Welcome to Montpellier - Euspen

Welcome to Montpellier 

Montpellier is at the heart of a region of outstanding beauty, a fascinating 

historical heritage and a booming economy. Its population has grown at a record 

rate in France, doubling over the last forty years. Montpellier owes its rapid growth 

to its privileged location in the "Franco-Spanish Mediterranian Arch" with its 

attractive climate and also to its dramatic economic development based on hitech. 

It is at the forefront in France of medical robotics, artificial vision, smart card 

applications and industrial sensors. But life-sciences are the foundation of 

Montpellier. It is the home of the oldest faculty of medicine in the western world 

(1220) and the city is now one of the leading platforms in Europe in 

biotechnologies and bio-informatics. 

euspen, likewise, has experienced a gratifying growth and influence both in the 

EU and internationally. It links industrialists, researchers and entrepreneurs 

across 27 countries in a powerful network of people dedicated to development, 

application and commercialisation of the ultraprecision technologies. euspen now 

has nearly 90 corporate and over 500 individual members. We run conferences, 

seminars, tutorials and publish newsletters and research papers all aimed at 

raising awareness, skills and competitiveness in high precision engineering, micro 

and nano technologies. We also provide related training programmes through the 

EC supported virtual institute VisionOnLine. It gives me great pleasure, on behalf 

of the Council of euspen, to welcome you at euspen's 5th International 

Conference organised by the University of Montpellier 2 which is itself, the home 

of several state-of-the art activities in nanotechnology. Having held euspen 

international conferences in Germany, Denmark, Italy, the Netherlands and the 

UK, we are particularly keen to hold this one in France to help strengthen fruitful 

interactions between French industry and scientific researchers and their 

counterparts in the EU and the rest of the world, an important two-way process. 

The Conference takes place in Montpellier's superb European Conference and 

Exhibition Centre, Le Corum, and has a full programme of review and research 

papers, professional development tutorials, an extensive commercial exhibition 

and offers a range of industrial visits in the area. 

Yours sincerely, Paul Atherton, UK, 

President of euspen 

5 th euspen International Conference - Montpellier – France – May 2005

Conference time table 

Sunday 8th May Time Monday 9th May 

8.30 - 12.30 8.45- 10.30 Opening session 

Tutorials sessions Life Achievment Award 

Joffre 1-2 

Conference Keynotes 

Pasteur Auditorium 

10.30- 11.00 Coffee break - Exhibition 

11.00-12.45 Oral session 1 

Large and Nano Optics 


12.45-13.30 Lunch High Level 

13.30-14.00 Coffee in the Exhibition 

14.00- 18.00 14.00-15.45 Posters sessions 5-6-7 

Tutorials sessions Espace Joffre 

Joffre 1-2 euspen AGM( 13.45-14.15) 


15.45-16.15 Coffee Break - Exhibition 

Registration 

15.00-19.00 16.15-18.00 Oral session 2 

Registration desk Corum Nano-Micro Integration 

engineering at Nanoscale 

Welcome reception Pasteur Auditorium 

18.30-19.30 19.30 Montpellier Mayor 

Hight level 1 Reception 

Salle Pétrarque 


Tuesday 10th May Wednesday 11th Thursday 12 th 

Oral session 3 Oral session 5 

Nanometrology and charac Ultraprecision machines 

terisation at nanoscale and control Company and 

Pasteur Auditorium Pasteur Auditorium Laboratory 

Tours 

Coffee Break - Exhibition Coffee Break - Exhibition Departing 

at 8.00 am 

Posters sessions Oral session 6 Back Le Corum 

1.2.3.4.8 Mechanical ultraprecision at 19.00 

Espace Joffre machining processes 


Lunch High Level Lunch High Level 

Coffee in the Exhibition Coffee in the Exhibition 

Oral session 4 Oral session 7 Toulouse : 

Microsystems MEMS Physico-chemical NanoTech center 

MOEMS and energy sources microfabrication processes Motorola 

Pasteur Auditorium Pasteur Auditorium 

Coffee break - Exhibition Coffee break - Exhibition Grenoble: 

ST Microelectronics 

Commercial Session Oral session 8 CEA LETI 

Applications of nanotech 

to new functionalities 

Pasteur Auditorium Pasteur Auditorium 

Conference Dinner 

18.30 Departing from 

Le Corum 


Topics 

Session 1- Latest development in design of large and nano 

optics 

Chairman : Marc Tricard 

Session 2- Nano-Micro Integration, engineering at Nanoscale 

Chairman : Pr Graham Davies 

Session 3- Nanometrology and characterization at nanoscale 

Chairman : Pr Guenter Wilkening 

Session 4- Microsystems MEMS, MOEMS and energy sources 

Chairman : Arno Hoogerwerf 

Session 5- Ultraprecision machines and control 

Chairman : Pr Alexander H. Slocum 

Session 6- Mechanical ultraprecision machinig processes 

Chairman : Pr Yoshimi Takeuchi 

Session 7- Physico-chemical microfabrication processes 

Chairman : Pr Hendrik van Brussel 

Session 8- Application of nanotechnologies to new 

functionalities 

Chairman : Emmerich Bertagnol 


Monday , 9th May 2005 

8.45 Presidential Address Prof. Paul Atherton 

euspen President 

9.00 Life Time Achievement award 

9.30 Keynotes 

BioMEMS Applications and Bioelectronics 

Jean-Louis Pautrat 

Minatec, Pôle d’innovation en micro nano technologies CEA / 

Grenoble 

10.30 

Progress of the OWL 100-m telescope conceptual design 

Dr Philippe Dierickx 

European Southern observatory 

Coffee break 

11.00 Oral Session 1 - 

Latest development in design of large and nano optics 

Chairman : Marc Tricard 

12.45 

14.00- 

15.45 

Status of the thirty Meter Telescope Projet 

J. Nelson 

UC Santa Cruz- Santa Cruz, CA -USA 

Large Optics at REOSC-From VLT to GTC and the ELT's 

R. Geyl ,M. Cayrel,M. Tarreau, E. Ruch 

SAGEM–REOSC – France 

Manufacturing of Optical Structures 

R.J.W. Knaapen, K.T. Krastev J.M.M. Swinkels,W.T.M.van de 

Ven, J.C. van de Ven 

Philips Applied Technologies –The Netherlands 

Design and Manufacture of Large and Nano Optics 

M.Tricard, P. Dumas 

QED Technologies, Rochester, NY USA 

From tetrahedral to box: design philosophy behind the 

Cranfield Big OptiX system 

P. Morantz, P. Shore, D. Stephenson, R.May-Miller*, R. Read* 

Cranfield University- UK * Cranfield Precision - UK 

Lunch 

Posters Sessions 5-6-7 

euspen Annual General Meeting (13.45-14.15) 

