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Failure Analysis of Electrical and Electronic Products and Components

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<strong>Failure</strong> <strong>Analysis</strong> <strong>of</strong> <strong>Electrical</strong> <strong>and</strong><br />

<strong>Electronic</strong> <strong>Products</strong> <strong>and</strong> <strong>Components</strong><br />

Cobham Technical Services<br />

Reliability <strong>and</strong> <strong>Failure</strong> <strong>Analysis</strong><br />

The most important thing we build is trust


<strong>Failure</strong> <strong>Analysis</strong> <strong>of</strong> <strong>Electrical</strong> <strong>and</strong><br />

<strong>Electronic</strong> <strong>Products</strong> <strong>and</strong> <strong>Components</strong><br />

Cobham Technical Services<br />

Reliability <strong>and</strong> <strong>Failure</strong> <strong>Analysis</strong><br />

Maintaining reliability<br />

Reliability in electronic systems is important,<br />

whether you are a designer, manufacturer,<br />

distributor or user <strong>of</strong> equipment. Cobham<br />

Technical Services has many decades <strong>of</strong><br />

experience in identifying the causes <strong>of</strong><br />

reliability problems from product down to<br />

component level. Cobham Technical Services<br />

provides impartial, expert <strong>and</strong> fast diagnosis<br />

<strong>of</strong> problems from design through to use <strong>and</strong><br />

failure in the field, working with you to find<br />

a solution.<br />

Where reliability problems arise<br />

There are many situations where having further<br />

information can solve reliability problems <strong>and</strong><br />

significantly save time <strong>and</strong> money. Here are<br />

some typical cases which Cobham Technical<br />

Services regularly investigates:<br />

Thermal <strong>and</strong>/or mechanical stress<br />

Can cause many types <strong>of</strong> failure including<br />

internal fractures. The SEM image shows<br />

Ball Grid Array (BGA) connections which have<br />

fractured from thermal fatigue.<br />

Fire<br />

Even when fire has burned away the region<br />

that caused it, identifying the probable cause<br />

is <strong>of</strong>ten still possible; sometimes from analysing<br />

a similar non-failed product. It is not always at the<br />

most obvious cause. The image shows a burned<br />

out cable connection.<br />

� Production stoppages threatening costly<br />

delays <strong>and</strong> losses<br />

� Field returns, where it is essential to<br />

know whether the fault is due to design,<br />

assembly or use<br />

� Conflicting insurance or legal claims<br />

� Assessing new production techniques<br />

� Checking whether components are<br />

counterfeit or below acceptable quality<br />

� Analysing a supply chain to locate the<br />

source <strong>of</strong> a fault<br />

� Assessing the quality <strong>of</strong> manufacture<br />

� Determining whether a series <strong>of</strong> faults<br />

is due to a batch <strong>of</strong> components or<br />

a change in a process<br />

� Assessing if there should be a product recall.<br />

<strong>Failure</strong> analysis services<br />

Cobham Technical Services advises across<br />

the electronics manufacturing industry from<br />

aerospace, automotive <strong>and</strong> rail through to<br />

domestic, IT infrastructure <strong>and</strong> medical.<br />

<strong>Analysis</strong> <strong>of</strong> thous<strong>and</strong>s <strong>of</strong> cases over more<br />

than 30 years at Cobham Technical Services<br />

has generated an invaluable accumulation<br />

<strong>of</strong> experience. This capability will help you<br />

underst<strong>and</strong> the root cause <strong>of</strong> any reliability<br />

problem <strong>and</strong> help avoid costly repetitions.<br />

Cobham Technical Services <strong>of</strong>fers a range<br />

<strong>of</strong> services:<br />

� <strong>Failure</strong> analysis: a practical approach to<br />

failure from whole equipment down to all<br />

active <strong>and</strong> passive electronic components,<br />

providing you with an analysis <strong>of</strong> faults,<br />

How products fail<br />

Continuing improvements in the reliability <strong>of</strong> electronics have led to the expectation that they will never fail. The result is a greater pressure<br />

to correct problems, when they do occur, <strong>and</strong> to prevent repetition. There are numerous potential reasons why even the best systems or<br />

components can fail, for example:<br />

Poor soldering<br />

Examination <strong>of</strong> solder joints <strong>and</strong> wetting will<br />

