2008-Snugovsky-SAC-Whiskers

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Inter-granular Corrosion and Lead/Solder Interface Roughness in Connection with Whisker and Hillock Growth (cont) 16 2 1 200X SEM, 1,800X SEM, 6,000X Voids 1 Alloy 42 SEM, 450X SEM, 3,000X
Details on Protrusions with Irregular Shape, Striations, and Cracks • The rod whiskers have features similar to the hillocks • Grow from recrystallized solder 17 – Depleted of Ag and Cu and – Containing much less intermetallic particles than the bulk solder • Have recrystallized pure Sn structure • May contain Cu 6 Sn 5 and/or Ag 3 Sn particles Cu 6 Sn 5 SEM, 7,000X 20keV
Page 1 and 2: Whisker Growth on SAC Solder Joints
Page 3 and 4: Whisker growth from lead-free solde
Page 5 and 6: Visual and SEM Inspection of Solder
Page 7 and 8: Visual and SEM Inspection of Solder
Page 9 and 10: Cross-section Analyses of Solder Jo
Page 11 and 12: Hillock Microstructure (cont.) •
Page 13 and 14: Inter-granular Corrosion and Lead/S
Page 15: Inter-granular Corrosion and Lead/S
Page 19 and 20: Details on Protrusions with Irregul
Page 21 and 22: Virgin Components, Ion Chromatograp
Page 23 and 24: Virgin Components, Plating Quality
Page 25 and 26: Virgin Components, Composition •
Page 27 and 28: Conclusions Precise cross-sectionin
Page 29 and 30: Conclusions (cont.) • There is no
Page 31: 31 Thank you

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