High site count complex mixed-signal device parallel testing soultion

High site count complex mixed-signal device parallel testing soultion
Joon Hong(Teradyne Korea)

Agenda
• Mixed-Signal SOC Multisite Test Roadmap
• Device Overview
• System configuration
• DIB Design
• AC Expansion Board Application
• Test Result
• Q&A
June 29, 2010
The 11th Korea Test Conference

Multi-site Test Roadmap
2 or 4-site 8-site
16-site 32-site 64-site
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011
Catalyst/Tiger
FLEX
UltraFLEX
UltraFLEX-HC
UltraFLEX with new High density Options
4-site Optical Disk
Drive SOC test
solution
World’s first 8-site
CD, DVD Player Processor
SOC test solution
World’s first 16-site
Mobile A/V Processor
SOC test solution
World’s first 32-site
Mobile A/V Processor
SOC test solution
64-site SOC device test solution
Using new high density (x2 ~ x4)
UltraFLEX future option
Multi-site capability is the key strategy to achieve low cost of test in SoC business
4-site codec in 2001
8-site CDP/DVDP in 2004
16-site Mobile A/V processor in 2007
32-site Mobile A/V processor in 2009
June 29, 2010
The 11th Korea Test Conference

Target Device Overview
Feature - Mobile Audio/Video Application processor
ARM Core (90MHz)
Media Core(AMCv2)
Memory controller
- 128K SRAM (Shared)
- 256K System Memory in AMC
- 128K System SRAM
- 50KB Embedded Rom
Class D AMP
DMA (4ch 10 DMA)
10 Bit ADC
Package - Discrete 148-ULGA, POP 232-ULGA
Tests - Total ~1000 test items
- Test group
ADC_DM_TEST
PMU_CURRENT_TEST
BAT_OVPTHM_TEST
BIRA_TEST
D-CLASS Amplifier DAC_TEST
USB_FS_TX_TEST, FS_Level_Test, HS_Level_Test
IDS_AF_TEST
ChipID, DieID
June 29, 2010
The 11th Korea Test Conference

System Configuration
UltraFLEX-HC system configuration
- 70 HSD, 11 DC, 4 AC channels for testing single site
- Total option channels for testing 32 sites
HSD
2240 Channels
DC
382 Channels
AC
128 Channels
36 slot UFLEX configuration
18 HSD 2304 Digital I/O channels
6 HDVS 288 Channels
4 DC30 80 Channels
2 DCIO 384 Channels
2 ACEX 128 Source Fan-outs
128 Capture Muxing
2 BBAC 4 Source & 4 Capture
2 VHFAC 4 Source & 4 Capture
*Optional 2 VHFAC for test time reduction
June 29, 2010
The 11th Korea Test Conference

DIB Design - Overview
• DIB (Mother) board
- High speed Digital and precision AC
connections
- Remove most of AC applications using
ACEX options on the test head
ACEX
• Daughter board
- DC test application circuit and relays
- 1 DC Block supports 4 sites testing
- 8 copies of the DC Block for 32 sites
• AC Expansion board
- Provide Common AC applications on
test head for the multi-site AC testing
Independent 16
site design
North
Independent 16
site design
South
• Option assignment
- North16 & South16 sites identical
DIB design for testing independently
• Symmetrical site to site circuit design
- Improve the site to site correlation
• 4.8mm DIB thickness
Daughter Board
(8 DC Blocks)
DIB Board
(AC and Digital)
ACEX
June 29, 2010
The 11th Korea Test Conference

DIB Design – Expand Application
Space
Interface design for mother and daughter boards
• Doubled application space using a daughter board under the DIB
• 10 of 200 pins high performance and high speed connectors for mating the daughter board
• All relays on the DIB and Daughter boards are mating through receptacles and can be replaceable
• Design 4.8mm thickness DIB for the handler interface standard
• The 10 connectors, screws and daughter board will sustain the main DIB more flat and stable for
the high forces applied by the 32 pick-ups on the multi-site handler
DIB
Device Socket
7-16 mm
4.8mm
3.6mm
Daughter Board
DIB and Daughter board Interface
connector
June 29, 2010
The 11th Korea Test Conference

DIB Design – Signal Delivery
Simulation
• Design the parts and transmission line models
• Simulate - pulse and sine wave response
June 29, 2010
The 11th Korea Test Conference

DIB Design – Relay Power Budget
•Relay assignment
• Assign a NEC 2 form C relays for testing low speed AC and DC test items on daughter board .
•Select Panasonic AGN20012 relays for low speed digital and AC applications on DIB
•Use small size Sanyu MFS-E1T12G relays for USB2.0 application on DIB
•Power budget study
• Count the total relay turn on currents on a group
• Check the max relay turn on number
• Assign right relay power source for the group
8442 DIB Relay power budget
No. of
DUT
NO/DUT
(EA)
Part Number
Voltage
(V)
Power(W)/
Relay
Total
Power
(W)
Current
(A)
Max
Relay
Turn-on
(EA)
Actual
Max
Current
(A)
Utility
Max
Current
(A)
Current
Mmargin
(A)
Daughter Bd 32 17.5 NEC UA2-5NU 5 0.14 78.4 15.68 9 8.064 8 -0.064 5V-1,2 2 Form C
DIB 32 5 PANASONIC AGN20012 12 0.1404 22.464 1.872 3 1.1232 2 0.8768 12V 2 Form C
DIB 32 3 SANYU MFS-E1T12G 12 0.2616 25.1136 2.0928 1 0.6976 2 1.3024 12V 1 Form C
Assign
-ment
Relay
Type
Power budget study for the total 816 relays
June 29, 2010
The 11th Korea Test Conference

DIB Design- Relay Control
•Relay control channel expansion
• Total number of UDB channels on UFLEX system is 128
• Total number of relays on the daughter board is 560
• Need to expand the relay control channel by using fan-out buffers
• One fan-out buffer control s 4 of 2 form C relays for testing 8 sites parallel
June 29, 2010
The 11th Korea Test Conference

DIB Design - Data Bit Grounding
• Separate the Data Bit Control GND - Low noise data bit grounding
June 29, 2010
The 11th Korea Test Conference

ACEX - User Interface and Signal
1Mhz
ACEX to DIB
Loopback

Test Result
• 32 sites Test time
10.9 sec
• Parallel Test Efficiency 98.8%
• Throughout improvement 184% (Compare with the16 sites testing )
Site Count 1 4 8 16 22 32
Test Time 8.040 8.446 8.939 9.610 10.361 10.875
Parallelism 100.00% 98.32% 98.40% 98.70% 98.63% 98.86%
10.870
10.370
9.870
9.370
Test Time
8.870
8.370
7.870
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
99.00%
98.90%
98.80%
98.70%
Parallelism
98.60%
98.50%
98.40%
98.30%
98.20%
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
June 29, 2010
(TT_x16 * Site count_x32 ) (15.5 * 32 )
= = 2.84
(TT_x32 * Site count_x16 ) (10.9 * 16 )
The 11th Korea Test Conference

Q&A
June 29, 2010
The 11th Korea Test Conference