ANNEXURE TO TENDER NO.DPS/MRPU/IGCAR/COMP/5235/TPT ...

ANNEXURE TO TENDER NO.DPS/MRPU/IGCAR/COMP/5235/TPT-1178
1. Description of the ITEM :
i) HyperLynx Signal Integrity, Power Integrity,
Thermal Analysis and DRC for EMI/EMC Tool
with workstation for running EDA Tools - 1 Set.
2. Detailed SPECIFICATIONS and Quantity :
Specification for HyperLynx SI, PI, Thermal Analysis & DRC
for EMI/EMC Tool - 1 No.
Hyperlynx Signal Integrity (SI)
HyperLynx SI tool should address high-speed PCB problems through-out the design cycle, beginning
at the earliest architectural stages and moving through post-layout verification. This tool should support
the following features:-
Pre-Layout Analysis
• To predict and eliminate signal integrity problems early by allowing proactive constrain routing,
plan stackups and optimize clock, critical signal topologies and terminations prior to layout.
• To facilitate intuitive drag-and-drop transmission-line modeling, complex interconnects, including
ICs, traces, vias, cables, connectors and passive components of design layout.
• Integrated 2D and 3D field solvers for accurate modeling and solution space exploration.
• To facilitate simulation using industry-standard IBIS Models, generic models and models from
databook information.
• To allow editing IBIS models including a heirarchical, automated syntax.
• To instantiate HSPICE, ELDO, IBIS-AMI, AMS, S-parameter and IBIS models.
• Design kits for PCI Express, DDR2, and PCI-X with timing analysis.
• To predict serial interface bit error rates (BER), worst-case bit sequences and eye diagrams using
HyperLynx FastEye.
Post-Layout Verification
• To allow signal integrity and timing analysis at three important stages: following part placement in
PCB layout system, after critical net routing and after detailed routing of an entire board.
• To facilitate interactive analysis that takes next level batch simulation to automatically scan large
number of nets on an entire PCB, flagging SI and EMC hot spots.
• To allow inserting new termination components on-the-fly, enabling real-time analysis.
• To predict crosstalk waveforms for any trace topology and IC placement, showing specific crosssections
violating crosstalk thresholds.
• To support multi-board analysis, including support for EBD models and connector models.
• To do verification of DDR, DDR2, and DDR3 memory systems, including timing analysis.
• To support sweeping parameters, loss modeling, enhanced via modeling, eye diagram, multiboard
analysis, waveform analyzer, SPICE/S-parameter simulation/HL SI SPICE/ADMS, s-
parameter generation, SPICE writer, surface roughness, fast eye & statistical curves, integrated
3D via modeling, models for Eldo & VHDL-AMS, IBIS-AMI simulation/sweeps, 3D geometry
extraction to HL 3DEM and SI & plane co-simulation.
HyperLynx Power Integrity (PI)
HyperLynx PI tool should address power distribution problems early in the board design & layout
stage. This tool should support the following features:-
IR Drop Analysis
• To identify issues such as excessive voltage drop, high current densities, excessive via currents
and disconnected power.

