- Page 1: Excellence by DesignBURN-IN • TES
- Page 5 and 6: Part Number DesignationsFor BGA/CSP
- Page 7 and 8: ContentsTitle .....................
- Page 9 and 10: QFN SocketsPitch Pkg Body Pkg Body
- Page 11 and 12: QFN SocketsPitch Pkg Body Pkg Body
- Page 13 and 14: QFN SocketsPitch Pkg Body Pkg Body
- Page 15 and 16: QFN SocketsPitch Pkg Body Pkg Body
- Page 17 and 18: QFN SocketsPitch Pkg Body Pkg Body
- Page 19 and 20: QFN SocketsPitch Pkg Body Pkg Body
- Page 21 and 22: QFN SocketsPitch Pkg Body Pkg Body
- Page 23 and 24: QFN SocketsPitch Pkg Body Pkg Body
- Page 25 and 26: QFN SocketsPitch Pkg Body Pkg Body
- Page 27 and 28: QFN SocketsPitch Pkg Body Pkg Body
- Page 29 and 30: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 31 and 32: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 33 and 34: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 35 and 36: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 37 and 38: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 39 and 40: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 41 and 42: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 43 and 44: BGA/CSP SocketsPitch Pkg Body Pkg B
- Page 45 and 46: LGA SocketsDesign Features• Loran
- Page 47 and 48: LGA SocketsPitch Pkg Body Pkg Body
- Page 49 and 50: Gull Wing SocketsPitch Pitch Body W
- Page 51 and 52: Gull Wing SocketsPitch Pitch Body W
- Page 53 and 54:
TO SocketsDesign Features• Open T
- Page 55 and 56:
TO SocketsI/O Pitch Pitch Pkg Name
- Page 57 and 58:
Axial, Radial & MELF SocketsPitch P
- Page 59 and 60:
SIP SocketsPitch Pitch I/O Pkg Name
- Page 61 and 62:
ConnectorsPitch Pitch I/O Connector
- Page 63 and 64:
LCC w/Castellations SocketsPitch Pi
- Page 65 and 66:
Design FeaturesPLCC/SOJ Sockets•
- Page 67 and 68:
SMD SocketsBody W I/O Body L Body H
- Page 69 and 70:
Design FeaturesDIP Sockets• High-
- Page 71 and 72:
Microwave/Hybrid SocketsBody W Body
- Page 73 and 74:
Microwave/Hybrid SocketsBody W Body
- Page 75 and 76:
FlatPack SocketsPitch Pitch I/O Bod
- Page 77 and 78:
Design FeaturesSockets Accessories
- Page 79 and 80:
FEATURESLoranger SmartSocket• Ind
- Page 81 and 82:
Thermoplastic MaterialsTHERMOPLASTI
- Page 83 and 84:
Socket Performance DataFor BGA/CSP
- Page 85 and 86:
Signal DegradationCalculated for So
- Page 87 and 88:
Burn-in BoardsDedicated • Flexibl
- Page 89 and 90:
Part Number DesignationsFor Printed
- Page 91 and 92:
Flexible Bus BoardsDesign Features
- Page 93 and 94:
Program CardsCARD WIDTH1 LINE4 SEGM
- Page 95 and 96:
Design FeaturesSpecialty Boards•
- Page 97 and 98:
Protection EquipmentDesign Features
- Page 99 and 100:
PCB Layout Design Goals• Power Di
- Page 101 and 102:
Laminate Materials DataTYPE FR-4/G-
- Page 103 and 104:
Carbon CompositionComponent Materia
- Page 105:
Environmental SystemsWe Manufacture