TEST + QUALITY ASSURANCE Source: Saki Corporation believes that the need for back-fillet inspection will increase. In addition, because 3D automated X-ray takes hundreds of slices throughout the solder joint which are then inspected with high definition 3D, it can detect small voids that can occur anywhere, especially those hidden under QFN packages, later creating bigger issues in the reflow process. HiP defects that occur in solder balls are the most difficult to identify because of their varied defect shapes. With the combination of hardware, software, and special algorithms, almost all HiP defects, as well as, voiding, can be located. Other defects defined in the IPC standard are the ratio of the amount of solder filling the through-holes (barrels), micro-bumps in flip chips, solder joints of PoPs, and power modules, such as insu- Different soldering-related defects detected using AXI with PCT. lated gate bipolar transistors, that require solder inspection. They are also difficult to inspect, but the need in the industry to detect these defects is getting greater. Future prospects for AXI In 2020, 5G, the 5th generation mobile communication system, is planned to be released, accelerating the IoT with 5G high capacity and ultra-high-speed 5G network functionality. Devices, reportedly, will be connected to each other in real time, and products, such as self-driving cars, which are already being tested, will probably see more widespread use. At the manufacturing site, to maintain quality, reliability, and highvolume production, the Smart Factory/Industry 4.0 initiative is going to prevail. Automated inspection equipment will use innovative technology to collect sensor information from other equipment along the assembly line, then analyze this information and give realtime feedback. Not only will this optimize production for one factory, but also for several corporations that have their manufacturing plants connected globally. With an improved communication infrastructure and growth in IoT applications, devices will be even smaller and reach high functionality quicker. Inspection needs will become more advanced and varied. The role of 3D X-ray inspection is expected to grow and become more vital. In a Smart Factory environment, AXI system capabilities are used to enhance communication and linkage with peripheral equipment and/or the host system. They become part of a total inspection solution that uses a complete lineup of 3D automated solder, 3D AOI, and 3D AXI systems that must correspond to production needs. Inspection and test equipment have to continue to evolve in order to accommodate demanding manufacturing and assembly challenges. productronica, Booth A2.259 www.sakiglobal.com Zusammenfassung In der Fertigung der Mikrolektronik steigen die Anforderungen an die Präzision und Zuverlässigkeit stetig. Neben klassischen elektrischen Testprozessen haben sich AOI sowie AXI als wichtige Ergänzungen durchgesetzt. Die meisten AXI-Systeme arbeiten auf Basis von Bild-Dekonstruktion, wobei sie anschließend von den Aufnahmen erst die Board-Unterseite für eine deutlichere Sichtbarkeit entfernen. Echte 3D-AXI-Systeme auf Basis der planaren Computertomographie (PCT) hingegen rekonstruieren aus vielen Bildschnitten eine genaue und hochaufgelöste Abbildung. Saki hat diese Technik in ein global funktionierendes Fertigungssystem implementiert, um hohe Qualität- und Zuverlässigkeitsanforderungen zu erfüllen – und offeriert damit ein effizientes Werkzeug für die Realisierung von Smart-Factory und Industrie 4.0-Konzepten. Résumé Dans la production de la microélectronique, les exigences de précision et de fiabilité augmentent continuellement. En plus des procédures d‘essai électriques classiques, AOI, ainsi qu‘AXI sont devenus des acquisitions importantes. La plupart des systèmes d’AXI fonctionnent sur la base de la déconstruction de l‘image, où les images de la partie inférieure de la carte de circuit imprimé sont retirées pour une visibilité plus claire. Les vrais systèmes 3D AXI basés sur la tomodensitométrie (TDM), cependant, reconstruisent une image à haute résolution et précise à partir de nombreuses tranches d‘imagerie. Saki a mis en œuvre cette technologie dans un système de fabrication mondiale pour répondre aux exigences de haute qualité et de fiabilité, en fournissant un outil efficace pour établir des concepts de Smart Factory et Industrie 4.0. Резюме В сфере производства электроники постоянно повышаются требования к точности и надежности. Наряду с классическими процессами тестирования продукции широкое распространение получили системы оптического (AOI) и рентгенографического (AXI) контроля качества печатных плат. В основе большинства систем рентгенографического контроля лежит принцип деконструкции изображения, при котором со снимка удаляется сначала нижняя сторона платы для обеспечения лучшего обзора. В то же время в настоящих трехмерных системах рентгенографического контроля (3D AXI) применяется метод планарной компьютерной томографии (PCT), при котором на основании множества слоев реконструируется точное изображение в высоком разрешении. Компания Saki внедрила подобную технологию в производственные системы, эксплуатируемые по всему миру, с целью обеспечения высокого качества и надежности продукции – тем самым компания предлагает эффективный инструмент для реализации «умного» производства в рамках концепции Индустрии 4.0. 66 EPP EUROPE November 2017