5 th euspen International Conference - Montpellier – France – May 2005 

3 

5 

9 

13 

17

15.45 Coffee break 

16.15- 

18.00 

Oral Session 2 - 

Nano-Micro Integration engineering at Nanoscale 

Chairman : Pr Graham David 

Fracture Fabrication of Single Crystal Silicon 

Nanosurfaces 

A.D. Sprunt and A.H. Slocum 

Department of Mechanical Engineering, MIT-USA 

Fabrication of electrical contacts to nanometer-sized 

materials using electron and ion-assisted deposition in a 

focused ion beam machine 

A. Romano-Rodriguez*, F. Hernández-Ramírez*, J. 

Rodríguez*, O. Casals*, A. Vilà*, J.R. Morante*, M. Abid**, 

J.P. Abid**, S. Valizadeh***, K. Hjort***, J.P. Collin**** , A. 

Jouaiti**** 

*EME/CErMAE/CEMIC Barcelon- Spain 

**École Polytechnique, Lausanne- Switzerland 

***Ångströmlaboratoriet, Universitet Uppsala, Sweden 

****Université Louis Pasteur Strasbourg, France 

Design and Fabrication of Microchannel Arrays for 

Combinatorial Studies of Nanomaterials Growth 

A.J. Hart , A.H. Slocum 

Massachusetts Institute of Technology-USA 

Computer Simulation of Nano-void Inspection in Low-k 

Dielectric Materials Using Near-field Optics 

S. Usuki, T. Nakao, S. Takahashi, K. Takamasu 

Department of Precision Engineering, University of Tokyo-Japan 

Tuesday , 10th May 2005 

8.45 Oral Session 3- 

Nanometrology and characterization at nanoscale 

Chairman : Prof Guenter Wilkening 

The LNE’s Nanometrology Research and Development 

program : last results 

L. Duhem 1 , L. Lahousse 2 , S. Ducourtieux 1 , J. David 2 , S. F. 

Larsonnier 1 , J. Salgado 1 , G.P. Vailleau 1 

1 

Laboratoire National d’Essais, Paris –France 

2 

Ecole Nationale Supérieure des Arts et Métiers, Lille –France 

New Precision Dimensional Metrology using Femtosecond 

Pulse Lasers 

S.W. Kim, J.S. Oh, J.H. Jin, Ki.N. Joo, Y.S. Kim, 


73 

77 

81 

85 

131 

135

Advanced Institute of Science and Technology- Korea 

A Study of the vicinity of a crack tip at nanometer scale 

enhanced nano migration-of ions in silicate glasses 

F. Célarié, M. Ciccotti, C. Marlière 

LDV, Université Montpellier 2- France 

Accurate and traceable 3D calibration of nanoscale 

standards 

G. Dai, T. Dziomba, M. Xu, L. Koenders, G. Wilkening 

Physikalisch-Technische Bundesanstalt, Braunschweig-Germany 

Video rate atomic force microscopy 

P. Atherton 1 , D. Catto 2 , J. Hobbs 3 , A. Humphris 4 

1,2 & 4 

Infinitesima Ltd., Bristol- UK 

3 

University of Sheffield-UK 


11.00 Posters sessions 1-2-3-4-8 

12.45 Lunch 


Microsystems MEMS, MOEMS and energy sources 

Chairman : Arno Hoogerwerf 

Device for harvesting hydropower with piezoelectric 

bimorph cantilevers 

S. Pobering, N. Schwesinger 

Munich University of Technology-Germany 

Design of a high resolution MEMS-based CMOS 

magnetometer 

N. Dumas, L. Latorre, P. Nouet 

LIRMM, Université Montpellier II-France 

Micromachined hight sensitive inclinometer based on 

thermal micro-convection 

J. Courteaud, A. Giani, P. Combette, A. Boyer,F. Pascal, A. 

Foucaran. 

CEM2, Université Montpellier II- France. 

2 DOF deflection mirror intended for closed loop control 

D. van Lierop, H.M.J.R. Soemers, M. Meuwese, R. Asjes, 

G.L.M. Jansen, P.E.M. Kuijpers 

Philips Applied Technologies -The Netherlands 

Angle-Controlled Assembly of Inclination Sensors 

A. Schubert , H.J. Koriath , R. Böttcher 

Fraunhofer Institute Machine Tools and Forming Technology, 

Chemnitz-Germany 


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141 

145 

283 

287 

291 

295 

299


16.15- 

18.00 

Commercial Session 

Chairman : Henny Spaan 

18.00 Departure for Conference Dinner 

Wednesday , 11th May 2005 


Ultraprecision machines and control 

Chairman : Pr Alexander H.Slocum 

Automated tool exchange for large surface ultraprecision 

diamond milling and turning applications 

C. Brecher, C. Wenzel, F. Niehaus 

Fraunhofer Institute for Production Technology IPT, Aachen- 

Germany, 

A new Approach for Precision Positioning Mechanisms 

T. Noll 

BESSY GmbH, Berlin- Germany 

Achieving Active Structural Damping in high precision 

equipment using Active Vibration Isolation mounts 

M.J. Vervoordeldonk, J. van Eijk 

Delft University of Technology, The Netherlands 

Philips Centre for Industrial Technology,Eindhoven- The 

Netherlands 

Design and performance evaluation of a coarse/fine 

precision motion control system 

H. Yang, E.S. Buice, S.T. Smith, R.J. Hocken, T.J. Fagan, D. 

Trumper*, D. Otten*, R.M. Seugling** 

Center for Precision Metrology, UNC Charlotte - USA 

*MIT, Cambridge - USA 

**LLNL, Livermore - USA 

An Analysis of the Discontinuity in the Modelling of 

Sinusoidal Excitation for Piezoelectric Actuator Based 

Micro-Positioning System for Surface Grinding Control 

Y. Gao *, S. Tse 

Department of Mechanical Engineering, University of Science and 

Technology- Hong Kong 




361 

365 

369 

373 

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12.45 

Mechanical ultraprecision machining processes 

Chairman : Pr Y.Takeuchi 

Manufacturing of an injection moulding mould insert with 

three-dimensional micro features by micromilling. 

