Introducing the New IntelÂ® UEFI Development Kit: Industry ...

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IP6 Networking• UEFI 2.3 network stackinfrastructure– SAN/Datacenter boot• TCP-based iSCSI• Cryptographic logon• Multi-path/fail-over– IPsec for end-to-end security– Supports US Governmentrequirements for IPV6 transitionhttp://www.antd.nist.gov/usgv6/usgv6-v1.pdf• Technology includes– IP4/6, UDP4/6, TCP4/6, DHCP4/6,VLAN, IPsec• Allows for concurrent networkapplications via design based uponMNP• Features dual stack: IP4, IP6, orboth– Evolution of network boot to IPV6• Defined in IETF RFC 597014US Government moving to IPV6 for equipment procurement
UEFI Driver Signing• Adds policy around UEFIand its 3 rd party imageextensibility– Admixture of OS loaders,apps, and drivers in system– Gives IT control around theseexecutables– Detects/prevents malware• Technology includes– Supports “known-good” and“known-bad” signaturedatabases– Policy-based updates to list– Rich signature types• SHA-1, SHA-256,RSA2048/SHA-1,RSA2048/SHA-256 &Authenticode*MS-DOS* HeaderPE Header OffsetPE HeaderSections DirectorySection #1Section #2….Sections #NDebug InformationCertificate #1Certificate #2…Certificate #3PE SignatureStandard HeaderOptional HeaderOptional DataDirectoryImage Data DirectoryIDD entry #1IDD entry #2IDD entry #3IDD entry #4IDD entryCertificate Table1515Extensible integrity architecture
Page 1 and 2: Introducing the New Intel ® UEFIDe
Page 3 and 4: Agenda• Latest UEFI specs release
Page 5 and 6: UEFI Platform InitializationOvervie
Page 7: Agenda• Latest UEFI specs release
Page 10 and 11: Intel ® UDK2010 Value PropositionO
Page 12 and 13: Packaging: Enabling Fast Delivery o
Page 16 and 17: UEFI User Identification• Facilit
Page 18 and 19: Intel ® UDK2010 Available ontianoc
Page 20 and 21: AgendaIBM Experience“Smarter Firm
Page 22 and 23: IBM UEFI Key Features and BenefitsK
Page 24 and 25: What We Look for in a Next Generati
Page 26 and 27: UDK2010 Customers & OEMBenefitsImpr
Page 28 and 29: IBM UDK2010 Value-Add in actionSyst
Page 30 and 31: EDKI vs. UDK2010 Features• EDKI C
Page 32 and 33: Agenda• Latest UEFI specs release
Page 34 and 35: Mission-Critical Customer Challenge
Page 36 and 37: What HP looks for in FirmwareHP Fir
Page 38 and 39: HP Contributions to EDK IIAn Early
Page 40 and 41: Summary• Intel ® UDK2010 meets t
Page 42 and 43: Intel ® UDK2010 Available ontianoc
Page 44 and 45: UEFI PLUGFEST in Taiwan Oct 12-15,
Page 46 and 47: Please Fill out theSession Evaluati
Page 48 and 49: Session Presentations - PDFsThe PDF
Page 50: Risk FactorsThe above statements an

Introducing the New IntelÂ® UEFI Development Kit: Industry ...

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