Mems - Meptec

PROFILEAs part of its extensiveportfolio, Dow Electronic Materialssupplies materials essential for awide range of advanced semiconductorpackaging applications.Through its Advanced PackagingTechnologies business, Dow ElectronicMaterials offers a portfolioof metallization, dielectric, lithographyand assembly products thatdeliver enabling technology forleading-edge packaging schemes,such as WLCSP, flip chip, SiP, and3D chip packages.Dow Electronic Materials’ experiencein metallization for electronics andmaterials for front-end semiconductormanufacturing makes the companyunique in the chip packaging market.Dow Electronic Materials’ heritage ofinnovation spans more than 50 yearsthrough the several companies, includingShipley, LeaRonal, Rodel and others,that came together in the last decade toform an electronic materials powerhouseknown as Rohm and Haas ElectronicMaterials. The innovations began withrevolutionary through-hole platingchemistry that changed the circuit boardindustry and continued into the dawnDow Electronic Materials is a global supplier of materials and technologies to theelectronics industry, bringing innovation and leadership to the semiconductor, interconnect,finishing, display, photovoltaic, LED and optics markets. With advanced technologycenters worldwide, teams of Dow research scientists and application experts workclosely with customers, providing solutions, products and technical service necessaryfor next-generation electronics.of semiconductor manufacturing withindustry-leading photoresists and relatedlithography materials, damascene copper,and chemical-mechanical planarization(CMP) pads. Today, as part of The DowChemical Company following the 2009acquisition of Rohm and Haas, DowElectronic Materials’ leading-edge productsfor semiconductor chips span theentire production process from polishingbare silicon substrates to connectingdevices to the circuit board.This heritage has built a deep understandingof the materials, stringentquality and expertise necessary to besuccessful in the semiconductor marketand adjacent segments of electronics.Dow Electronic Materials has leveragedthis experience into the Advanced PackagingTechnologies business to deliverproducts and processes that enable thedrive towards reduced form factor andincreased functionality in electronicdevices that require smaller and morereliable chip-to-chip and chip-to-circuitboard interconnects and packages.Dow Electronic Materials forgesclose relationships with its customers andthe company is engaged in several jointdevelopment programs with industryleaders. “We understand the importanceof working closely with our customers,”says Leo Linehan, global businessdirector for Advanced Packaging Technologies.“Close cooperation with ourcustomers is essential to understandingtheir applications and material needs andensuring that we deliver solutions thatwork.”Due to the global nature of thesemiconductor industry, Dow ElectronicMaterials understands the needto provide local technical support andservice. Dow Electronic Materials isin good position to support customerswith its extensive global AdvancedPackaging Technologies infrastructure,which continues to grow rapidly toenable expansion of the portfolio and toposition resources close to customers.Advanced Packaging Technologies hasR&D, applications, manufacturing andsales facilities and capabilities positionedglobally at the following locations: Marlborough,MA; Midland, MI; Freeport,TX; Lucerne, Switzerland; Cheonan,Korea; Seoul, Korea; Taoyuan, Taiwan;Sasakami, Japan; and Tokyo, Japan.Dow Electronics Materials is positioned to support customers with its extensive global Advanced Packaging Technologies infrastructure.Marlborough, MASasakami, JapanCheonan, Korea18 MEPTEC REPORT SPRING 2011 meptec.org