G. Bissacco , H.N. Hansen, J. Fugl, T. Tang, L. De Chiffre 

Department of Manufacturing Engineering and Management. 

Technical University of Denmark. 

Study on ultra precision cutting of free form surface with 

diamond fly cutting 

H. Suzuki, M. Yuki*, Y. Yamamoto, A. Nakagawa*, T. 

Moriwaki*, T. Okino*, Y. Hijikata*, 

*Kobe University Kobe - Japan 

Machining Properties of Mono-crystalline Diamond End 

Mills 

E. Uhlmann*, D. Oberschmidt*, P. Feuchter** 

*Fraunhofer Institute Production Systems and Design Technology 

** Mößner GmbH – Germany 

Ultrasonic Assisted Diamond Turning of Hardened Steel 

Alloys 

F. Klocke, M. Heselhaus, J. Püllen 

Fraunhofer Institute for Production Technologies – IPT Aachen- 

Germany 

Control stability issues while applying rules of precision 

engineering on an ultra-precise five-axis grinding machine 

D. Hemschoote, J. Qian, H. Van Brussel, D. Reynaerts 

Katholieke Universiteit Leuven - Belgium 

Lunch 


Physico-chemical microfabrication processes 

Chairman : Pr Hendrik van Brussel 

Machining Complicated Patterns with Electrolyte Jet 

Machining 

W. Natsu, T. Ikeda, M. Kunieda 

Tokyo University of Agriculture & Technology- Japan 

Super Finishing of Moulding Steel for Optical Replication 

Techniques 

F. Klocke, O. Dambon 

Fraunhofer-Institute for Production Technology IPT - Aachen- 

Germany 

Force-Feedback-Assisted Micromachining 

Workbench for Spark Assisted Chemical Engraving 

(SACE) 


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649 

653 

657

15.45 

16.15- 

18.00 

U. Spaelter, R. Wüthrich, H. Bleuler 

Laboratoire de Systèmes Robotiques - Ecole Polytechnique 

Fédérale Lausanne (EPFL)- Switzerland 

Contouring of single-crystal silicon optics by use of wire 

electrical discharge machining 

H. Takino 1 , T. Ichinohe 1 , K. Tanimoto 1 , K. Nomura 1 , M. 

Kunieda 2 

1 

Nikon Corporation, Japan 

2 

Tokyo University of Agriculture & Technology -Japan 

Flexible Master Structures Made of SU-8 for Double-Sided 

Moulding of PDMS 

N. Lucas*, P. Sichler*, S. Büttgenbach* , C. Penache**, V. 

Bartels**, C.P. Klages** 

*Institut für Mikrotechnik, Technische Universität Braunschweig - 

Germany 

**Institut für Schicht- und Oberflächentechnik Braunschweig – 

Germany 

Coffee break 

Oral Session 8- 

Application of nanotechnologies to new functionalities 

Chairman : Emmerich Bertagnolli 

Low voltage thin film electroluminescent devices based on 

semiconductor nanocrystals 

C. Bertoni, D. E. Gallardo, S. Dunn 

School of Industrial and Manufacturing Science , Cranfield 

University - England 

Influence of Micro Wire Erosion on Surface 

Biocompatibility 

E. Uhlmann*, S. Piltz**, U. Doll* 

*Fraunhofer Institute Production Systems and Design Technology 

– Germany 

** Technical University Berlin-Germany 

Degradable implants made of magnesium alloys 

B. Denkena*, F. Witte**, C. Podolsky*, A. Lucas* 

* Hannover University – Germany 

** Hannover Medical School-Germany 

Control of droplet profile with directional wettability on the 

textured surface 

A. Kaneko, N. Moronuki 

Tokyo Metropolitan University,Tokyo - Japan 

5 th Terahertz generation and detection by plasma waves 

in nanometer gate high electron mobility transistors 

W. Knap 

euspen International Conference - Montpellier – France – May 2005 

1 , J. Lusakowski, F.Teppe 1 ,N. Daykonova 1 ,Y .Meziani 1 

L. Varani 3 , J.F. Millithaler 3 

661 

665 

727 

731 

735 

739 

743

1 GES, Universite Montpellier II- ,France 

2 Institute of Experimental Physics,Warsaw - Poland 

3 CEM2, Université Montpellier II - France 

19.30 Free evening 


Posters 

Sessions 5-6-7 

Monday 9 th May, 14.00-15.45 

Session 5 Ultra precision machines and control 

S5P1 Teaching the Next Generation of Precision Engineers 

D. Slocum, P. Long, A. Slocum 

S5P2 Error Budget for Micro-Milling Operations 

L. Uriarte, A. Herrero, S. Azcárate, G. Santiso 

S5P3 Active disturbance rejection control of fast tool servo for 

noncircular turning process 

W. Dan, W. Xiankui, Z. Tong 

S5P4 Torsional Error Motion of Simple Leaf-Spring Flexure 

Mechanisms 

D.G. Chetwynd, A. Alemohammed 

S5P5 A methodology for characterization and categorization of 

solutions for micro handling 

A. Gegeckaite , H.N. Hansen 

S5P6 An XY scanner with minimized coupling motions for the 

high speed AFM 

J. Park , W. Moon 

S5P7 Double focusing three face neutron monochromator 

M. Zatarain , M.A. Carrera, F. de la Maza 

S5P8 Design of an adjustable intuitive toolholder for Philips’ 

Lifrel 

L.J.M. van den Bedem, P.C.J.N. Rosielle, R.J.W. Knaapen, M. 

