Unknown Board 1156. Nishizawa, H.; Ohta, K. 1960. Artificial timber. Patent, P.N.: JP 14784, I.D.: unknown. [Japanese]. Summary: The patent describes the use <strong>of</strong> wheat flour in the producti<strong>on</strong> <strong>of</strong> a composite wood product. Cement/Clay/Gypsum/Plaster Materials 1157. Blair, R.C. 1963. Gypsum-based plasters. Patent, P.N.: CA 656542, I.D.: unknown. Summary: Wheat and/or rye gluten are used in the producti<strong>on</strong> <strong>of</strong> a gypsum-based plaster. 1158. Ludwig, N.C. 1950. Cement <strong>for</strong> lightweight c<strong>on</strong>crete. Patent, P.N.: US 2521073, I.D.: unknown. Summary: The use <strong>of</strong> wheat flour in the producti<strong>on</strong> <strong>of</strong> cement <strong>for</strong> lightweight c<strong>on</strong>crete is discussed. 1159. Polis, C. 1970. Binding compositi<strong>on</strong> from gypsum plaster, lightweight granular aggregate, and wheat paste. Patent, P.N.: US 3519450, I.D.: 700707. Summary: A binding compositi<strong>on</strong> used as mortar <strong>for</strong> securing artificial fiberboard bricks to interior surfaces <strong>for</strong> decorating purposes is obtained by adding wheat paste to a mixture <strong>of</strong> gypsum plaster and a lightweight granular aggregate in an amount calculated to reduce drying time to render the compositi<strong>on</strong> more workable with improved adhesi<strong>on</strong>. The amount <strong>of</strong> wheat paste is specified as 6 percent. (Also see references 392 and 909.) Molded Masses Plastics 1160. Cheng, Z.; Li, Z. 1988. Development <strong>of</strong> thermoplastic composites with mixed fillers. Suliao. 17(5): 37-40. [Chinese]. Summary: Organic fillers, such as wood flour, sawdust, wheat stalk, cornstalk, and straw hull, can be combined with inorganic fillers, such as CaCO 3, gypsum powder, and hard st<strong>on</strong>e flour, in the preparati<strong>on</strong> <strong>of</strong> PVC and polyethylene composites. Refractory Materials 1161. Hughes, M.J. 1968. Thermally insulating slabs <strong>for</strong> lining the upper parts <strong>of</strong> ingot molds. Patent, P.N.: GB 1115435, I.D.: unknown. 122 Summary: Wheat flour is used in the producti<strong>on</strong> <strong>of</strong> heatinsulating slabs that are used in the steel and ir<strong>on</strong> industry. (Also see reference 961.) Resins/Binders 1162. An<strong>on</strong>ymous. 1977. Starch paste <strong>for</strong> corrugated boards c<strong>on</strong>taining alpha-wheat flour, wheat flour, sodium carb<strong>on</strong>ate, borate, calcium hydroxide. Assignee: (HOHN-) Hohnen Oil KK. Patent, P.N.: JP 77039619, I.D.: 771006. [Japanese]. Summary: Starch paste, useful <strong>for</strong> the manufacture <strong>of</strong> corrugated boards, is prepared by dissolving a-starch, starch, <strong>on</strong>e or more hydroxides or oxides <strong>of</strong> two to three valent metals, and <strong>on</strong>e or more sodium or potassium salts in water. 1163. Nakai, T.; Takatsuji, I.; Tokuda, M.; Kikuchi, K. 1976. Adhesives <strong>for</strong> corrugated boards. Assignee: Hohnen Oil Co. Ltd. Patent, P.N.: JP 51124132, I.D.: 761029. [Japanese]. Summary: Whole wheat was treated with water to a water c<strong>on</strong>tent <strong>of</strong> 17 percent, steamed at 980.6 kPa gage <strong>for</strong> 30 min, cooled, dry-milled, and separated from bran. Flour (16.5 g) was dispersed in 200 mL <strong>of</strong> water at 40°C, pasted with 6.6 g NaOH at 60°C <strong>for</strong> 15 min, diluted with 125 mL <strong>of</strong> water, and stirred <strong>for</strong> 10 min. The flour was also dispersed in 500 mL <strong>of</strong> 33°C water c<strong>on</strong>taining 5.5 g borax, 16.5 tannin, and 14 g urea-<strong>for</strong>maldehyde copolymer and mixed with the abovedescribed paste to yield a high-speed corrugator adhesive with better hot-water resistance than a c<strong>on</strong>trol prepared without steaming (<strong>for</strong> denaturati<strong>on</strong> <strong>of</strong> protein) or without urea <strong>for</strong>maldehyde and tannin. 1164. Roman, C. 1948. Composite wood products. Patent, P.N.: US 2446304, I.D.: unknown. Summary: The use <strong>of</strong> rye and wheat flour in the producti<strong>on</strong> <strong>of</strong> wood composite boards is discussed. (Also see references 72, 529, 530, 990, 993, and 1154.) Miscellaneous Ec<strong>on</strong>omics (See references 1147 and 1152.) General In<strong>for</strong>mati<strong>on</strong>/<str<strong>on</strong>g>Review</str<strong>on</strong>g>s 1165. Goehre, H.O. 1987. Straw semichemical pulp process <strong>for</strong> the producti<strong>on</strong> <strong>of</strong> fiber raw material <strong>for</strong> corrugated board, packaging papers and plain paper board. Papier (Darmstadt). 41(10): 541-546. [German]. Summary: The paper discusses a new process <strong>for</strong> the use <strong>of</strong> straw in the producti<strong>on</strong> <strong>of</strong> fiber-based materials in Germany.
