IRC Cooperation Forum Micronova Technology ... - VIA electronic
IRC Cooperation Forum Micronova Technology ... - VIA electronic
IRC Cooperation Forum Micronova Technology ... - VIA electronic
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New solutions of integration technology with<br />
multilayer ceramics ltcc<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
MicroNano<strong>Technology</strong> network Finland ––<br />
Interdisciplinary<br />
Optics and photonics network Thuringia<br />
<strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki June 2005<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
New solutions of integration technology with multilayer ceramics<br />
Overview<br />
•Company Profile<br />
•The LTCC Process<br />
•LTCC vs PCB<br />
•Packaging needs<br />
•The Match-X modular approach<br />
•Customized 3d (Mems) packages<br />
•LTCC integrated functions<br />
•New R&D Results<br />
•Outlook<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
New solutions of integration technology with multilayer ceramics<br />
Company Profile: Ownership structure<br />
• Microtel S.P.A. 26%<br />
Mailand<br />
• SIEGERT TFT 20%<br />
Hermsdorf<br />
• Thales Micro<strong>electronic</strong> 20%<br />
Rennes<br />
• Franz Bechtold 26%<br />
• Albert Siegert 8%<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
• Sales Partner<br />
Italy/South Europe<br />
• <strong>Technology</strong>partner<br />
Thinfilm on LTCC<br />
• Former Manufacturing Partner<br />
High Volume LTCC<br />
• Companyfounder<br />
• Investor
New solutions of integration technology with multilayer ceramics<br />
Company profile: Financial datas<br />
• Stock Capital 300.000 €<br />
• Payed 100%<br />
• Employees 04 14<br />
• Turnnover 04 900.000 €<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
New solutions of integration technology with multilayer ceramics<br />
Company Profile: History<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Employees Turnover K€<br />
1997 Foundation<br />
1998 7 300<br />
1999 10 500<br />
2000 14 750<br />
2001 15 1050<br />
2002 14 850<br />
2003 13 800<br />
2004 14 900
New solutions of integration technology with multilayer ceramics<br />
Company Profile: Customers<br />
• Medical, Italy<br />
• Siegert <strong>electronic</strong>,<br />
Germany<br />
• Lynx, Israel<br />
• Thales, France<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
• Ketek, Germany<br />
• IMST, Germany<br />
• CEA Leti, France<br />
• IMEG, Sweden<br />
• MPI, Germany
New solutions of integration technology with multilayer ceramics<br />
Company profile: Services<br />
• advanced CAD design<br />
• flexible manufacturing line, all lot sizes<br />
• installed capacity > 1 M sqi of circuits per year<br />
• high precision and reliable cleanroom processing<br />
• sophisticated optical and mechanical measurement<br />
• experience with different material systems<br />
• R&D capabilities for materials and elecronics through network<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
New solutions of integration technology with multilayer ceramics<br />
Company Profile: customer`s Products<br />
• multilayer ceramic boards<br />
• complex 3D packages<br />
• multichip modules<br />
• substrates for direct bonded thinfilm<br />
• ceramic multilayer components<br />
• rf modules<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
New solutions of integration technology with multilayer ceramics<br />
The LTCC Process<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Unsintered ceramic foils (ceramic) are<br />
mechanical shaped.<br />
Vertical conductive paths (Vias) are punched as<br />
very small holes and filled with metal paste<br />
afterwards.<br />
The lateral conductive pattern is screenprinted<br />
in advanced thickfilm technology.<br />
The seperate layers are positioned accurately<br />
and laminated together by hot pressing.<br />
This laminate is sintered in a singulare process<br />
(cofiring) at low temperatures ( low temperature)<br />
at about 900°C to the completely wired<br />
substrate or package.
New solutions of integration technology with multilayer ceramics<br />
Advantages and disadvantages vs. PCB<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
+ Thermal conductivity<br />
+ Reliability<br />
+ Life time<br />
+ Integration density<br />
+ Passive integration<br />
+ Insulation resistance<br />
+ RF stability<br />
- Costs<br />
- Lead times<br />
- Electrical conductivity<br />
- Line definition
New solutions of integration technology with multilayer ceramics<br />
Specific solution for high volumes in the automotive busines<br />
Match-X modular solutions for large variety and medium volumes<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Pressure Sensor &<br />
Temperature Sensor<br />
A/D-Converter<br />
Microcontroller<br />
Program & Data<br />
Memeory<br />
Bus Interface<br />
Auxiliary Functions<br />
Level 2 Package<br />
Plug (satisfies DIN 43650)
New solutions of integration technology with multilayer ceramics<br />
The Match-X semistandard integration approach<br />
Match-X 3D Packaging<br />
Match-X Cover<br />
Land Grid Array<br />
Wire Bond Loop<br />
Die<br />
Ball Grid Array<br />
Match-X Carrier<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Bus Vias<br />
Internal Rew iring Layer<br />
1<br />
16<br />
64<br />
1 7<br />
8 15<br />
16<br />
24<br />
32<br />
40<br />
48<br />
56 63<br />
17 32<br />
49<br />
48<br />
33
New solutions of integration technology with multilayer ceramics<br />
Match-X Modules: DSP - Unit<br />
Double sided assambly<br />
inside the cavity<br />
Cavity hight: 3.2mm<br />
Frame<br />
Can-Interface<br />
RAM<br />
RS232-Interface<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Quarz<br />
DSP<br />
Cover<br />
with<br />
LGA<br />
SMD<br />
Bottom with BGA<br />
• high integration density<br />
• good thermal management<br />
and heat dissipation<br />