Steinbuch, M.M.P.A. Vermeulen 

S5P9 Six degrees of freedom Table for nanometric displacement 

by means of magnetic actuators 

I. Etxaniz, A. Izpizua, J. Arana 

S5P10 CoM-SiM - Conceptual Machine Design Simplification 

Modeler 

E. Bamberg, S. Hoskere 

S5P11 Motion Error Compensation of Hydrostatic Bearing Table 

Using the Active Controlled Capillary 

C.H. Park, Y.J. Oh, D.W. Lee 

S5P13 Integrability of handling facilities into micro machining 

centers 

J.P. Wulfsberg, A. Kuhn 


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405 

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421 

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S5P14 Weight Compensation Mechanisms for Ultra High Precision 

Vertical Positioning 

T. Frank, R. Theska, M. Lotz, T. Hackel, G. Höhne 

S5P15 Automatic Coarse and Fine Alignment System Based on 

Moiré Interference Phenomena 

Y. Uchida, J.N. Liu, Y. Uchida 

S5P16 Macro/micro position measurement system for a mobile 

robot using moving marks 

A. Torii, T. Inoue, K. Doki, A. Ueda 

S5P18 Investigations on a Magnetically Guided High-Precision 

Multi-Coordinate Drive Operated in a Hardware-in-the-Loop 

- Test Rig 

R. Volkert, V. Kireev, J. Zentner, T. Bertram 

S5P19 Dual Servo System Using VCM and Halbach Linear Motor 

K. H. Kim, Y. M. Choi, B. U. Nam, M. G. Lee, D. G. Gweon 

S5P20 Principles and Applications of the Slow Slide Servo 

Y. Tohme, R. Murray 

S5P21 Precision testing of a low cost high precision Automotive 

Valve 

D. Freeman, A. Slocum 

S5P22 Microscopic Behavior of Positioning Mechanism Using Ball 

Screw And Rolling Guide Way 

S. Fukada, S. Nakai, K. Wakuta 

S5P23 Complex quality control algorithm for production of ultra 

precision photonic and bioengineering articles from 

polymers 

S.N. Lavrynenko, A.G. Mamalis 

S5P24 Development of Gearless Polishing Machine for High 

Removal Rate and Ultra-Smoothness Double Side Surface 

Polishing 

H. Yasui, K. Yamaguchi, S. Kuribayashi 

S5P25 Reduction in thermally induced displacements in an XY 

contouring stage through FEA analysis inspired design 

T. Wemyss, J. Phelan 

S5P27 Calibration issues in line scale based 3D nano- and micro 

CMMs 

R. Bergmans, G. Kotte, J. van Seggelen, N. Rosielle, P. 

Schellekens, H. Spaan 

S5P29 Experimental Method and Device for Spherical Joint 

Accuracy Evaluation 


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461 

465 

469 

473 

475

G. Olea, O. Sato, H. Kiyosawa, S. Takahashi, and K. Takamasu 

S5P30 European Scale Training in Microhandling and 

Microassembly 

W. Brenner, D. Andrijasevic, F. Suemecz 

S5P31 Modeling and Simulation study for a mini actuator using a 

giant magnetostrictive material 

B. Yang, M. Bonis, H. Tao, C. Prelle, F. Lamarque 

S5P32 Investigation of the Microscopic Performance of an 

Aerostatic Precision Positioning Stage with an Airlubricated 

Capstan Drive System 

J. Neou, C.W. Chao, C.L. Chao 

S5P33 A large range XY flexure stage for Nanopositioning 

S. Awtar, A.H. Slocum 

S5P34 

S5P35 

A two-axis Tri-mode Positioning System for Picometer 

Positioning 

H. Mizumoto, Y. Yabuta, S. Arii, Y. Tazoe, Y.Kami 

Grinding of Ultrasmall Milling Tools 

R. Haberland , K. Schmidt 

Session 6- Mechanical ultraprecision machining 

processes 

S6P1 Ultra-precision Cutting of Oxygen-free Copper for Cells in 

the Linear Collider -Using Ultra-high quality Diamond Tools 

in Nitrogen Gas Atmosphere 

T. Kaneeda, S. Yamaguchi, S. Yokomizo, S. Shimada, M. 

Higuchi, L. Anthony 

S6P2 Alternative methods for manufacturing milling tools 

J. Schmidt, J. Kotschenreuther, M. Knoll 

S6P3 Detection of Cutting Forces in Micro Machining Operations 

J. P. Wulfsberg, G. Brudek 

S6P4 Effects and Possible Roles of Atmospheric Molecules in 

Ultra-micro Cutting of Monocrystalline Silicon 

Y.J. Liu, T. Inamura, N. Takezawa 

S6P5 Grinding characteristics and surface modifying effects on 

ELID ground biocompatible Co-Cr alloy for artificial joint 

K. Katahira, M. Mizutani, Y. Akinou, J. Komotori, H. Ohmori, Y. 

Uehara 

S6P6 Internal Grinding for Center Hole of Zirconia Ferrules 

Utilizing An Electroplated Diamond Taper Wire 


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533 

537 

541 

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Y. Kamimura, Y. Tani, M. Nukui 

S6P7 Fabrication of Ni-W Electroplated Micro Diamond Tools 

with Carbide Substrate and Their Application to the 

Grooving of Silicon without/with Ultrasonic Vibration 

H. Onikura, O. Ohnishi, K. Nishihara, Y. Mori 

S6P8 The Effect of Oil-Mist Application on the Machinability in 

High Speed Turning of Nickel-Based Super Alloy Inconel 

718 

T. Yatsuzaki, H. Onikura 

S6P9 Investigation on a procedure for optimal axial depth of cut 

accuracy in micromilling 

G. Bissacco , H. N. Hansen, L. De Chiffre 

S6P10 Wear of micro end mills 

G. Bissacco H. N. Hansen, L. De Chiffre 

S6P11 Microstructuring of Embossing Rollers with Profiled 

Diamond Tools 

E. Brinksmeier, O. Riemer, K. Rickens 

S6P12 Dynamic Behavior of ELID-processes 

E. Brinksmeier, W. Preuss, K. Rickens, D. Grimme 

S6P13 Control of Tool Wear in Single Crystal Diamond Cutting of 

Steelby intermittent cutting method 

Y. Song, K. Nezu, T. Shibasaka, T. Moriwaki 

S6P14 Micro Milling of Hard Material with Micro Milling Tool 

H. Suzuki, T. Kimura, Y. Yamamoto, T. Moriwaki, T. Okino, Y. 

Hijikata, I. Goto, T. Goto, T. Ono, Y. Goto, H. Isono, N. 

