Package Thermal Characterization
Analysis Tech Inc. is a designer, manufacturer and global supplier of electronic instruments associated with reliability testing of electronic packaging. Founded in 1983 and headquartered ten miles north of Boston, Massachusetts, Analysis Tech has developed instruments that have traced the evolution of electronic packaging technology.
Analysis Tech Inc. is a designer, manufacturer and global supplier of electronic instruments associated with reliability testing of electronic packaging. Founded in 1983 and headquartered ten miles north of Boston, Massachusetts, Analysis Tech has developed instruments that have traced the evolution of electronic packaging technology.
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The Reference Sample Set provides a collection of prepared, pre-tested reference samples spanning<br />
the appropriate range of thermal impedances. These reference samples can be tested at any time to<br />
confirm the accuracy and consistency of the TIM Tester operation. Reference samples are tagged<br />
with the sample's impedance, tolerance, and specified test pressure. The included documentation<br />
provides certified traceability to national laboratory standards. Reference standard samples<br />
provide an excellent and convenient means to maintain highest verification and confidence in the<br />
TIM Test results.<br />
Component <strong>Thermal</strong> Test-Lab Services<br />
Analysis Tech offers complete test-lab services for thermal characterization on customer-supplied<br />
components. All test services meet the requirements of JEDEC No. 51 Standards and MIL STD 750E<br />
and 883. All Analysis Tech thermal product capabilities are available for contract test service. Test<br />
results are reported in tabular and graphical formats with typical turnaround times of 1-2 weeks.<br />
Steady-state thermal resistance measurements, junction-to-ambient, junction-to-case, junction-toboard,<br />
psi jt, and junction-to-lead are available all devices types. In this regard, up to three different<br />
reference sites can be utilized per test. A complete range of fixturing and environmental conditions<br />
are available including still air, forced convection, liquid immersion, Rjc (junction-to-case, air or<br />
liquid cooled, and Rjb (junction-to-board).<br />
Die attachment evaluation is available for large or small lots. The text-file data and histogram plots<br />
are provided. Data for serialized lots are tagged with device serial numbers. Parts tested can also be<br />
pass/fail-screened or bin-sorted and bagged according to die attachment quality.<br />
Heating characterization and impedance simulation test services are available for comprehensive<br />
evaluation of transient thermal behavior. Transient thermal RC models are derived from the<br />
transient thermal response of the device under test and can provide insight into the internal<br />
thermal performance of the device. Plots for time-constant spectrum and structure function are<br />
also provided. Device impedance plots as a function of heating-cycle-frequency and duty-factor for<br />
square waves or arbitrary waveforms are also offered.<br />
For more information please visit<br />
http://www.analysistech.com
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