DAC08 Data Sheet

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DAC0816-Lead Dual-In-Line Package(Q and P Suffix)PIN CONNECTIONS16-Lead SO(S Suffix)DAC08RC/883 20-Lead LCC(RC Suffix)V LCI OUTV–123161514COMPENSATIONV REF (–)V REF (+)V+V REF (+)V REF (–)123161514B8 LSBB7B6I OUTV LCNC321COMPV REF (–)20 19I OUT413V+COMP413B5V– 418 V REF (+)MSB B1B2B3567121110B8 LSBB7B6V LCI OUTV–567121110B4B3B2I OUTNCMSB B1B2567817161514V+NCB8 LSBB7B489B5I OUT89 B1 MSB9 10 11 12 13B3B4NCB5B6NC = NO CONNECTDICE CHARACTERISTICS(125°C Tested Dice Available)1. V LC2. I OUT3. V–4. I OUT5. BIT 1 (MSB)6. BIT 27. BIT 38. BIT 49. BIT 510. BIT 611. BIT 712. BIT 8 (LSB)13. V+14. V REF (+)15. V REF (–)16. COMPDIE SIZE 0.087 0.063 inch, 5,270 sq. mils(2.209 1.60 mm, 3.54 sq. mm)–4–REV. B
WAFER TEST LIMITS(@ V S = 15 V, I REF = 2.0 mA; T A = 25C, unless otherwise noted. Output characteristics apply to bothI OUT and I OUT .)DAC08N DAC08G DAC08GRParameter Symbol Conditions Limit Limit Limit UnitDAC08Resolution 8 8 8 Bits minMonotonicity 8 8 8 Bits minNonlinearity NL ± 0.1 ± 0.19 ±0.39 % FS maxOutput Voltage V OC Full-Scale Current +18 +18 +18 V maxCompliance Change < 1/2 LSB –10 –10 –10 V minFull-Scale Current I FS4 or V REF = 10.000 V 2.04 2.04 2.04 mA maxI FS2 R 14 , R 15 = 5.000 kΩ 1.94 1.94 1.94 mA minFull-Scale Symmetry I FSS ± 8 ± 8 ±16 µA maxZero-Scale Current I ZS 2 4 4 µA maxOutput Current Range I FS1 or V– = –10 V,V REF = +15 V 2.1 2.1 2.1 mA minV– = –12 V,I FS2 V REF = +25 V 4.2 4.2 4.2 mA minR 14 , R 15 = 5.000 kΩLogic Input “0” V IL 0.8 0.8 0.8 V maxLogic Input “1” V IH 2 2 2 V minLogic Input CurrentV LC = 0 VLogic “0” I IL V IN = –10 V to +0.8 V ± 10 ± 10 ±10 µA maxLogic “1” I IH V IN = +2.0 V to +18 V ± 10 ± 10 ±10 µA maxLogic Input Swing V IS V– = –15 V +18 +18 +18 V max–10 –10 –10 V minReference Bias Current I 15 –3 –3 –3 µA maxPower Supply PSSI FS+ V+ = +4.5 V to +18 V 0.01 0.01 0.01 % FS/% V maxSensitivity PSSI FS– V– = –4.5 V to –18 VI REF = 1.0 mAPower Supply Current I+ V S = ± 15 V 3.8 3.8 3.8 mA maxI REF ≤ 2.0 mA –7.8 –7.8 –7.8 µA maxPower Dissipation P D V S = ± 15 V 174 174 174 mW maxI REF ≤ 2.0 mANOTEElectrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteedfor standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.REV. B–5–
Page 6 and 7: DAC08+V REF0VR INTYPICAL VALUES:R I
Page 8 and 9: DAC08POWER SUPPLY CURRENT - mA10987
Page 10 and 11: DAC08APPLICATION INFORMATIONREFEREN
Page 12: DAC08OUTLINE DIMENSIONSDimensions s

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