Takahashi 

S6P15 Innovative Manufacturing Process Chains for Micro Milling 

Tools 

E. Uhlmann, K. Schauer 

S6P16 Fabrication of Micro Flat Drills Composed of 90 nm WC 

Grain with a Diameter Less Than 10 micrometers and Their 

Drilling Performance 

O. Ohnishi, H. Onikura, S-K. Min, M. Aziz, A. Wahdi, T. Koga 

S6P17 Investigations on the influence of the substrate’s thickness 

on the cut quality during dicing of thin silicon wafers 

H.H. Gatzen, G. Günzel 

S6P18 Process analysis during micro cutting of high-strength 

materials 

A. Schubert, J. Schneider, U. Eckert 

S6P19 Cutting Characteristics in Edge Moving Type of Long Life 595 


549 

553 

557 

561 

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573 

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Precision Cutting Method 

H. Yasui, S. Hoda 

S6P20 Ultra-smoothness Grinding of Silicon Carbide in Depth of 

Cut of 1mm 

H. Yasui, Y. Yamamoto, T. Sawa 

S6P21 Manufacturing of the aspheric stainless steel die by ultraprecision 

turning using coated-cemented-carbide tool 

S. Sakamoto, H. Yasui, A. Shinozaki 

S6P22 

Ultraprecision Straight Microgrooving with Pattern by 

Means of a High Speed Shuttle Unit 

T. Kawai, K. Ebihara, Y. Takeuchi 

S6P23 Drilling of microholes in Titanium Alloy Ti-6-Al-4V 

L. Kudla 

S6P24 

Modeling and computer simulation of Rotating Electrical 

Discharge Machining (REDM) 

J. Kozak, Z. Gulbinowicz 

S6P26 In-Process-Measurement of Sample Thickness changes 

during Grinding 

D. Stoebener, G. Goch 

S6P27 Geometrical characterization of micro end milling tools 

F. Borsetto, P. Bariani, G. Bissacco, L. De Chiffre, H. N. 

Hansen 

S6P28 Development of a new vacuum porous pin chuck for CMP 

Pin formation by abrasive-blasting a porous material 

A. Une, K. Yoshitomi , M. Mochida 

S6P29 Effect of rake angle of single crystal diamond tools during 

micro grooving on electroless nickel plated die materials 

A.Q. Biddut, M. Rahman, K.S Neo 

S6P30 Diamond Wire Polishing of Corrugated Micro-bores 

K. Ramesh, W.G. Lewis, L. Yin, F.F. Zhou 

S6P31 Material Removal Mechanisms Involved in Rotary 

Ultrasonic Machining of Brittle Materials 

C.L. Chao, T.T. Chen, J. Neou, K.J. Ma 

S6P32 Diamond turning properties of the intermetallic, singlecrystalline 

NiAl 

R. Rentsch, C. Zhang, P. Gumbsch, E. Brinksmeier 

Session 7- Physico-chemical microfabrication 

processes 


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S7P1 Optimization of critical processes within an automated 

