Tech_020711.qxd - Raytheon

the finished product. Future generations of
military solid-state radars will use wide
band-gap semiconductors, and RRFC is one
of the industry leaders in developing these
devices and materials. The resultant systems
will be capable of enormous new potential
when this technology matures.
Through the Advanced Products Center
(APC), we have capitalized to ensure that
our supply of MMICs and modules will not
bottleneck the programs to which they are
supplied. This highly integrated module
manufacturing facility makes use of robotic
equipment, automated handlers, and highspeed
microwave test equipment to ensure
high-volume production. Module hardware
is assembled and tested using batch
processes to achieve the highest throughput
with the minimum labor cost.
Design engineers across our one company
are learning to utilize the production manufacturing
capabilities of both the Andover
and the Dallas facilities as designs unfold
Raytheon’s semiconductor technology
is being used in solid-state upgrades on board
Navy ships to replace aging
tube-based systems.
for the next-generation antennas and tube
replacements in phased arrays and other
transmitting hardware.
Advanced semiconductors form the core of
low-cost, high-performance modules for
use in tomorrow’s systems. For example,
today we are building PHEMT T/R modules
with nearly double the performance when
compared to prior MESFET modules, and all
of this is being accomplished at nearly half
the selling price to the customer. Within
RRFC we have worked to provide higher
levels of integration in MMIC chip design.
This allows T/R modules to be built with
fewer components and less direct assembly
and test labor. The most successful chip of
this type so far is the THAAD multi-function
chip, which combines a 7-bit phase shifter;
6-bit attenuator; amplifier gain stages for
transmit and receive; T/R switching; and
digital serial-to-parallel interface circuitry.
The enabling technologies for advanced T/R
modules will include both semiconductor
Key to cost-effective solid-state products
is mutual coexistence of defense and
commercial development and manufacturing.
and microelectronics manufacturing innovations.
Advanced semiconductor technologies
including MHEMT, E/D-PHEMT, and
wide band-gap semiconductors will allow
for higher device power output, higher system
efficiency, better noise figure, and
more functionality at the element level. All
of these contribute to far more capable systems.
These become enablers for multifunction,
wideband, shared beam apertures
that will dominate the future. The push for
“module-less“ array panels will necessitate
building multiple elements-worth of electronics
into a single integrated assembly.
Some of these concepts are now in
exploratory development phases and will
pave the way toward more productized
configurations.
Demonstration of low-cost alternatives
for today’s T/R module functionality
will secure the future for Raytheon
in solid-state array technology.
– Mike Borkowski
spring 2002 13