Wafer Inspection Equipment Market
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competition has led to increased demands for better quality and least defects in the<br />
semiconductor devices. Moreover, increasing demands for high performance chips for mission<br />
critical applications in industries and R&D activities will present considerable growth<br />
opportunities for the wafer inspection equipment market through the forecast period.<br />
IoT, and digitization are the major trends expected to transform the globe, which would require<br />
semiconductor technologies as the basis of their framework. Smart connected TVs, vehicle<br />
automation, kitchen automation, smart city, smart grids, are among the many such IoT concepts<br />
that are expected to gain traction over the next few years. This will increase demand for the<br />
electronic product manufacturing, which will in turn fuel the wafer inspection equipment<br />
market growth.<br />
<strong>Wafer</strong> <strong>Inspection</strong> <strong>Equipment</strong> <strong>Market</strong> Taxonomy<br />
On the basis of technology, the global wafer inspection equipment market is classified into:<br />
<br />
<br />
E-beam<br />
Optical<br />
On the basis of wafer type, the global wafer inspection equipment market is classified into:<br />
<br />
<br />
Unpatterned wafer<br />
Patterned wafer<br />
On the basis of end user, the global wafer inspection equipment market is classified into:<br />
<br />
<br />
<br />
Integrated device manufacturers<br />
Memory manufacturers<br />
Foundries<br />
Read more on research study @<br />
https://www.coherentmarketinsights.com/ongoing-insight/wafer-inspection-equipment-market-637<br />
Advent of 3D finFETs, NAND and advanced DRAMs technologies are expected to present<br />
considerable growth challenge to the industry growth<br />
Optical and E-beam are complementary technologies that perform distinct operations in the<br />
workflow. optical has fast throughputs and finds great applications in the end use. On the other<br />
hand E-beam helps in detection of smallest defects, however the throughputs are low. Owing