process chain for the Micro-Powder-Injection-Molding 

Process 

J. Fleischer, C. Buchholz, H. Weule 

S7P2 Photoblasting with PDMS mask and fine abrasive for 

micromachining of metal and glass 

E. Makino, T. Mineta, T. Takada, H. Sato 

S7P3 Discussion Of Thin-Wire Electro Discharge Machining 

Errors 

A. Herrero, L. Uriarte, S. Azcarate, J.A. Sánchez, L.N. López de 

Lacalle 

S7P4 Material micro-removal mechanisms in Laser Assisted Jet 

Electrochemical Machining 

P.T. Pajak, A.K.M. De Silva, D.K. Harrison, J.A. McGeough 

S7P5 Simulation of a Chemo-mechanical Polishing Process 

Using FEM-Modelling Techniques 

F. Klocke, O. Dambon, D. Cardenas 

S7P6 Quality Assurance in Micro Production - Chances and 

Challenges 

J. Fleischer, I. Behrens 

S7P7 Investigations of Micro Electrochemical Machining with 

UltraShort Voltage Pulses 

D. Gulbinowicz, Z. Gulbinowicz, J. Kozak 

S7P8 Electrochemical Etching with High Etch Factor for 

Micromachining of Shape Memory Alloy 

T. Mineta, E. Makino 

S7P9 Low-Temperature Synthesis of Hard coating Film on Plastic 

Substrates 

C.C. Wang, C.F. Yang ,K.L. Hsien 

S7P10 Formation of insulating layer of the electrode for the 

electrode-contact discharge truing and its durability 

M. Mizuno, T. Iyama 

S7P11 Manufacturing of micro structured rotational devices by 

electro discharge technologies 

E. Uhlmann, S. Piltz 

S7P13 Microcoaxial probe for scanning microwave near field 

M. Marchetti, M. Castagné, D. Gasquet, J.L. Carbonero 

S7P14 Advanced ion beam and plasma jet technologies for ultra 

precision surface processing and finishing 

A. Schindler, T. Hänsel, F. Frost, A. Nickel, W. Frank, G. Böhm, 


669 

673 

677 

681 

685 

687 

691 

695 

699 

703 

707 

711 

715

R. Fechner, R. Schwabe 

S7P15 The Quality of Laser Assisted Micro-structured Sapphire 

Components and Occuring Damaging Effects 

A. Ostendorf, T. Temme, K. Samm 

S7P16 Nanostructural effects at KNbO3 synthesis 

P. Teslenko, Y. Kabirov, Y. Kuprina, N. Kofanova, M. 

Kupriyanov 

Posters 

Sessions 1-2-3-4-8 

Tuesday 10 th May, 11.00-12.45 

Session 1- Latest development in design of 

large and nano-optics 

S1P1 Novel Designs of Measuring Mirrors For Ultra High 

Precision Machines 

M. Lotz, T. Frank, T. Hackel, R. Theska, G. Höhne 

S1P2 High Speed Fringe Reflection Technique for nm Resolution 

Topometry of Diamond Turned Free Form Mirrors 

R. Gläbe, C. Flucke, T. Bothe, E. Brinksmeier 

S1P3 Study on shape measurement of large glass substrates for 

FPD 

Y.Ito, W.Natsu, M.Kunieda, N.Maruya, N.Iguchi 

S1P4 A study on the characteristic of ultra-precision grinding 

machining considering ultra-fine surface and 3D contour 

accuracy of aspherical surface micro lens 

S.Y. Baek, E.S. Lee, H.D. Lee 

S1P5 A Comparison between the Errors in Simulated and 

Experimental Data in Non-contact Surface Measurement 

Systems 

W. Sun, J.W. McBride, M. Hill 

S1P6 Precision Moulding of Micro Aspherical Glass Lenses 

H. Suzuki, A. Muramatsu, Y. Yamamoto, T. Okino, Y. Hijikata, 

T. Moriwaki 

S1P7 Plane mirror interferometer for precision length 

measurements 

H.J. Büchner, G. Jäger 

S1P8 Nanometric characterization of aspheric optical surfaces 49 


719 

721 

21 

25 

29 

33 

37 

41 

45

InCalcium fluoride by multi-wavelength image processing 

S. Gras, B. Feraud, R. Y. Fillit, J. C.Pinoli 

S1P12 Precision Contour Grinding of Optical Glasses Using 

Coarse-Grained Diamond Wheels 

Q. Zhao, E. Brinksmeier, W. Preuss, O. Riemer 

S1P13 Ultra-High Precision Gimbal-Mount for Optical Elements 

S. Zelenika, M. Rohrer, D. Rossetti 

S1P14 Micro-Optical Fabrication Using Dynamic Gray Mask based 

on the Digital Light Processing Technique 

Chen Jenq-Shyong, Lai Ming-Ping 

S1P17 Optical near-field microscopy for biological samples: 

collection and transmission mode 

E.L. Nativel, S. Mailfert, P. Falgayrettes,T. Salehzada, P. Gall- 

Borrut, C. Bisbal , M. Castagné, Le Chat 

S1P18 Scattering type near-field optical microscopy for integrated 

optics : complex field mapping and analysis 

A. Bruyant, I. Stefanon, G. Lerondel, S. Aubert, S. Blaize, P. 

Royer 

Session 2- Nano-Micro Integration, engineering 

at Nanoscale 

S2P1 Nanopatterning of Diamond Films in Diamond Mold Room 

Temperature Nanoimprint Lithography Using Polysiloxane 

S. Kiyohara, F. Matsubayashi, M. Fujiwara, K. Mori 

S2P2 Development of a universal calibration system for the 

depth measuring system in a nanoindentation instrument 

Z. Li, K. Herrmann, F. Pohlenz 

S2P3 Geometrical Characterisation of MST and Microfluidic 

Devices Using Novel Surface Metrology Techniques 

L. Blunt, S. Xiao, X. Jiang, P. Scott 

S2P4 Investigation on the micro-nano mechanical properties of 

anodised aluminium by TPM 

X. Liu, M.K. Chan, T. Warrender, A. Stange, W. Hotz 

S2P5 Precision Assembly of Tips for Scanning Probe 

Microscopes 

R. Meeß, M. Kempe, H.-U. Danzebrink, F. Löffler 

S2P6 Synthesis of gold nanodots by ultrasound assisted 

electrodeposition. Caracterisation by TEM, EDAX XRD and 

Disk Centrifuge 

L. Canet, J.L. Deplancke 


53 

57 

61 

65 

69 

89 

93 

97 

101 

105 

109

S2P7 Highly Flexible Fabrication of µ-Sensor Parts by UV-Laser 

Direct Write thin-film Structuring with High Repetition 4w- 

Diode Pumpe Solid State Lasers 

A. Ostendorf, F. Meyer, U. Stute 

S2P8 Discussion about the reliable Dimensioning of Micro 

Components and Potentials for Stress Decrease 

A. Albers, D. Metz 

S2P9 Investigation on gas bearings operable in high vacuum 

environment for engineering at nano-scale 

C. Schenk, S. Risse 

S2P10 Nanostructuring with an Electrolytical STM : Localized 

deposition of Pt on HOPG 

A. Lal, H. Bleuler 

Session 3- Nanometrology and characterization 

at nanoscale 

S3P1 Development of an optical stylus displacement sensor with 

a speckle noise reduction capability 

H. Fukatsu, K. Yanagi 

S3P2 Fast optical roughness characterization of engineered 

surfaces 

S. Patzelt, G. Goch 

S3P3 A Micromachined Displacement Sensor with High Accuracy 

and Long Range 

M. Kim, W. Moon, E. Yoon 

S3P4 Measurement of an Aspherical Surface Profile on a 

Precision Grinding Machine 

A. Shibuya, Y. Arai, W. Gao, H. Shimizu, S. Kiyono 

S3P5 Universal Interferometer for the calibration of gauge 

blocks, end bars, Step gauges and graduated line scales. 