Patent Appendix In this bibliography, patent citati<strong>on</strong>s are <strong>for</strong>matted as follows: P.N. denotes patent number; capitalized letters between P.N. and the number represent the country code; I.D. denotes issue date; and, finally, the date is cited by year, m<strong>on</strong>th, and day. For example, in reference 18, the patent number (P.N.) is 1127700, which is preceded by the country code (GB). The issue date (I.D.) is September 18, 1968 (680918). 18. An<strong>on</strong>ymous. 1986. Bagasse panels b<strong>on</strong>ded with urea<strong>for</strong>maldehyde resin. Assignee: Societe An<strong>on</strong>. Verkor. Patent, P.N.: GB 1127700, I.D.: 680918. Notati<strong>on</strong> <strong>for</strong> patent country codes: AU BE BR CA CN CS DE EP EU FR GB HU IN IT JP NL PL RO SA SU US Australlia Belgium Brazil Canada China Czechoslovakia West Germany European Patent East Germany France Great Britain Hungary India Italy Japan Netherlands Poland Romania South Africa United Soviet Socialist Republics United States <strong>of</strong> America 123
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Literature <strong
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databases to about 1967. Citations
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leaves yielded the poorest results.
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31. Hesch, R. 1967. Particle board
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properties compared to boards made
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8.6 MPa dry and wet modulus of rupt
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88. Anonymous. 1984. Flame-resistan
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104. Gaddi, V.Q.; Samaniego, R.L.;
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tensile strength and modulus were o
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Summary: The operations of Celotex
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(Also see references 6, 89, 103, 10
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University international particlebo
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Cement/Clay/Gypsum/Plaster Material
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Summary: One percent Propionic acid
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Bamboo [Stalk] Panel Board Particle
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chips were impregnated with water-2
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288. Singh, M.M.; Jain, H.C.; Sekha
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324. Mehra, S.R.; Ghosh, R.K.; Chad
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cure and harden. The material can b
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382. Lipangile, T.N. 1990. The use
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Summary: A thermal-plasticization p
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Summary: Experiments are described
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Cement/Gypsum/Plaster Board 435. Hu
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Cement/Clay/Gypsum/Plaster Material
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Summary: This paper reports on how
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was noticed but not proportionately
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combinations and proportions with a
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527. Demko, P.R.; Washabaugh, F.J.;
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Insulation Board 548. Anonymous. 19
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Summary: Chaff or waste from proces
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Summary: This paper relates how a p
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Industries. [Polish]. (no abstract
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Summary: Scotch pine Christmas tree
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aging effects, and the like, and th
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hot asphalt, compared favorably wit
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- Page 75 and 76: Peanut [Hull, Shell] Panel Board Pa
- Page 77 and 78: Molded Masses Rubbers 696. Bhattach
- Page 79 and 80: 715. Zou, W.; Qiu, C.; Zheng, M.; M
- Page 81 and 82: 744. Krishnamoorthy, S.; Ramaswamy,
- Page 83 and 84: Summary: The patent describes a met
- Page 85 and 86: 786. Kilanowski, W. 1970. Economic
- Page 87 and 88: Summary: Reeds are processed by sco
- Page 89 and 90: Summary: Particleboards were manufa
- Page 91 and 92: decreasing coarse fiber content. Th
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- Page 95 and 96: 869. Gamza, L.B.; Korol’kov, A.P.
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- Page 99 and 100: 913. Chittenden, A.E.; Flaws, L. J.
- Page 101 and 102: and rice husk ash as a pozzolan. A
- Page 103 and 104: Summary: Compositions of 20 to 80 p
- Page 105 and 106: 974. Mehrotra, B.B.; Fink, F.; Lipp
- Page 107 and 108: manufacturing molded panels. Assign
- Page 109 and 110: Summary: Sisal fiber corrugated int
- Page 111 and 112: (COPE/) Copeland W L, (COPE-) Copel
- Page 113 and 114: interface sisal/matrix was the weak
- Page 115 and 116: Molded Masses Resins/Binders (See r
- Page 117 and 118: 1091. Anonymous. 1982. Chipboard co
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- Page 123: 1147. USDA Northern Regional Resear
- Page 127 and 128: Author Atchison, J.E. Atfoort, G.A.
- Page 129 and 130: Author Chandra, R. Chandramouli, P.
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- Page 137 and 138: Author Lugembe, P. Luhowiak, W. Lum
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- Page 143 and 144: Author Salyer, I.O. Samaniego, R.L.
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