COMSOL CONFERENCE

Seeding Distribution in the
Channel of a Cell Culture Vessel
J. Brcka 1 , K. Kagawa 2 , S. Ozaki 2 , Y. Oshima 3 ,
G. Zhang 4
1
Tokyo Electron U.S. Holdings, Inc.,
Austin, TX, USA
2
Tokyo Electron, Technology Development
Center, Chuo-ku, Kobe, Japan
3
Tokyo Electron Europe LTD, Stem Cell
Technology Centre, Stevenage, United
Kingdom
4
Clemson University, Rhodes Engineering
42
Research Center, Clemson, SC, USA
Simulation of a Buckled
Cantilever Plate with Thermal
Bimorph Actuators
A. Arevalo 1 , D. Conchouso 1 , D. Castro 1 ,
M. Diaz 2 , I. G. Foulds 3
1
CEMSE Division, King Abdullah University of
Science and Technology, Thuwal, Saudi Arabia
2
Physical Sciences and Engineering Division,
King Abdullah University of Science and
Technology, Thuwal, Saudi Arabia
3
University of British Columbia,
Vancouver, BC, Canada
Simulation of a Dual Axis MEMS
Seismometer For Building
Monitoring System
M. A. Shah 1 , F. Iqbal 1 , B. L. Lee 1
1
Korea University of Technology and
Education, Cheonan, Chungcheong,
South Korea
Simulation of the
Cooling and Phase Change
of a Melt-Cast Explosive
W. Sanhye 1 , C. Dubois 1 , P. Pelletier 2 , I. Laroche 2
1
Department of Chemical Engineering,
École Polytechnique de Montréal,
Montréal, QC, Canada
2
General Dynamics Ordnance
and Tactical Systems-Canada Inc.,
Repentigny, QC, Canada
Simulation of the Impedance
Response of Thin Films as a
Function of Film Conductivity and
Thickness
Y. Jin 1 , S. Kumar 1 , R. A. Gerhardt 1
1
School of Materials Science and Engineering,
Georgia Institute of Technology, Atlanta, GA, USA