Socket FS1 Design Specification - AMD Support & Drivers

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Socket FS1 Design Specification 44455 Rev. 3.00 August 2011 Figure 8. Illustration of Best Fit Plane and Outer Support Region Flatness 3.2.2.4 Inner Support Region Measurement Measure the distance between the eight inner processor package support locations and the defined plane (the outer support region LMS plane defined in Section 3.2.2.2), using a point-to-plane method. Refer to Figure 9, on page 22, for an illustration of the measurement method and Figure 10, on page 23, for an illustration of the measurement locations. Note: The inner processor package supports measured at the eight locations must meet the dimension requirement of item 3 in Table 1 on page 20. Best Fit LMS Plane Outer Support Inner Processor Package Support Figure 9. Illustration of Inner Support Measurement Method Best Fit LMS Plane 0.04±0.05 (Point to Plane) Outer Support 22 Socket Mechanical Requirements Chapter 3
44455 Rev. 3.00 August 2011 Socket FS1 Design Specification Figure 10. Illustration of Inner Processor Package Support Measurement Locations 3.3 Socket Housing The socket housing consisting of the base and the cover can be seen in Figure 4 on page 18. 3.3.1 Socket Base and Socket Cover The socket base and socket cover are made from liquid crystal polymer (LCP) with a UL flammability rating of 94 V-0. � Socket base color—black 27 26 25 � Socket cover color—natural or ivory The socket cover includes a 0.30 ± 0.05 mm deep recess to accommodate the package pin shoulder and braze/solder fillet. The socket cover flatness is less than 0.25 mm, before and after the SMT reflow to the PCB and after the environmental and mechanical testing. Finger access cutouts with a minimum width of 12 mm must be incorporated into two opposing sides of the socket cover to provide access for package removal. 28 32 Chapter 3 Socket Mechanical Requirements 23 29 30 31
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Socket FS1 Design Specification - AMD Support & Drivers

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