shipments boost.<br />
table Of Content<br />
1. Global Semiconductor Industry<br />
1.1 Overview<br />
1.2 Ic Packaging<br />
1.3 Ic Packaging And Testing<br />
2. Downstream Market Of Ic Substrate<br />
2.1 Introduction To Ic Substrate<br />
2.2 Flip Chip Ic Substrate<br />
2.3 Global Mobile Phone Market<br />
2.4 Global Smartphone Market<br />
2.5 Chinese Mobile Phone Market<br />
2.6 Laptop Computer Market<br />
2.7 Cpu And Gpu Market<br />
2.8 Memory Market<br />
3. Ic Substrate Market And Industry<br />
3.1 Ic Substrate Market<br />
3.2 Wide Io/hmc Memory<br />
3.3 Embedded Component Substrate<br />
3.4 Embedded Trace Substrate<br />
3.5 Ic Packaging For Portable Devices<br />
3.5.1 Status Quo<br />
3.5.2 Pop Packaging<br />
3.5.3 Fowlp<br />
3.6 Sip Packaging<br />
3.7 2.5d Packaging (si/glass/organic Interposer)<br />
3.7.1 Introduction To 2.5d Packaging<br />
3.7.2 Application Of 2.5d Packaging<br />
3.7.3 Market Size Of 2.5d Interposer<br />
3.7.4 Suppliers Of 2.5d Packaging<br />
3.8 Tsv (3d) Packaging<br />
3.8.1 Tsv Packaging Equipment<br />
3.9 Fc-pop Packaging<br />
3.10 Ic Substrate Industry<br />
Global and China IC Substrate Industry Report, 2015
4. Ic Substrate Vendors<br />
4.1 Unimicron<br />
4.2 Ibiden<br />
4.3 Daeduck Electronics<br />
4.4 Simmtech<br />
4.5 Lg Innotek<br />
4.6 Semco<br />
4.7 Nan Ya Pcb<br />
4.8 Kinsus<br />
4.9 Shinko<br />
4.10 Kyocera Slc<br />
4.11 At&s<br />
4.12 Access<br />
4.13 Eastern<br />
5. Ic Substrate Packaging Companies<br />
5.1 Ase<br />
5.2 Amkor<br />
5.3 Spil<br />
5.4 Stats Chippac<br />
5.5 Mitsubishi Gas Chemical Company<br />
5.6 Ajinomoto<br />
ResearchMoz(http://www.researchmoz.us/) is the one stop online destination to find and buy market research reports & Industry Analysis. We fulfill all your<br />
research needs spanning across industry verticals with our huge collection of market research reports. We provide our services to all sizes of organizations and<br />
across all industry verticals and markets. Our Research Coordinators have in-depth knowledge of reports as well as publishers and will assist you in making an<br />
informed decision by giving you unbiased and deep insights on which reports will satisfy your needs at the best price.<br />
Contact:<br />
Sales Team,<br />
90 State Street,<br />
Suite 700,<br />
Albany NY - 12207<br />
United States<br />
Tel: +1-518-618-1030<br />
USA - Canada Toll Free 866-997-4948<br />
Email: sales@researchmoz.us<br />
Website: http://www.researchmoz.us/<br />
Global and China IC Substrate Industry Report, 2015
Change language