indicate the quality <strong>of</strong> the soldering process,<br />

for example on lead-free joints. The image<br />

shows poor wetting <strong>of</strong> a component lead,<br />

with perhaps insufficient time at temperature.<br />

<strong>Electrical</strong> overstress<br />

Can cause melting, breakdown, oxidation<br />

<strong>and</strong> other effects. The image shows a power<br />

transistor with a voltage breakdown.<br />

Contamination <strong>and</strong> migration<br />

Contamination can be introduced during<br />

manufacture or use. Migration can occur under<br />

electrical stress <strong>and</strong> is exacerbated by heat <strong>and</strong><br />

moisture. The SEM image shows migration <strong>of</strong><br />

a metal across an insulating surface.<br />

Mechanical abrasion<br />

Defective surface finish can:<br />

Cause or result from abrasion <strong>and</strong> wear,<br />

Cause mechanical malfunction or electrical failure,<br />

Cause adhesion <strong>of</strong> coatings to fail.<br />

Surface analysis can quantify roughness, waviness,<br />

curl <strong>and</strong> other parameters.


conclusions on the mechanism <strong>of</strong> failure,<br />

identification <strong>of</strong> the stage at which it<br />

occurred, <strong>and</strong> recommendations on<br />

correction <strong>and</strong> prevention.<br />

� Analytical services: with expert<br />

interpretation.<br />

� Design review: assessment <strong>of</strong> the electronic<br />

design or build quality <strong>of</strong> a product,<br />

subassembly or component.<br />

� Technical review: state-<strong>of</strong>-the-art reviews<br />

<strong>of</strong> a particular technology. Previous<br />

examples include high temperature<br />

Data collection<br />

It is crucial that all the samples <strong>and</strong> historic<br />

data available is obtained. Details from<br />

manufacturing history, or use, or previous<br />

failures may give key information.<br />

Non Destructive Tests<br />

These include electrical measurements,<br />

internal inspection, <strong>and</strong> probes such as X-ray<br />

or Scanning Acoustic Microscopy. The micr<strong>of</strong>ocus<br />

X-ray image shows a pcb via with very thin copper<br />

at the centre.<br />

Package Opening<br />

Techniques include:<br />

Mechanical lid removal<br />

Chemical jet etching<br />

The image shows an integrated circuit with<br />

epoxy package material removed by jet etching<br />

to reveal the chip <strong>and</strong> wire bonds.<br />

Internal Examination<br />

This includes both Optical Microscopy<br />

<strong>and</strong> Scanning Electron Microscopy<br />

The image shows a ‘tomb-stoned’<br />

ceramic capacitor.<br />

electronics, non-volatile memories <strong>and</strong><br />

electronics for use in satellites.<br />

� Expert witness <strong>and</strong> investigation to<br />

support legal actions: technical evidence<br />

<strong>of</strong>ten clarifies who is at fault <strong>and</strong> in what<br />

way. Cobham Technical Services works for<br />

solicitors, companies <strong>and</strong> courts providing<br />

expert witness statements <strong>and</strong> reports to<br />

support claims. These can be for a single<br />

party or joint witness situations.<br />

� Financial loss engineering support:<br />

while the direct causes <strong>of</strong> failure <strong>and</strong><br />

unreliability are technical, <strong>of</strong>ten it is the<br />

underlying issues such as adequacy <strong>of</strong> the<br />

design <strong>and</strong> design process, allocation <strong>of</strong><br />

fault <strong>and</strong> consequential financial losses<br />

which are <strong>of</strong> central importance. Cobham<br />

Technical Services deploys its technical<br />

capability to provide evidence to support<br />

claims <strong>and</strong> quantify costs.<br />

A structured approach<br />

Cobham Technical Services employs a multidisciplinary team from diverse backgrounds <strong>and</strong> with many years <strong>of</strong> experience <strong>of</strong> diagnosing<br />

reliability <strong>and</strong> failure problems. <strong>Electronic</strong> components are analysed by using a consistent methodology <strong>and</strong> a careful sequence to ensure<br />

that all the evidence is obtained <strong>and</strong> correctly used to assess the cause <strong>of</strong> failure:<br />

