Introducing the New IntelÂ® UEFI Development Kit: Industry ...

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HP Contributions to EDK IIAn Early Adopter• Provided review/guidance that helped to refine EDKII to the present form• Provided multiple feedback on simplification• Recommended the use industry-standard toolsinstead of proprietary tools• Provided fixes of build tool bugs• Identified EDK II issues that arose when enablingcompiler optimization with the Intel C compiler.• Discovered multiple EDK II bugs− For example, a subtle design issue with the UEFI network stack thatleads to severe performance degradation on large systemsHP Contributions benefited the entire opensourcecommunity38Hewlett-Packard Company makes no warranty as to the accuracy or completeness of theforegoing material and hereby disclaims any responsibility therefor.
UEFI Transition RecommendationsDevelopment Challenge• Code development required large-scale source tree updates• Updates needed on average every 2-3 months• Expected in early adoption phaseUDK2010 addresses this challenge through code base maturity,packaging technology, and catching up with the latest specsDevelopers Recommendation• Pay close attention to the specifications/errata• Parallel versions for different spec versions• Maintain the infrastructure support and compatibility– Keep “deprecated” version of lib/include/PCD– Avoid changing build tools/lib/include/PCD• Proactively communicate when a bug is fixed39OEMs/IBVs Recommendation• Take advantage of parallel versions if available– Get small-scale source updates needed• Pull in the latest code at least every 2 months• Use EDK II package solution– Create vendor-specific modulesHewlett-Packard Company makes no warranty as to the accuracy or completeness of theforegoing material and hereby disclaims any responsibility therefor.
Page 1 and 2: Introducing the New Intel ® UEFIDe
Page 3 and 4: Agenda• Latest UEFI specs release
Page 5 and 6: UEFI Platform InitializationOvervie
Page 7: Agenda• Latest UEFI specs release
Page 10 and 11: Intel ® UDK2010 Value PropositionO
Page 12 and 13: Packaging: Enabling Fast Delivery o
Page 14 and 15: IP6 Networking• UEFI 2.3 network
Page 16 and 17: UEFI User Identification• Facilit
Page 18 and 19: Intel ® UDK2010 Available ontianoc
Page 20 and 21: AgendaIBM Experience“Smarter Firm
Page 22 and 23: IBM UEFI Key Features and BenefitsK
Page 24 and 25: What We Look for in a Next Generati
Page 26 and 27: UDK2010 Customers & OEMBenefitsImpr
Page 28 and 29: IBM UDK2010 Value-Add in actionSyst
Page 30 and 31: EDKI vs. UDK2010 Features• EDKI C
Page 32 and 33: Agenda• Latest UEFI specs release
Page 34 and 35: Mission-Critical Customer Challenge
Page 36 and 37: What HP looks for in FirmwareHP Fir
Page 40 and 41: Summary• Intel ® UDK2010 meets t
Page 42 and 43: Intel ® UDK2010 Available ontianoc
Page 44 and 45: UEFI PLUGFEST in Taiwan Oct 12-15,
Page 46 and 47: Please Fill out theSession Evaluati
Page 48 and 49: Session Presentations - PDFsThe PDF
Page 50: Risk FactorsThe above statements an

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