R. Calvo, A. Gutierrez, E. Prieto 

S3P6 The use of the GPS-Standard in Nanometrology 

A. Weckenmann, Th. Wiedenhoefer 

S3P7 Self-Calibration of CMM with redundant degree of freedom 

R. Furutani, K. Shimojima, K. Takamasu 

S3P8 Development of “softgauges” for surface profile metrology 

L. Blunt, R. K. Leach, X. Jiang, P. Scott, P. Harris, S. Xiao, T.Li, 

G. Parkin 

5 th S3P10 A correction method for the nonlinear behaviour of the 

height measuring system in a SPM 

euspen International Conference - Montpellier – France – May 2005 

113 

117 

121 

125 

149 

153 

157 

161 

165 

169 

173 

177 

181

M. Xu, F. Pohlenz, G. Dai 

S3P11 Prototypes of new nanoscale CD-standards for high 

resolution optical microscopy and AFM 

U. Huebner, W. Morgenroth, R. Boucher, H.G. Meyer, Th. 

Sulzbach, B. Brendel, W. Mirandé, E. Buhr, G. Ehret, Th. Fries, 

G. Kunath-Fandrei, R. Hild 

S3P12 Simulation based analysis of workshop influences on 

machine-integrated form testing interferometers 

D. Doerner, P. Mangalasseril, T. Pfeifer, R. Schmitt 

S3P13 Self calibration method for 3D roundness of spheres 

using an ultraprecision coordinate measuring machine 

A. Küng, F. Meli 

S3P14 Towards a nano CMM for bridging the nano and micro 

world of surface measurements 

G. Dai, F. Pohlenz, H.U. Danzebrink, G. Wilkening, K. Hasche 

S3P15 A new micro-artefact for testing of optical and tactile 

sensors 

M. Neugebauer, U. Neuschaefer-Rube 

S3P16 MIKES’ facility for calibration of commercial laser 

interferometers 

V.P Esala, B. Hemming, K. Nyholm, A. Lassila 

S3P17 Straightness measuring method for large objects by using 

high precision water level gauges 

O. Horiuchi, Y. Yamaguchi, Y. Kosaka, T. Kato, Y. Mizukami 

S3P18 High resolution two-dimensional zero reference marks 

design with optimization algorithms 

J. Saez-Landete, E. Bernabeu, J. Alonso 

S3P19 Verification of optical coordinate measuring machines 

along the vertical measurement axis 

R.E. Morace, H.N. Hansen, L. De Chiffre 

S3P20 Three dimensional Metrology on LIGA parts using the 

Werth Fibre Probe: Methods and Models to reduce optical 

Effects influencing the Precision 

R. Thelen, P.Meyer, A. Janssen, J. Schulz 

S3P21 Particulate Nano-defects Detection for Patterned Wafers 

using Evanescent Light Illumination method 

T. Yoshioka, T. Miyoshi, Y. Takaya, K. ShiraI, 

S3P23 Roughness measurement with an AFM-CMM instrument 

F. Marinello, P. Bariani, L. De Chiffre, H.N. Hansen 

229 

S3P24 Control system for guiding deviations on the PTB 233 


185 

189 

193 

197 

201 

205 

209 

213 

217 

221 

225

nanometer comparator 

J. Flügge, R. Köning, H. Bosse 

S3P25 Multiplexed fibre interferometer and its application on 

surface measurement 

D. Lin, X. Jiang, W. Zhang, L. Zhang, L. Blunt 

S3P26 Construction of an Ultrahigh Vacuum Scanning Tunnelling 

Microscope (UHVSTM) for Atomic-Level Characterization of 

Magnetic Systems 

W.T. Pong, C. Durkan 

S3P28 Metrological Characteristics of Complex Wavelet 

Transform for Surface Topography Analysis 

W. Zeng, X. Jiang, P. Scott, L. Blunt 

S3P29 An Extended Auto-Collimation Method Combined with a 

Deflect Optical System for Non-Contact Profile 

Measurement 

H. Shimizu, Y. Watanabe, W. Gao, S. KIiyono 

S3P30 Tackling the challenge of traceable surface texture 

measurement in three dimensions 

J. Haycocks, K Jackson, R. Leach, J. Garratt, I. McDonnell, P. 

Rubert, J. Lamb, S. Wheeler 

S3P31 Reconstruction of continuous surface profiles from 

discretely sampled data 

J. K. Brennan, A. Crampton, X. Jiang , R. Leach, P. Harris 

S3P33 New generation of wireless high resolution optical 

encoders 

Y. Jourlin, O. Parriaux, M. Johnson, S. Reynaud 

S3P34 Nano-structuring of SiO2 layers on Si substrates 

using irradiation damage 

J.-F. Carlotti, A.D. Touboul, C.C. Rotaru, H. Lebius, M. 

Schleberger, G. Bruguier, C. Guasch, J. Bonnet 

S3P35 A Compact Metrological Atomic Force Microscope using 

Laser Interferometer 

T.B. Eom, J. Y. Lee, J.A. Kim 

S3P36 Low Cost and Rapid Precision Measurement at Mesoscale 

Using Sub-Pixel Edge Detection Technique 

H.S. Ryu , S. Mekid 

S3P37 Diamond turning properties of the intermetallic, singlecrystalline 

NiAl 

R. Rentsch, C. Zhang, P. Gumbsch, E. Brinksmeier 

Session 4- Microsystems MEMS, MOEMS and 

energy sources 


237 

241 

245 

249 

253 

257 

261 

265 

269 

273 

277

S4P1 In Process Visualization of Micro Manufacturing Operations 

J. Lehman, J. P. Wulfsberg 

S4P2 Wireless power supply systems, specific for Nano/Micro 

Technology 

Vittore Giraudo 

S4P3 Trends in MEMS- and nano-related technologies: an 

analysis on the basis of patent application data 

P. Polesello, M. Meister, P. Foussier, C. McGinley, C.Meister 

S4P4 Why use LIGA technology to produce MEMS 

P. Meyer, A. Janssen, J. Schulz, M. Guttmann, R. Thelen, M. 

Arendt, H.J. Fichtner, P. Hesse, V. Ritter 

S4P5 A Novel Non-linear Beam Method to Extend the Working 

Range of Electrostatic Parallel-Plate Micro Actuator 

D.Y. Qiao, W.Z. Yuan 

S4P6 Mechatronic Actuators for Precise Positioning Systems 

R. Slatter 

S4P7 Fabrication of Differential SMA Driven Micro Grippers in 

Batch-Technology 

B. Hoxhold, M. Leester-Schädel, S. Büttgenbach 

S4P8 Solid Hinge Guide Made by Silicon Bulk Microtechnology 

J. Fruehauf, E. Gaertner, M. Seifert 

S4P10 

SPM-based probing systems for nano-coordinate 

metrology 

H.U. Danzebrink, D.V. Sokolov, C. Dal Savio, G. Dai 

S4P12 Embedded programmable devices using Magnetic RAM 

cells 

N. Bruchon, N. Saint-Jean, L. Torres, G. Sassatelli, G. Cambon 

S4P13 Design of CMOS Cantilevers for Inertial Sensing 

A. Chaehoi, L. Latorre, P. Nouet 

S4P15 Tool wear for micro-ultrasonic machining (MUSM) 

E. Andrey, J.J. Boy, C. Khan Malek 

S4P16 Characterization of measurement effects in an MST 

Characterization of measurement effects in an MST based 

nano probe 

E.J.C. Bos, F.L.M. Delbressine, A.H. Dietzel 

S4P17 Deep Reactive Ion Etching for MEMS and Microsystems a 

market and technologies overview 


303 

307 

311 

315 

319 

323 

325 

329 

333 

337 

341 

345 

349 

353

E. Mounier, Ph. Roussel,J.C. Eloy 

S4P18 Design and manufacturing of a bi-stable MEMS 

G. Fleury, P.L. Charvet, S. Drapier, R. Fortunier 

Session 8 -Application of nanotechnologies to 

new functionalities 

S8P1 Manufacturing of microsurgery tools by microelectrodischarge 

machining 

Kawata, T.Domyo, T. Sato, K. Inoue 

S8P3 Fabrication of Micro Organic Light-Emitting Devices in 

Nanoimprint Method Using Diamond Molds 

S. Kiyohara, M. Fujiwara, F. Matsubayashi, K. Mori 

S8P8 Synthesis of Carbon Nanostructures in Matrices Based on 

Fine Silica 

S. Volkov, V. Ogenko, L. Dubrovina, O. Holdun 

S8P9 Production of complex medical implants with ceramic 

functional surfaces 

B. Denkena, M. Reichstein, M. van der Meer 

S8P10 Monte Carlo analysis of nano-scale schottky diodes for THz 

generation 

S. Pérez, T. Gonzalez, L. Varani, C. Palermo, J.C. 

Vaissière,J.F. Millithaler, E. Starikov, P. Shiktorov, V. 

