EmeraldTM 150 UV Laser Drilling - Orbotech

Emerald TM 150 UV Laser Drilling
Drill More.
PCB Production Solutions

Emerald TM 150
Drill More.
Emerald 150 delivers a new level of advanced UV drilling performance for challenging IC
substrates and flex PCBs. With innovative Multi-Path Technology, Emerald 150 achieves
more speed and accuracy, enabling highest quality drilling of the most complex designs at
maximum efficiency and cost savings.
Benefits
Ultra-fast speed utilizing the patented Multi-Path Technology
Over 3500 blind vias per second for FC-BGA epoxy and solder resist
Registration accuracy down to 10μm
High drilling quality using automatic built-in measurement and calibration tools
Supports both through holes and blind vias drilling
Versatility to drill through copper, ABF, resin, glass fibers and solder resist
UV drilling through copper eliminating the need for brown oxide and copper
thinning processes
More Speed with Multi-Path TechnologyTM Utilizing a high power UV laser, Emerald 150’s innovative Multi-
Path Technology operates multiple beams and scanners in
parallel to achieve significantly higher drilling speed without
compromising on accuracy.
Drilling throughput is fully optimized by the system’s unique
ability to simultaneously drill eight areas of the panel at a time.
Combining a higher power UV laser and a higher frequency
rate with eight fast galvanic scanners, Emerald 150 enables
100% utilization of the laser pulses. As a result, drilling speed
of over 3500 vias per second is achieved on panels with one
million vias per layer and more.
60μm via drilling in epoxy
resin in FC-BGA application
Blindvia in double-sided flex
Top drilling speed – 4 beams, 8 scanners operating in parallel

Superior Quality
Emerald 150 provides an advanced solution for achieving exceptional quality drilling
of complex board designs at full production speed.
The UV laser technology enables drilling of small vias down to 30μm through copper,
epoxy resin, solder mask and polyimide with no residue at the bottom of the via and
no undercut. Emerald 150 achieves exceptional registration accuracy down to 10μm.
To ensure consistent, top performance, Emerald 150 conducts automatic optical tests
and calibrations by using built-in measurement tools such as drill power, positioning
of Galvanic scanners as well as beam size and shape.
Emerald 150 is equipped with a high magnification microscope (optional) and set of
graphical measurement tools for the testing and reporting of drilling quality
Full Flexibility
Emerald 150 has full flexibility to support a large variety of drilling profiles
for different board materials and production stages:
Epoxy Resin of FC-BGA or FC-CSP
Solder Resist opening for flip chip bumps or copper pillars
Fine vias and through holes in flex
Through holes drilling in fine core CSPs
The system’s software has the full control and ability to change beam energy,
beam shape and size as well as punching and trepanning drilling modes online.
Multiple laser beam sizes with Top Hat and Gaussian beam shapes are supported. Setup and
switching between drilling modes and materials are very fast and easy. This allows drilling of
vias in several steps of different energies and shapes for a wide range of drilling applications.
100μm via in Copper and
Polyimide
100μm hole in 100μm
Cu coated BT
60μm opening in solder resist for copper pillar
To accommodate the drilling of highly warped rigid and flex PCB panels, Emerald 150
is equipped with a unique vacuum table built from a metal net laid on metal pillars
to ensure excellent flattening and attachment.
Diameter 58μm
High magnification microscope and
graphical measurement tools