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FinFET Technology Market Forecast

FinFET technology market is used by various end users such as automotive, smart phones, wearables, computers and tablets, high-end networks, and others. Smart phones segment is the highest revenue generating segment among all the end users of FinFET technology owing to a high demand of smartphones from consumers for enhanced processors which improves day-to-day functioning. The wearables segment is expected to grow at the highest rate during the forecast period because of changing needs of the consumers for smart watches which can assist in tracking and monitoring human body for day to day functioning.

FinFET technology market is used by various end users such as automotive, smart phones, wearables, computers and tablets, high-end networks, and others. Smart phones segment is the highest revenue generating segment among all the end users of FinFET technology owing to a high demand of smartphones from consumers for enhanced processors which improves day-to-day functioning. The wearables segment is expected to grow at the highest rate during the forecast period because of changing needs of the consumers for smart watches which can assist in tracking and monitoring human body for day to day functioning.

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Table of Contents<br />

MARKET DYNAMICS<br />

COMPETITIVE INSIGHTS<br />

INDUSTRY ANALYSIS<br />

GLOBAL FINFET TECHNOLOGY<br />

MARKET (BY TECHNOLOGY NODE)<br />

GLOBAL FINFET TECHNOLOGY<br />

MARKET (BY TYPE)<br />

GLOBAL FINFET TECHNOLOGY<br />

MARKET (BY PRODUCT)<br />

GLOBAL FINFET TECHNOLOGY<br />

MARKET (BY END USER)<br />

GLOBAL FINFET TECHNOLOGY<br />

MARKET (BY REGION)<br />

• <strong>Market</strong> Drivers<br />

• <strong>Market</strong> Restraints<br />

• <strong>Market</strong> Opportunities<br />

• Key Strategies & Developments<br />

• Leading Player Analysis<br />

• Industry <strong>Technology</strong> trends<br />

• Changes in Gate Material<br />

• Changes in Gate Structure<br />

• Extreme Ultra Violet (EUV) Lithography<br />

• Change in Wafer Dimensions<br />

• Moore’s Law for Producing Various<br />

<strong>FinFET</strong> Technologies<br />

• Supply Chain Analysis<br />

• Patent Analysis<br />

• Heat Map<br />

• Assumptions and Limitations<br />

• Introduction<br />

• 7nm <strong>FinFET</strong> <strong>Technology</strong> Node<br />

• 10nm <strong>FinFET</strong> <strong>Technology</strong> Node<br />

• 14nm <strong>FinFET</strong> <strong>Technology</strong> Node<br />

• 16nm <strong>FinFET</strong> <strong>Technology</strong> Node<br />

• 22nm <strong>FinFET</strong> <strong>Technology</strong> Node<br />

• Introduction<br />

• Silicon on Insulator (SOI) <strong>FinFET</strong><br />

• Bulk <strong>FinFET</strong><br />

• Introduction<br />

• Central Processing Unit (CPU)<br />

• System-on-Chip (SoC)<br />

• Field-Programmable Gate<br />

• Graphics Processing Unit (GPU)<br />

• Microcontroller Unit (MCU)<br />

• Network Processors<br />

• Introduction<br />

• Smartphones<br />

• Computers and Tablets<br />

• Wearables<br />

• Automotive<br />

• High End Networks<br />

• Overview<br />

• North America<br />

• Asia Pacific<br />

• Europe<br />

• Rest-of-the-World<br />

SCOPE &<br />

RESEARCH<br />

METHODOLOGY<br />

• Scope of the Report<br />

• <strong>FinFET</strong> <strong>Technology</strong><br />

<strong>Market</strong> Research<br />

Methodology<br />

COMPANY<br />

PROFILES<br />

• Overview<br />

• Taiwan Semiconductor<br />

Manufacturing Company<br />

Limited (TSMC)<br />

• Intel Corporation<br />

• Samsung Electronics<br />

Co., Ltd.<br />

• Semiconductor<br />

Manufacturing<br />

International Corporation<br />

(SMIC)<br />

• United Microelectronic<br />

Corporation (UMC)<br />

• GLOBALFOUNDRIES<br />

Inc.<br />

• Qualcomm Incorporated<br />

• MediaTek Inc.<br />

• Xilinx Inc.<br />

• Nvidia Corporation<br />

VIEW COMPLETE TABLE OF CONTENT<br />

sales@bisresearch.com | www.bisresearch.com

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