Gru¡zinskisand, L. Reggiani 

S8P11 Optical and Structural characteristics of electron beam ZnO 

thin films evaporated for sensors applications. 

R.A. Asmar, G. Ferblantier, J.L. Sauvajol, A. Giani, F. Pascal 

Delannoy, S. Juillaguet, A. Foucaran 

S8P12 Magnetic microspheres based on poly (vinyl alcohol). 

Synthesis and characterisation 

C.M. Marian, S. Stolnik-Trenkic, M. Rusu 

S8P13 Biological samples imaged by Atomic Force Microscopy : a 

previous study to a combination of an AFM / Fluorescence- 

Scanning Near-Field Optical Microscope 

S. Mailfert, L. Nativel, P. Falgayrettes, P. Gall-Borrut, T. 

Salehzada, C. Bisbal 

S8P15 Development of Bio-microdevice actuated by piezoelectric 

thin film for cell culture 

T. Shibata, Y. Makita, T. Masuzawa, A. KishidaI, E. Makino, T. 

Mineta 


355 

747 

751 

755 

759 

763 

767 

771 

775 

777

S8P16 Piezoelectric zinc oxide thin films for bulk acoustic wave 

resonator. Application to humidity detection. 

G. Ferblantier, R. Al Asmar, F. Mailly, F. Pascal-Delannoy, 

A.Foucaran 


781

Technical exhibition 

A commercial exhibition will be run in Joffre Suite during the conference. It will 

provide a valuable meeting opportunity for customers, scientists and providers of 

precision engineering, micro and nano technologies 

Exhibitors 

Advance Nanotec Inc 

Stand N°26 

www.advancenanotec.com 

USA 

Alicona Imaging 

Stand N°25 

www.alicona.com 

Austria 

CEA 

Stand N°13 

www.cea.fr 

France 

Coors Tek 

Stand N°17 

www.coorstek.com 

USA 

euspen Ltd 

Stand N°28 

www.euspenk.com 

UK 

Fogale Nanotec 

Stand N°19 

www.fogale.fr 

France 

Focal Dimensions Ltd 

Stand N°7 

www.nanotechsys.com 

USA 

Harmonic Drive AG 

Stand N°5 

www.harmonicdrive.de 

Germany 

Heidenhain 

Stand N°18 

www.heidenhain.com 

Germany 

Hembrug 

Stand N°2 

www.hembrug.com 

The Netherlands 

IBS Precision Engineering 

Stand N°1 

www.ibspe.com 


Nano Corporation 

Stand N°8 

www.nanowave.co.jp 

Japan 

Philips Applied Technologies 

Stand N°11 

www.cft.philips.com 


Physik Instrumente GmbH 

Stand N°10 

www.pi.ws 

Germany 

Precitech Ultra Precision 

Stand N°23 

www.precitech.com 


Precision MicroDynamics 

Stand N°24 

www.pmdi.com 

Canada 


SIOS Meßtechnik GmbH 

Stand N°9 

www.sios.de 

Germany 

Solartron Metrology 

Stand N°22 

www.solartronmetrology.com 

UK 

Sony Manufacturing System 

Stand N°6 

www.sonysms.de 

Germany 

Taylor Hobson Precision 

Stand N°16 

www.taylor-hobson.com 

UK 

Queensgate Instruments Ltd. 

Stand N°4 

www.queensgate.com 

UK 

Savimex 

Stand N°21 

www.savimex-fr.com 

France 

Tecan Ltd 

Stand N°15 

www.tecan.co.uk 

UK 

Zygo LOTOriel 

Stand N°3 

www.zygolot.de 

Germany 

Symetrie 

Stand N°12 

www.symetrie.fr 

France 


International Scientific Committee 

The conference contributions were reviewed by : 

Dr S. Azcarate, Tekniker, Spain 

Dr.A .Bosseboeuf, IEF Orsay, France 

Prof. W. Brennen, TU Wien, Germany 

Prof. E. Brinksmeier, University of Bremen, Germany 

Prof. H. van Brussel, Katholieke Universiteit Leuven, Belgium 

Prof. S. Büttenbach, TU, Braunschweig, Germany 

Prof. G. Byrne, University of Dublin, Ireland 

Prof. A. Cappy, IEMN, Lille, France 

Dr. K. Carlisle, Lawrence Livermore Nat. Lab., USA 

Prof. D. Chetwynd, Warwick University, UK 

Prof.L. de Chiffre, TU, Denmark, Danemark 

Prof. J. Corbett, Cranfield University, UK 

Dr. J.S. Danel, CEA Grenoble, France 

Prof. G. Davies, Birmingham University, UK 

Dr. J. van Eijk, Philips Research, The Neederlands 

Prof. A. Frank, TU, Graz, Austria 

Dr. Y. Gao, Univ of Sc & Tech, Hong Kong, China 

Prof. R. Hocken, UNC Charlotte, USA 

Prof. S. W. Kim, Korea Ad. Inst of Sc. & Tech, Korea 

Dr. W. Knapp, Knapp Engineering Office, Swisserland 

Dr. L. Kudla, Warsaw University of Technology, Poland 

Prof. H. Kunzmann, PTB, Braunschweig, Germany 

Dr. R. Leach, NPL, Teddington, UK 

Dr. C. Le Grimellec, INSERM, Montpellier, France 

Prof. D.A. Lucca, Oklahoma State University, USA 

Prof. A. G. Mamalis, Nat. Techn. Univ. Athens, Greece 

Prof. T. Moriwaki, Kobe University, Japan 

Prof. T. Pfeifer, WZL, Aachen, Germany 

Prof. A. Slocum, Mass. Inst. of Technology, USA 

Dr. A. Spiewak, University Calgary, USA 

Prof. Y. Takeuchi, Osaka University, Japan 

Dr. P.Temple-Boyer, LAAS, Toulouse, France 

Dr. E.G. Thwaite, CSIRO-NML, Australia 

Prof. M. Weck, IPT - WZL, Aachen, Germany 

Prof. R. Whatmore, Cranfield University, UK 

Prof. G. Zhang, Tianjin University, China 


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