PACKAGING PRODUCT UPDATES Needle valve with modular design Nordson EFD, a Nordson company, a manufacturer of precision fluid dispensing systems, introduces the xQR41 series microdot needle valve. The valve features a 60 % smaller form factor than standard valves, an exchangeable modular design for greater customization and process control, and a quick release (QR) clasp that allows easy removal of the fluid body to replace wetted parts in seconds. The new valve expands manufacturing opportunities for multiple applications and industries, especially those related to wireless devices, sensors, mobile phones, and other high-end electronics. The xQR41 valve’s small profile of 66 mm x 23.7 mm (2.60 “ x 0.93 “) enables multiple valves to be mounted closer together for greater output per batch, increasing production throughput. Ideal for automated assembly processes, the needle valve can dispense in tighter spaces and at angles that are more complex. Weighing only 141.4 g (5.0 oz.), the valve reduces the tooling payload. This not only means faster actuator arm movement and improved positioning stability, but also reduced tabletop automation (TTA) motor and belt wear. The xQR41’s small form factor also results in a smaller wetted path, resulting in less retained fluid volume, which minimizes fluid waste. It can be fed from a variety of reservoirs, syringe barrels, external cartridges, or tanks. The valve‘s unique QR clasp secures the fluid body to the air actuator and can be removed with a turn of a thumbscrew – no tools required. No longer is it necessary to remove the entire actuator or valve assembly from mounting fixtures. Full change-outs take seconds, not minutes. This is especially important in applications with fluids that have a curing time where the wetted part must be removed as quickly as possible and returned to operation. The pneumatically operated, adjustable valve applies precise micro-deposits as small as 150 μm (0.15 mm) (0.006 ”) of low- to highviscosity fluids onto a substrate. The xQR41’s exchangeable modular design can be configured with stroke adjustable or non-adjustable cap, BackPack valve actuator, low-profile mounting block, and 90 ° air and fluid inlet fittings. The fluid body can be aligned and locked at 360 ° intervals to accommodate mounting, positioning, and fluid inlet alignment needs. It can be installed on many automation platforms. productronica, Booth A2.245 www.nordsonefd.com The xQR41 valve’s small profile enables multiple valves to be mounted closer together for greater output per batch. Source: Nordson EFD The xQR41’s small form factor results in a smaller wetted path, which minimizes fluid waste. Source: Nordson EFD The valve expands manufacturing opportunities, especially those related to wireless devices, sensors, and mobile phones. Source: Nordson EFD 58 EPP EUROPE November 2017
Biocompatible adhesive designed for bonding temperaturesensitive substrates Panacol adds epoxy-based adhesive Structalit 8801 to its portfolio of medical grade adhesives. The biocompatible adhesive was especially designed for bonding temperature-sensitive substrates, as it cures quickly at low temperatures. It is a single-component adhesive based on epoxy resin. Due to its viscosity characteristics, it is perfectly suited as a potting or filling material. The beige-colored adhesive possesses high chemical resistance against common cleaning agents used for medical devices, including isopropyl alcohol. It develops high bond strength with ceramics, metals and many plastics. For example, it is successfully being used as a potting compound for sensors in medtech devices. This adhesive cures very quickly at low oven temperatures. At 100° C, it will fully cure in only a few minutes. Being certified according to ISO 10993–5 standards, it is also for applications in medical devices. Source: Panacol-Elosol GmbH Potting for sensors. The adhesive is 100 % solvent free and compatible with common sterilization processes such as autoclaving, gamma irradiation, E-beam, and EtO. productronica, Booth A4.465 www.panacol.com NEW & UNIQUE: Our Labtester LT101 Unbeatable ratio of cost of ownership Smart program teaching with 7“ touch screen State of the art data export (USB, Bluetooth, Ethernet, WLAN) Industrie 4.0 ready Pulltester LT101 Optical silicone binder extends thermal and optical performance Dow Corning, a leader in silicones, siliconbased technology and innovation, introduced CL-1000 Optical Silicone Binder, a new, more thermally stable, high refractive index (RI) material available only in China that is formulated to expand design options for high-power chip-scale LED packaging (CSP). The latest addition to the company’s portfolio of advanced solutions for LED lighting, CL-1000 Binder offers thermal stability and is optimized for compression molding processes. Validated through the company’s stringent testing, the thermal stability of the materi- CL-1000 Binder offers best-in-class thermal stability and is optimized for compression molding processes. Source: Dow Corning al enabled it to exhibit lower degradation and improved maintenance of mechanical properties vs. other high-RI silicone encapsulants after 2,000 hours of exposure to temperatures above 180° C. The new high- RI material also delivers excellent photostability with high clarity to further support reliable performance over the life of LED devices. The solution demonstrates good conformance with highly reflective WR-3001 and WR-3100 Die Edge Coat materials, enabling CSP packaging with enhanced reliability over longer periods. The product’s high Shore D60 hardness also enables LED packaging to withstand dicing operations. It leverages the same phenyl silicone chemistry as the company’s other high RI optical encapsulants, which can help optimize the efficiency of next-generation LED lighting designs without costly investments in more powerful LED dies. productronica, Booth B3.305 www.dowcorning.com For further information please visit us at the Visit us! Hall B2, Stand 427 or contact us directly! November 14 – 17, 2017, Messe München F&S BONDTEC Semiconductor GmbH Industriezeile 49a A-5280 Braunau am Inn, Austria T: +43.7722.67052.8270 F: +43.7722.67052.8272 Mail: info@fsbondtec.at EPP EUROPE November 2017 59 www.fsbondtec.at