Infrared Spectroscopy<br />

helps identify materials by their characteristic<br />

IR absorption. The image shows comparison<br />

<strong>of</strong> IR curves <strong>of</strong> a contaminant <strong>and</strong> the<br />

suspected source material.<br />

Ion Chromatography<br />

Separates <strong>and</strong> quantifies the individual<br />

ions within a test solution. It is used to<br />

characterise unknown ionic materials (e.g.<br />

contaminants from a surface). The image<br />

shows unknown contaminants against a<br />

characterisation curve, <strong>and</strong> allows assessment<br />

<strong>of</strong> risk from contamination.<br />

Thermal analysis<br />

Thermo gravimetric analysis (TGA) <strong>and</strong><br />

differential scanning calorimetry (DSC) can<br />

give valuable information about the thermal<br />

behaviour <strong>of</strong> materials <strong>and</strong> their thermal history<br />

either during processing or since. The image<br />

shows thermal decomposition <strong>of</strong> two supposedly<br />

identical materials.<br />

Postulation <strong>and</strong> testing <strong>of</strong> failure mechanisms<br />

A hypothesis for the mechanism is developed<br />

against the available evidence <strong>and</strong> previous<br />

experience. The theory may be tested by<br />

deliberate trial on new samples.


Examples <strong>of</strong> problems in different markets<br />

Aerospace<br />

A series <strong>of</strong> small smoke incidents in the cabin<br />

<strong>of</strong> an aircraft lead to a large scale review.<br />

Cobham Technical Services identified the<br />

immediate cause to be associated with the<br />

method <strong>of</strong> assembly <strong>of</strong> the electronics <strong>and</strong><br />

recommended changing the position <strong>of</strong> the<br />

critical components on the board.<br />

Transport<br />

Problems had occurred with monitoring the<br />

position <strong>of</strong> doors on an underground train.<br />

Cobham Technical Services found that a<br />

suspect component had inadequate<br />

internal soldering.<br />

www.cobham.com/technicalservices<br />

ERA Technology Limited trading as Cobham Technical Services<br />

Domestic<br />

Several heating systems failed with emissions<br />

<strong>of</strong> fumes. The root cause was located by<br />

analysis at Cobham Technical Services in<br />

some poor quality capacitors.<br />

Industrial<br />

An extensive set <strong>of</strong> accelerated life tests<br />

generated a number <strong>of</strong> failures in high power<br />

control systems. Some <strong>of</strong> these were analysed<br />

at Cobham Technical Services to be caused<br />

by an inadequate cleaning process.<br />

Cobham Technical Services<br />

Cobham Technical Services works at the<br />

leading-edge <strong>of</strong> innovation by undertaking<br />

advanced design <strong>and</strong> development,<br />

producing high-performance custom<br />

components <strong>and</strong> sub-systems, delivering<br />

specialist technical consultancy services <strong>and</strong> by<br />

providing state-<strong>of</strong>-the-art electromagnetic<br />

<strong>and</strong> power system modelling s<strong>of</strong>tware<br />

products.<br />

Expert technical teams have extensive<br />

embedded programme management<br />

experience, which ensures efficient project<br />

planning, resource time management <strong>and</strong><br />

on-time delivery.<br />

These capabilities provide customers with<br />

high added-value <strong>and</strong> enhanced competitive<br />

advantage through reduced technical <strong>and</strong><br />

commercial risk, faster time-to-market <strong>and</strong><br />

improved performance <strong>of</strong> products, systems<br />

<strong>and</strong> engineering infrastructure assets.<br />

Industry-leading technology is delivered<br />

to government departments <strong>and</strong> global<br />

companies across market sectors as diverse<br />

as communications, aerospace, defence,<br />

transport, electronics, medical <strong>and</strong> energy.<br />

Cobham Technical Services is based<br />

across four sites located in Leatherhead,<br />

UK (ERA Technology), Abingdon, UK<br />

(Lightning Testing <strong>and</strong> Consultancy),<br />

Kidlington, UK (Vector Fields S<strong>of</strong>tware)<br />

<strong>and</strong> Aurora, USA (Vector Fields S<strong>of</strong>tware).<br />

For further information please contact:<br />

Cobham Technical Services<br />

ERA Technology<br />

Cleeve Road,<br />

Leatherhead,<br />

FM1303<br />

Surrey KT22 7SA UK<br />

REF: RFA25<br />

Tel: +44 (0)1372 367444<br />

Fax: +44 (0)1372 367134<br />

Email: era.info@cobham.com<br />

Web: www.cobham.com/technicalservices

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