Advanced Packaging Market 2021: CAGR Value, Industry Share, Key Company Profiles, Type, Applications, Size, Trends and Forecast To 2030

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Advanced Packaging Market
“With rapid growth in advanced packaging market, specifically fan out wafer level packaging, along with increase in
demand for smartphone and devices and Internet of Things (IoT), advanced packaging suppliers are developing
process and ways to reduce the overall cost of advanced packaging and provide maximum operational efficiency.
During the recent times, advanced packaging is mainly used for high-end products and for applications related to
niche-market such as wafer and die production due to its high cost in its operation..”
Divyanshi Tewari
Lead Analyst, Semiconductor and Electronics at Allied Market Research
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Advanced Packaging Market
The advanced packaging market is steadily gaining traction, owing to rise in demand for enhanced technologies in
various industry verticals such as integration of IoT, AI, and surge in demand for smart consumer electronics.
According to a recent report published by Allied Market Research, titled, “Advanced Packaging Market by Type
(Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 2.5D/3D, Fan-Out WLP, and Others), and End Use
(Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others): Global Opportunity
Analysis and Industry Forecast, 2020–2027,” the global advanced packaging market size was valued at $29.42 billion
in 2019 and is projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027.
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Advanced Packaging Market
Advanced packaging market is expected to leverage high potential for the consumer electronics and automotive
vertical in 2026. The current business scenario is witnessing an increase in the demand for smart consumer
electronics, particularly in the developing regions such as China, India, and others, due to an increase in demand for
technological advancements in this sector such as adoption of AI and IoT. Companies in this industry are adopting
various innovative techniques such as mergers and acquisition activities, to strengthen their business position in the
competitive matrix.
The advanced packaging market is analyzed by type, end use, and region. By type, the market is classified into flip
chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. On the basis of end use, the
market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others.
By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent
countries.
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Key Findings Of The Study
Advanced Packaging Market
• By type, the flip-chip ball grid array segment held the highest revenue of $9.63 billion in 2019 and contributed a
major part in advanced packaging market share.
• By end use, the consumer electronics segment held the highest revenue share of the market in 2019, generating
$18.51 billion as per the advanced packaging market analysis.
• By region, Asia-Pacific is expected to dominate the market, garnering a major market share during the forecast
period.
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Advanced Packaging Market
Major Companies:
Key players operating in the advanced packaging market trends include Amkor Technology, Intel Corporation,
Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology,
Renesas Electronics Corporation, Texas Instruments, and Analog Devices, which are profiled in this report.
The Advanced packaging industry key market players adopt various strategies such as product launch, product
development, collaboration, partnership, agreements, among others to influence the market growth.
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Advanced Packaging Market
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