Thin Wafer Market Growth Forecast to 2017-2022

Thin Wafer Market to See High Growth in Forecast
Period due to high Demand from Semiconductor Industry
by 2022
Global Thin Wafer Market report includes in-depth analysis of
industry. Growing need of thin wafer semiconductors, rising
technological advancements, and growing demand for material
savings projected to drive the market over the next seven years.
Thin wafer market is expected to witness significant growth over the forecast period owing to
increasing demand for electronic devices with high on performance, low on cost and small in size.
Rising demand for semiconductor devices in end use industries such as consumer electronics,
automotive and telecommunication, increasing adoption of portable devices, and growing demand
of 300mm wafer are few other factors anticipated to propel the market growth over the next seven
years.
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A wafer is a substrate or slice of semiconductor material, which is mainly used in photovoltaic solar
cells and in electronics for the fabrication of integrated circuits. It undergoes several micro fabrication
process steps such as ion implantation or doping, deposition of various materials, etching and
photolithographic patterning. Thin/Ultra-thin wafers have various industrial uses such as advanced
packaging applications (TSV, interposers, and Fan out WLP), LEDs, power devices, CIS, memory, and
RF devices. The growing demand for aforementioned uses has anticipated the market to witness
significant growth by 2022.
Growing need of thin wafer semiconductors, rising technological advancements, and growing
demand for material savings projected to drive the market over the next seven years. However, thin
wafer’s high volatility and susceptibility to damage under stress make it anticipate slightly low growth
over the next seven years. The primary reason for the market to expect aforementioned challenges
is owing to growing demand of ultra-thin wafer thus making them prone to damage under cracking.
The companies have formed a support system which through continuous R&D endeavors is working
to develop a stronger thin wafer dies. These developed dies are expected to assist in reducing the
thickness of packaged dies for mobile phones and in providing the efficient thermal management to
electronic devices.
Thin wafers market is anticipated to report more than 50% of the overall semiconductor industry
demand over the next seven years primarily due to growing awareness and availability of ultra-thin
wafers ranging from 200µm to 100µm. The industry constitutes vendors that cater to the everevolving
needs of memory disks, wireless devices, and consumer electronics. The market is also
expected to see high growth rate owing to increasing R&D endeavors in developing super-thin & flat
wafer ranging from 100µm to 25µm, and thus obsoleting the traditionally used silicon wafer with
thickness of about 500mm
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The market is segmented by technology into wafer dicing, dry polishing, handling and thinning. The
market is also segmented by application into power devices, advanced packaging of 3D TSV LEDs,
CMOS image sensors, memory & logic and MEMS. The market further segmentation can be done on
the basis of size into 125mm, 200mm, and 300mm. The 300mm wafer is projected to witness highest
growth among other segments majorly owing to its widely acceptance and usage in semiconductor
manufacturing industry. The primary reason for it to be widely used in the semiconductor devices is

ecause it allows manufacturers to produce a huge number of devices in a single batch. Thus,
companies have a high production capacity of 300mm wafer among all other available sizes.
Asia-Pacific is expected to account for largest market share over the forecast period owing to growing
disposable income, rising economic development, increasing demand for smartphones and other
electronic devices. India, China, South Korea, and Taiwan are projected to account for fastest growth
in the region primarily due to rising use of thin wafers in the semiconductor industry, and growing
manufacturing industries that are focused on producing thin/ultra-thin wafers.
North America and Europe are anticipated to witness significant growth over the next seven years
owing to growing demand for thin wafers in end-use industries and rising awareness of its varied
applications. Particularly the US, Germany, France, the UK, and Italy are expected to account for
highest growth in the region primarily due to growing demand for portable devices and rising
consumer electronic industry.The Middle East & Africa is projected to see considerable growth by
2022 majorly due to increasing urbanization, globalization, and industrialization. The market has huge
potential in this region primarily owing to growing economic development, and rising purchasing
power parity.
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The key vendors in the market include 3M, ABB, Accretech, AIT and All Via. Few other players in the
market include Shin-Etsu Chemical Co. (Japan), LG Siltronic, Inc. (South Korea), Sumco Corporation
(Japan), Siltronic AG (Germany), SUSS Microtec AG (Germany), SunEdison Semiconductor Ltd. (U.S.),
Brewer Science, Inc. (U.S.), DISCO Corporation (Japan), Lintec Corporation (Japan), Nissan Chemical
Corporation (Japan), Applied Materials Inc. (U.S.), EV Group (U.S.), Synova (Switzerland), and Ulvac
GmbH (Germany).
Market Segment:
This report studies Thin Wafer in Global market, especially in North America, Europe, China,
Japan, Korea and Taiwan, focuses on top manufacturers in global market, with capacity,
production, price, revenue and market share for each manufacturer, covering
• LG Siltronic
• Shin-Etsu Chemical
• Siltronic AG

• SUMCO Corporation
• SunEdision Semiconductor
• SUSS MicroTec AG
• Lintec Corporation
• DISCO Corporation
• 3M
• Applied Materials
• Nissan Chemical Corporation
• Synova
• EV Group
• Brewer Science
• Ulvac
Market Segment by Regions, this report splits Global into several key Regions, with production,
consumption, revenue, market share and growth rate of Thin Wafer in these regions, from 2012
to 2022 (forecast), like
North America
• Europe
• China
• Japan
• Korea
• Taiwan
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Split by product type, with production, revenue, price, market share and growth rate of each type,
can be divided into
• 125mm
• 200mm
• 300mm
Split by application, this report focuses on consumption, market share and growth rate of Thin
Wafer in each application, can be divided into
• MEMS

• CMOS Image Sensors
• Memory
• RF Devices
• LEDs
• Interposers
• Logic
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