QFN Sockets

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Design FeaturesQFN Socket Family• Loranger Standard and APS Contacts Availablefor Pad Pitches of 0.25 mm and Greater• Depth-Controlled Wiping Contact with CompliantCover• Accurate, Tightly-Controlled Package Fit• Zero-Insertion-Force• Open Top and Clam Shell Socket Designs• Optional Case Contacts and Bottom MountedHeat SinksSmartSocket with HeatSinks, Heaters, Local TemperatureSensing, and LogicCircuits for Local ControlDesign Features• Heatsink Cover Dissipates Heat from Package• Pitches of 0.25mm and Up• Optional Package Temperature Sensor (RTD orThermocouple)• Optional Socket Heater to Stabilize Package Temperature• Proven Contact Design• SMT and Efficient Size for High Board Densities• Package Aligns Quickly in Socket• Fast Delivery in High Quantities“Your Complete Burn-in Source for Sockets, Boards and Systems”April-11-2011Page 4SILICON VALLEY EAST COAST SOUTHERN CA ON-LINE303 Brokaw Road 817 Fourth Avenue 1055 Gaviota Drive loranger.comSanta Clara, CA 95050 Warren, PA 16365 Laguna Beach, CA 92651(408) 727-4234 Tel (814) 723-2250 Tel (949) 494-2356 Tel E-MAIL(408) 727-5842 Fax (814) 723-5391 Fax (949) 494-6597 Fax sales@loranger.com
Part Number DesignationsFor BGA/CSP & LGA Sockets OnlyBASIC PACKAGE BODY SIZE (mm)Outer dimensions of package defined with the largestdimension first (e.g., 12.38mm x 9.23mm with 324balls = 123092324B6617)Square packages, dimension is followed by “SQ”Input / Output Total, for example: BALL COUNTSOCKET TYPEU = BGA/CSPB = BGAC = Column Grid ArrayJ = APS (Advanced Plunger Style)K = KGDL = LGAM = MixedP = HPS (Plunger Style)T = Open TopW = Wafer270SQ 256B6617XPLATING0 = No Plating1 = 50 Microinches (1.270 microns) Au2 = Other Au Thicknesses3 = 100 Microinches (2.54 microns) Solderable Ni4 = 10 Microinches (0.25 microns) Au5 = Non-Magnetic Properties6 = 30 Microinches (0.76 microns) Au7 = Other PlatingSOCKET TERMINATION6 = Surface Mount Contact TerminationCONTACT MATERIAL0 = Not Applicable1 = Be-Cu5 = Other (Engineering Design Req'd)PLASTIC MATERIAL0 = Not Applicable5 = Polyphenylene Sulfide (PPS)7 = LGA / BGA/CSP – to 175°C8 = Modified Socket (Engineering Design Req'd)9 = Other (Engineering Design Req'd)C = LCP 300°C (max) ApplicationVARIATIONA-Z = Revision Level Normally Caused by Variation inPackage Dimensions, but can be other specialchanges“Your Complete Burn-in Source for Sockets, Boards and Systems”April-11-2011Page 5SILICON VALLEY EAST COAST SOUTHERN CA ON-LINE303 Brokaw Road 817 Fourth Avenue 1055 Gaviota Drive loranger.comSanta Clara, CA 95050 Warren, PA 16365 Laguna Beach, CA 92651(408) 727-4234 Tel (814) 723-2250 Tel (949) 494-2356 Tel E-MAIL(408) 727-5842 Fax (814) 723-5391 Fax (949) 494-6597 Fax sales@loranger.com
Page 1 and 2: Excellence by DesignBURN-IN • TES
Page 3: Best Selection of Fine PitchSockets
Page 7 and 8: ContentsTitle .....................
Page 9 and 10: QFN SocketsPitch Pkg Body Pkg Body
Page 29 and 30: BGA/CSP SocketsPitch Pkg Body Pkg B
Page 45 and 46: LGA SocketsDesign Features• Loran
Page 47 and 48: LGA SocketsPitch Pkg Body Pkg Body
Page 49 and 50: Gull Wing SocketsPitch Pitch Body W
Page 51 and 52: Gull Wing SocketsPitch Pitch Body W
Page 53 and 54: TO SocketsDesign Features• Open T
Page 55 and 56:
TO SocketsI/O Pitch Pitch Pkg Name
Page 57 and 58:
Axial, Radial & MELF SocketsPitch P
Page 59 and 60:
SIP SocketsPitch Pitch I/O Pkg Name
Page 61 and 62:
ConnectorsPitch Pitch I/O Connector
Page 63 and 64:
LCC w/Castellations SocketsPitch Pi
Page 65 and 66:
Design FeaturesPLCC/SOJ Sockets•
Page 67 and 68:
SMD SocketsBody W I/O Body L Body H
Page 69 and 70:
Design FeaturesDIP Sockets• High-
Page 71 and 72:
Microwave/Hybrid SocketsBody W Body
Page 73 and 74:
Microwave/Hybrid SocketsBody W Body
Page 75 and 76:
FlatPack SocketsPitch Pitch I/O Bod
Page 77 and 78:
Design FeaturesSockets Accessories
Page 79 and 80:
FEATURESLoranger SmartSocket• Ind
Page 81 and 82:
Thermoplastic MaterialsTHERMOPLASTI
Page 83 and 84:
Socket Performance DataFor BGA/CSP
Page 85 and 86:
Signal DegradationCalculated for So
Page 87 and 88:
Burn-in BoardsDedicated • Flexibl
Page 89 and 90:
Part Number DesignationsFor Printed
Page 91 and 92:
Flexible Bus BoardsDesign Features
Page 93 and 94:
Program CardsCARD WIDTH1 LINE4 SEGM
Page 95 and 96:
Design FeaturesSpecialty Boards•
Page 97 and 98:
Protection EquipmentDesign Features
Page 99 and 100:
PCB Layout Design Goals• Power Di
Page 101 and 102:
Laminate Materials DataTYPE FR-4/G-
Page 103 and 104:
Carbon CompositionComponent Materia
Page 105:
Environmental SystemsWe Manufacture
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