• low stress BGA<br />
interconnection by Si<br />
matched TCE<br />
• high reliability under<br />
harsh environment
New solutions of integration technology with multilayer ceramics<br />
Match-X Modules: BGA 63 pressure sensors<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
And the physical<br />
realisation
New solutions of integration technology with multilayer ceramics<br />
Match-X Modules: BGA 63 pressure sensors<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
The ltcc package is concept is following<br />
the idea of modularity itself:<br />
Absolute pressure Relative pressure differential pressure<br />
•Available for different sensitivities (Chipsizes)<br />
•µProcessor on the backside close to the system optional<br />
• Compatible to Match-X-Modules
New solutions of integration technology with multilayer ceramics<br />
Match-X Modules: MORES Sensor<br />
optical<br />
signal<br />
opt. functional glass<br />
sensor chip<br />
rewiring to MATCH-X- BGA 63<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
• Front-end-Sensor with backside<br />
contacts<br />
• MATCH-X-compatible<br />
• 12.5mm/BGA 63 Package<br />
• Several optical sensor application<br />
thin film contacts<br />
solder<br />
contact<br />
vias
New solutions of integration technology with multilayer ceramics<br />
Customised 3d Packages<br />
6mm sidewalls<br />
Integrated resistors<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
80mm,thermal vias<br />
DSP: lid and package<br />
3d TO package<br />
Integrated gas channel<br />
Feed trough insulator
New solutions of integration technology with multilayer ceramics<br />
Integrated functions<br />
L/C Bandpass<br />
LC phase shifter<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Power transformer<br />
Integrated optical device<br />
Integrated resistor<br />
Integrated fluidics
New solutions of integration technology with multilayer ceramics<br />
New developments, available in lab scale<br />
Si Matched LTCC<br />
for Wafer level<br />
packaging<br />
ferrite ltcc<br />
technology for<br />
inductivites<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Lead frame and<br />
heat sink<br />
attachement<br />
Fine pitch<br />
technology for<br />
HF applications<br />
High performance<br />
ltcc technology<br />
for integration of<br />
optical devices<br />
Direct bonded<br />
thinfilm on ltcc
New solutions of integration technology with multilayer ceramics<br />
New developments in process<br />
Integrated<br />
microembossing<br />
technology for high<br />
currency<br />
Monolithic Integration of<br />
R-C-L Components<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Integrated<br />
Microreactors<br />
Integrated Fuel Cell<br />
High precision 0shrinkage<br />
technology<br />
Integration of Sensors<br />
in Thickfilm and<br />
Thinfilm
New solutions of integration technology with multilayer ceramics<br />
News: 0-Shrinkage<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Pressure assisted sintering<br />
Material DuPont 951<br />
Cavities, postfire laser cut<br />
Blind holes, postfire laser drilled<br />
Vias 90µm<br />
Interconnect: Thinfilm
New solutions of integration technology with multilayer ceramics<br />
News: Anodic bondable LTCC<br />
Materialsystem development in Hermsdorf<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
.<br />
TCE matched to Si<br />
Chemistry designed for<br />
anodic bonding<br />
Lapped and polished surface
New solutions of integration technology with multilayer ceramics<br />
News: high permeability ferritic tapes<br />
Materialsystem development in Hermsdorf<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
SMT High Performance Inductivities<br />
16 Layers, Metallisation: Au, AgPd<br />
Induktivities: 0,2 to 2 mH
New solutions of integration technology with multilayer ceramics<br />
News: monolithic integrated capacitors<br />
Teststructures for RF Applications (Phase shifter)<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Basic Material: DuPont 951<br />
Metallisation: Au<br />
High K Tape ESL 41210<br />
K=100<br />
Conductorwidth: 125 µm<br />
Conductordistance: 70µm
New solutions of integration technology with multilayer ceramics<br />
News: Integrated fluidic structures<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Fluidic Channel<br />
0,1 x 0,1 mm<br />
Fluidic Channel<br />
0,2 x 0,2 mm<br />
Fluidic Channel<br />
0,4 x 0,6 mm<br />
Sensorpackage<br />
with integrated<br />
fluidic channel
New solutions of integration technology with multilayer ceramics<br />
News: integrated fluidic structures<br />
Bio-Sensor Module<br />
with integrated fluidic<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH<br />
Fluidik Chip with integrated<br />
High voltage conductors<br />
Interconnection to<br />
100µm channel
New solutions of integration technology with multilayer ceramics<br />
Outlook<br />
• Superior reliability performance<br />
• High integration capability with new functions<br />
• New performance with the nanomaterial approach<br />
• High innovation potential for new integration solutions<br />
• High innovation speed by networking<br />
• Sustainable growth potential<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
New solutions of integration technology with multilayer ceramics<br />
The End<br />
Parts of the work presented were carried out in the frame of the joint<br />
research projects 20Ghz+, Multifer, Mabogos, Match-Druck, Imodas<br />
and AHRMS, supported by the Ministery of Reasearch and <strong>Technology</strong><br />
in Thuringia, The German Ministery of Education and Research and the<br />
European Commission<br />
<strong>IRC</strong> <strong>Cooperation</strong> <strong>Forum</strong><br />
<strong>Micronova</strong> <strong>Technology</strong> Center Helsinki<br />
Franz Bechtold, <strong>VIA</strong> <strong>electronic</strong> GmbH
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