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Silicon Photonics in the Data Center - Institute for Energy Efficiency

Silicon Photonics in the Data Center - Institute for Energy Efficiency

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<strong>Silicon</strong> <strong>Photonics</strong> <strong>in</strong><strong>the</strong> <strong>Data</strong> <strong>Center</strong>Mario PanicciaIntel Fellow & GM<strong>Silicon</strong> <strong>Photonics</strong> OperationIntel.com/go/spUCSB May 1 2013


Agenda•Trends <strong>in</strong> <strong>Data</strong> <strong>Center</strong>•Hybrid <strong>Silicon</strong> Laser•New Photonic Architecture•Challenges go<strong>in</strong>g <strong>for</strong>ward2 © 2013, Intel Corporation. All Rights Reserved


Estimat<strong>in</strong>g <strong>the</strong> Exaflood, Discovery <strong>Institute</strong>, 1/08; Amass<strong>in</strong>g Digital Fortunes, a Digital Storage Study, CEA, 3/08A Wealth of <strong>Data</strong> to MovePersonal MediaBus<strong>in</strong>essMedicalSocial MediaScienceAve. Files on HD54GBRetail Customer DB600 TBCl<strong>in</strong>ical Image DB~1PBPhotos/ video/music>1EB/dayPhysics (LHC)300 EB/yrMore than 15Bconnecteddevices by 2015KiosksMedicalImag<strong>in</strong>gNetworkAppliancesDigitalSignageTest &MeasurementSecuritySurveillanceIn-VehicleInfota<strong>in</strong>mentHow do you connect all <strong>the</strong>se?3© 2013, Intel Corporation. All Rights Reserved


Cloud Growth = Massive <strong>Data</strong> TrafficHow long canpper support…• <strong>in</strong>creas<strong>in</strong>g l<strong>in</strong>k speeds <strong>for</strong> exponential data growth?• <strong>in</strong>creas<strong>in</strong>g distance <strong>for</strong> scal<strong>in</strong>g out of datacenter?• need to distribute H/W <strong>for</strong> efficient compute?Low Cost <strong>Photonics</strong> could allow scal<strong>in</strong>gReduc<strong>in</strong>g cables would improve cool<strong>in</strong>g4© 2013, Intel Corporation. INTEL All Rights CONFIDENTIALReserved


Br<strong>in</strong>g<strong>in</strong>g <strong>Silicon</strong> Manufactur<strong>in</strong>g to OpticalSi Manufactur<strong>in</strong>gOptical CommunicationsHigh volume,low costHighly<strong>in</strong>tegratedScalableVery highbandwidthLight weightLong distancesImmunity toelectrical noiseOPTICALANYWHERE,INCREDIBLEPOTENTIAL5© 2013, Intel Corporation. All Rights Reserved


Core technology: Hybrid <strong>Silicon</strong> LaserResearch collaboration with Professor Bowers UCSBCross-sectionTheDevice~1000umWafer level process<strong>in</strong>gOne bond lots of lasers…Per<strong>for</strong>mance based on silicon~150 umEtched Grat<strong>in</strong>gs6 © 2013, Intel Corporation. All Rights Reserved


The 50G Integrated <strong>Silicon</strong> <strong>Photonics</strong> L<strong>in</strong>kTransmitt<strong>in</strong>g and Receiv<strong>in</strong>g Light with <strong>Silicon</strong>Hybrid lasersOpticalFiberIntegratedTransmitterChipIntegratedReceiverChipTransmitModuleReceiverModule7© 2013, Intel Corporation. All Rights Reserved


Can we Br<strong>in</strong>g Optical <strong>in</strong>to Rack?If we had fiber up and down <strong>the</strong> rack:-Th<strong>in</strong>ner & lighter-Improved air flow-can connect more racksWhat about <strong>the</strong> photonics?Corn<strong>in</strong>gNew fiberCable &Connector8© 2013, Intel Corporation. INTEL All Rights CONFIDENTIALReserved


New Photonic Architecture(announced with Facebook Jan 16 2013)Mezzan<strong>in</strong>e OptionsOptical PCIe viaIntel <strong>Silicon</strong> <strong>Photonics</strong>Intel® Atom TMMicro-servertrayMezzan<strong>in</strong>e fiberIntel E<strong>the</strong>rnet chip andIntel <strong>Silicon</strong> <strong>Photonics</strong>Intel® Xeon ®processor basedtray100G <strong>Photonics</strong> provides multi-generation usageCan upgrade components <strong>in</strong>dependent of network.© 2013, Intel Corporation. All Rights Reserved


Industry Challenges <strong>for</strong> Optical <strong>in</strong> Rack:1) Cost: Copper pennies per p<strong>in</strong>. What is TOTLAL opticalsolution-fiber, connector, module2) Power: Rack power limited need to optimize electrical andoptical <strong>in</strong>terface3) Packag<strong>in</strong>g /size /density• HVM & Sever like assembly a must.. automation• Board space is expensive real-estate. Smaller is better4) Thermals: can we get lasers to operate at 85C?THESE WILL DRIVE VOLUME & USE OPPORTUNITIES10© 2013, Intel Corporation. All Rights Reserved

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