• To facilitate simulation results to be viewed in graphical and report format.
• To support 3D power viewer, stackup editor/field solver, dc drop analysis, thermal/dc drop cosimulation,
decoupling analysis, decoupling acceleration, plane noise analysis.
• To enable to read board data into HyperLynx layout analysis environment.
• To support to analyze DC behavior per net or across the whole board.
• To support to export to pre-layout environment to do what-if analysis on changing copper islands
and adding vias.
Power Distribution Network (PDN) Analysis
• To support to optimize impedance of power distribution network (PDN) in pre- or post-layout
modes.
• To support to analyze propagation of noise on the planes
• To allow what-if analysis for board outlines, plane voids and adding copper on plane.
• To perform noise analysis to visualize the decoupling strategy
• To allow placement & mounting of capacitors on planes.
Model Extraction
• To support to model vias in the multigigabit domain including entire bypassing network of the
board.
• To support to extract portable PDN models as S-parameters, Z-parameters or Y-parameters
HyperLynx Thermal
HyperLynx Thermal tool should support to simulate board temperatures, component and junction
temperatures as well as component temperature constraint violations. This tool should support the
following features:-
• To support 3D modeling of complex flow and thermal fields based on heat conduction, convection
and radiation effect.
• To find temperature profile & gradient of PCB.
• To support enclosure modeling, board/layer copper modeling, heat sink, heat pipe, screw.
• To facilitate to import and analyze single-sided, double-sided, and multilayer boards with irregular
shapes, and reference-plane discontinuities.
• To support to model effects of gravity, air pressure, flow directions and PCBs in a sealed
compartment—with or without a heat exchanger—or in an open system with forced convection.
• To support solution oriented analysis for industries like avionics & space, computer &
instrumentation, telecom & industrial controls, automotive and power supplies.
• Provision to create component models from component datasheet.
HyperLynx DRC
HyperLynx DRC tool should address design rule checking for issues with EMI/EMC, signal integrity
and power integrity. This tool should support the following features:-
• To check 19 standard design rules (DRCs) for items such as traces crossing splits, reference
plane changes, shielding and via checks on PCB board that can cause issues with EMI/EMC,
signal integrity (SI), and power integrity (PI).
• To support custom rule creation including a script debugger with geometry visualization.
• To support script writing and debugging environment built into the GUI that should allow to set
break points, walk through the script step by step and add variables to a watch list.
• To support results viewing, parameterized rule control, custom rule analysis & authoring and rule
debugging
Training : Technical training on Signal Integrity, Power Integrity, Thermal Analysis & DRC
Tool shall be provided to IGCAR engineers. Specialized training on any of the above
modules shall be quoted separately.
Acceptance Criteria : The above tool specifications shall be tested & demonstrated against
IGCAR designed PCB layout files.
License : Single user node lock perpetual to run on Windows 7 or XP.

Specification of Workstation for running EDA Tools - 4 Nos.
i) Processor : Intel Quad Core i7 3820QM or better
ii)
iii)
iv)
Clock Speed : 2.7 GHz or better
Cache Memory : 8 MB L3 or higher
Memory : 16 GB DDR3 upgradable up to 32 GB
v) Hard Disk : Two 1TB 7200 RPM SATA2 (3Gbps)
vi)
vii)
Graphics card with 1 GB dedicated on-board graphics memory (Nvidia or equivalent)
Key Board : USB Keyboard
viii) Mouse : Optical Mouse
ix)
Display : 22” HDMi widescreen LED monitor (Samsung/LG/DELL or equivalent)
x) Optical Drive : DVD +/-R/W
xi)
xii)
Network Interface : 10/100/1000M bit Ethernet LAN
I/O Ports : 1xParallel/1xSerial/6xUSB Ports
xiii) Audio : Audio In, Out and MIC with multimedia kit
xiv) Casing : Good housing for PC with provision for heat removal
xv)
OS : Genuine Windows 7 professional, Media Kit, genuine licenses & manuals (firewall
enabled and all security updates and patches and fixes up-to-date)
xvi) Other S/W : Latest version of Microsoft Office Professional edition
xvii) Anti Virus : Anti Virus software should be installed with licenses
xviii) Warranty : 1 years comprehensive on-site manufacturer authorized warranty
NOTE:
- After publishing the tender, if there is any change in specification, it will be published as
corrigendum in the MRPU portal.
- Remarks column shall be utilized only for filing up non financial aspects such as make, packing
etc…,
- Aspects having an implication on the price shall be given in the column provided for the same
and not in the remarks column.
- Scanned copy of the quotation should not be uploaded separately.
- Technical details/ catalogues/drawings etc, if any, shall be uploaded separately.
- Breakup Cost of the Tool & Workstation should be quoted separately in the online ‘Price Bid
Alternate Offer’ form
- Accessories, Spares, Breakup costs etc. if any, shall be quoted online in the ‘Price Bid Alternate
Offer’ form only.