2008-Snugovsky-SAC-Whiskers

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Inter-granular Corrosion and Lead/Solder Interface Roughness in Connection with Whisker and Hillock Growth (cont.) 14 Area 1 SEM, 4,000X SEM, 1,300X
Inter-granular Corrosion and Lead/Solder Interface Roughness in Connection with Whisker and Hillock Growth (cont.) 15 1 Area 2 Nitrogen 20keV 2
Page 1 and 2: Whisker Growth on SAC Solder Joints
Page 3 and 4: Whisker growth from lead-free solde
Page 5 and 6: Visual and SEM Inspection of Solder
Page 7 and 8: Visual and SEM Inspection of Solder
Page 9 and 10: Cross-section Analyses of Solder Jo
Page 11 and 12: Hillock Microstructure (cont.) •
Page 13: Inter-granular Corrosion and Lead/S
Page 17 and 18: Details on Protrusions with Irregul
Page 19 and 20: Details on Protrusions with Irregul
Page 21 and 22: Virgin Components, Ion Chromatograp
Page 23 and 24: Virgin Components, Plating Quality
Page 25 and 26: Virgin Components, Composition •
Page 27 and 28: Conclusions Precise cross-sectionin
Page 29 and 30: Conclusions (cont.) • There is no
Page 31: 31 Thank you

2008-Snugovsky-SAC-Whiskers

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