IRC Cooperation Forum Micronova Technology ... - VIA electronic
IRC Cooperation Forum Micronova Technology ... - VIA electronic
IRC Cooperation Forum Micronova Technology ... - VIA electronic
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New solutions of integration technology with multilayer ceramics<br />
The Match-X semistandard integration approach<br />
Match-X 3D Packaging<br />
Match-X Cover<br />
Land Grid Array<br />
Wire Bond Loop<br />
Die<br />
Ball Grid Array<br />
Match-X Carrier<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
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