Troubleshooting the Stencil Printing Process - SMTA

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<strong>Stencil</strong>Apertures: Right Size & Shape, SmoothWalls, Uniform Thickness, Free of Debrisor Solder PastePositional AccuracyN O T T O S C A L E
Solder PasteFormulation, Rheology, ReleaseCharacteristics, Particle Size, PasteTemperature, Ambient Temperature& HumidityN O T T O S C A L E
Page 1 and 2: Troubleshooting the StencilPrinting
Page 3 and 4: Solder Paste Properties• Solder p
Page 5: PWBPads: Flat, RightSize, Free of D
Page 9 and 10: A Good Mechanical Setup isEssential
Page 11 and 12: Stencil SeparationIf printer has st
Page 13 and 14: Results16-mil pitch QFP
Page 15 and 16: Preventing The Bad and The Uglywith
Page 17 and 18: PSI and Solder Paste“Chops” eac
Page 19 and 20: Process ControlWith Automatic Solde
Page 21 and 22: Still Making Defects?Check the easi
Page 23 and 24: Check the ToolingNext: Remove the s
Page 25 and 26: Didn’t find the Root Cause?Time t
Page 27 and 28: Solder Bridges
Page 29 and 30: Poor Print DefinitionPeaks and “D
Page 31 and 32: InsufficientsPoor Aperture FillBonu
Page 33 and 34: InsufficientsPoor Aperture Release
Page 35 and 36: Poor Gasketing
Page 37 and 38: Poor Alignment
Page 39 and 40: Summary - Troubleshooting• Unders
Page 41: Questions?Contact Chrys at:chrys@sh

Troubleshooting the Stencil Printing Process - SMTA

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