Radiation-Hardened (RH) Products for Powering FPGAs
Radiation-Hardened (RH) Products for Powering FPGAs
Radiation-Hardened (RH) Products for Powering FPGAs
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Ø LTC planning to release Class V SMDs by Q1CY12Ø LTC Technology/Quality Con<strong>for</strong>mance Inspections includes:q Group B subgroups 1- 4 plus 6 <strong>for</strong> each assembly lotq Group B/2 and B/3 <strong>for</strong> each inspection lotq Group B/5 <strong>for</strong> each wafer lot<strong>RH</strong>A Class V vs. LTC <strong>RH</strong> Flowq Subgroups are per MIL-STD-883 Test Method 5004 <strong>for</strong> Class S screening and TM5005<strong>for</strong> QCI/TCI/Qualification (Group B Class S).Ø LTC does not use Si3N4 [silicon nitride] top-side passivation on any <strong>RH</strong>offerings to date. Such passivation encourages radiation-induced trappedcharges which reduces hardness.Ø LTC uses a low temperature chemical deposited oxide, otherwise knownas ‘silox’ or ‘silicon dioxide’ as a non-scratch-proof top-side barrier.Ø 4,000 angstroms glassivation and no Silicon Nitride versus minimum6,000 angstroms and 2K Silicon Nitride as per MIL-PRF-38535 AppendixA and MIL-STD-883 TM5007 (Wafer Lot Acceptance)q LTC per<strong>for</strong>ms Glassivation as an integral part of its wafer fabrication process
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