A Complete Guide on ESD Best Practices (Electrostatic Discharge)
ESD Stands for Electrostatic Discharge. Electrostatic discharge occurs when electricity flows through a conductive body when touched by another charged body. This usually happens when two charged bodies are in physical contact. In the case of electronics, this phenomenon occurs when the circuit is shorted out at some place, or a capacitor dielectric has broken down.
ESD Stands for Electrostatic Discharge. Electrostatic discharge occurs when electricity flows through a conductive body when touched by another charged body.
This usually happens when two charged bodies are in physical contact. In the case of electronics, this phenomenon occurs when the circuit is shorted out at some place, or a capacitor dielectric has broken down.
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Parasitics In The Path Of ESD Source, IC And
Typical
TVS
Should These Parasitics Be Handled For ESD
How
Protection?
2/27/23, 11:57 AM A Complete Guide on ESD Best Practices (Electrostatic Discharge)
The paths joining the ESD source, The IC and the TVS introduce parasitic inductances. These
Oxeltech
parasitic inductances are illustrated in the gure below:
As shown in the diagram above, the paths between the data port, diode and IC have been
labelled as separate inductances, and their description is given here:
LPORT is the inductance between the data port and the rest of the IC and diode
assembly
LIC is the inductance connecting the IC to the diode and the data port
LESD is the branch inductance for the diode
LGND is the inductance of the second end of the diode providing a return path to ground
The following point help in handling the parasitics mentioned above for optimum ESD
solution:
The ratio between LPORT and LIC should be decreased to direct the current to the TVS
instead of IC. Conversely, LIC can also be increased to achieve the objective. We can
place the IC as far from the TVS as possible (centre of the board). This will increase LIC
as compared to LPORT. Furthermore, we should place TVS as close to the Connector as
possible, which will reduce LPORT.
We can also introduce a series resistor between the ESD source and the IC in order to
reduce the current ow into the IC. However, care must be taken while using the bu
er
resistor in case of high-speed lines so that signal a
enuation can be avoided.
To ease the owing current into the TVS and to the ground, it is necessary to reduce the
LESD and LGND. One way of doing this would be to shorten these respective traces.
https://oxeltech.de/en/esd-best-practices/ 3/14
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