Mems - Meptec

PROFILEprocessing flexibility for wafer bumpingbecause it can be processed in a wideoperating window at either high or lowspeed using a single formulation, whileconsistently producing uniform, voidfree,smooth fine-grained deposits at finepitches. With its excellent performancecharacteristics and industry-leading costof ownership, SOLDERON BP TS 4000Tin-Silver plating chemistry is ideal forin-via bumps, mushroom bumps and capplating.The tin portfolio also includes tinlead,which is available in multiple alloycompositions, for applications that stillrequire lead content in bumping applications.SOLDERON BP tin-lead depositspossess excellent solderability and areeasily reflowed to form solder bumps.Dow Electronic Materials also leads theway with low-alpha materials by offeringboth tin and lead with low alpha particleemitting versions of their products,which are ideal for packaging applicationssensitive to the effects of theseemissions.Electrolytic Wafer Plating ProcessesTo fill a variety of other metallizationneeds in advanced packaging, DowElectronic materials offers both goldand nickel electroplating solutions. Theelectrolytic gold, AUROFAB BP II, isprovided in a ready to use formulationthat is suitable for semiconductor applications,and it delivers uniform deposits,excellent solderability and high cathodeefficiency. Dow’s NIKAL BP nickelprovides a low-porosity electroplatingbath with deposits that have high ductilityand serve as an excellent barrier tocopper diffusion.Under Bump MetallizationDow Electronic Materials offers arange of electroless plating chemistries,including nickel, zincate, immersion goldand palladium, that are ideal for underbump metallization. These products areformulated to produce the varying customerneeds for uniform deposits, highwear resistance, high hardness, porositycontrol, solderability and other characteristicsthat are essential for consistentwafer fabrication.SOLDERON BP TS 4000 Tin-Silver6 ASDWide Operating WindowENIG (electroless nickel/immersion gold)for wafer plating processes, after electrolessnickel process.Dielectric Portfolio8 ASDDow Electronic Materials offers twolines of dielectric materials specificallydesigned for advanced packaging applications.CYCLOTENE Advanced ElectronicsResins from Dow Electronic Materialsare high-purity polymer solutions thathave been developed for microelectronicapplications. The resins are formulatedas high-solids, low-viscosity solutions,which, along with exceptional perfor-10 μm via in 10 μm thick film, CYCLOTENEpositive-tone dielectric.12 ASDmance characteristics, make them idealas dielectrics in wafer-level packagingapplications. The hallmark of CYCLO-TENE dielectric materials is its excellentelectrical properties and superiorchemical resistance. Customers canchoose from the 3000 series, which isa dry-etch grade spin-on dielectrics, orthe 4000 series, which is a negativetone,photosensitive, spin-on dielectric.CYCLOTENE dielectrics a low dielectricconstant along with good planarizationproperties and compatibility with copper.The material is used for dielectric redistribution,bumping, passivation and waferbonding applications, among others.INTERVIA Photodielectric in WLCSP FanOut Package (courtesy: NXP Semiconductor)INTERVIA Photodielectrics areepoxy-based, negative-tone permanentdielectric materials designed for use onwafers and organic/inorganic substrates.The spin-on material has a low dielectricconstant, low moisture absorbance, lowtemperature cure, low stress, and excellentadhesive characteristics for bondingapplications. INTERVIA photodielectricscan be used for passivation stress buffer,die topcoat, redistribution, permanentpolymer adhesive and TSV polymer fill/metal insulator.20 MEPTEC REPORT SPRING 2011 meptec.org