ISOLA IS410

High-T g and high temperature-resistant base materialIS410IS410 is based on a high-T g epoxysystem with a nominal glass transitiontemperature of 170 - 180 °C (DSC). Thisquality offers very high resistance toheat and chemical attack.IS410 is particularly well-suited for leadfreesoldering processes, which subjectmaterials to increasingly greater thermalstresses.Recommended Pressing ParametersHydraulic pressSpecial Propertiestemperature (°C)spec. pressure (bar)200200180190 °C temperature180(specification) → hold160for 105 minTransfer to160140cooling pressapp. 45 min14012012010010080806060404020 bar pressure (spec.)2020000 20 40 60 80 100 120 140 160 180 200time (min)• High T g value (DSC) of 170 - 180 °C• High temperature resistance;T 260 > 60 min, T 288 = 30 min(time to delamination)• High resistance to chemical attack• CAF-resistant*• Excellent resistance to heat shock(withstands six solder test repetitions10 s at 288 °C)• Completely cures without follow-uptempering* Conductive Anodic FilementTesting conditions:1000 hours at 85 °C/85% r.h./100 VApprovalUnderwriters’ Laboratories Inc.File-No. E41625Typical ApplicationsCircuit boards subjected to high thermalstresses in the form of process, dissipationand ambient heat, as well as printedcircuits requiring highly migration-resistantsubstrates.Raw MaterialsThe same types of E-glass-fabric areused as for our standard-FR-4-qualityDURAVER ® -E-CU quality 104.Typical copper foil thicknesses (18, 35,70 µm) correspond to IPC-4562, grade 3(HTE-quality). For laminates with asubstrate ≤ 0.1 mm VLP foils with HTEproperties are used. Laminates are onlyavailable with double sided coppercladdings.Supply forms and storageThe laminates are produced in standardsheet size: 1225 x 1070 mm warp.Prepregs are available with a standardwidth of approx. 1250 mm (locationoriented).Other sheet sizes and roll widthsavailable on request.ADARA presstemperature (°C)spec. pressure (bar)250200temperature2520150pressure (spec.)1510010505000 10 20 30 40 50 60 70 80 90 100 110 120time (min)Dielectric constant depending on frequencyand resin contentparameter: resin content Loss factor from 1– 10 GHz = 0.020 – 0.027D k4.24.140 %4.045 %3.93.83.73.652 %56 %60 %3.53.43.32 5 10f (GHz)