LT-4182 Macromelt - Loctite.ph
LT-4182 Macromelt - Loctite.ph
LT-4182 Macromelt - Loctite.ph
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Low Pressure Molding<br />
<strong>Macromelt</strong> ®
LOW PRESSURE INSERT MOLDING<br />
Henkel, the global leader in adhesives, and The Cavist Corporation, application engineering and equipment experts in the field of low<br />
pressure insert molding, have partnered to offer a complete solution for the gentle over-molding and encapsulation of delicate<br />
electronic components.<br />
Low pressure molding is an innovative manufacturing process between injection molding and potting. It is injection molding at very low<br />
pressures with hot melt adhesives. It is a cost effective alternative to epoxy potting for protection of fragile electronic components. When<br />
used for cable and connector molding, it offers superior strain relief compared to conventional plastic injection molding.<br />
Process Flow Advantage of Low Pressure Molding<br />
TRADITIONAL POTTING PROCESS FLOW<br />
LOW PRESSURE PROCESS FLOW<br />
The Low Pressure Molding process<br />
provides many benefits.<br />
• Complete sealing of the components,<br />
providing water-tight encapsulation<br />
• Effective strain relief<br />
• Low viscosity materials allow for low<br />
injection pressures of 20 to 500 psi<br />
• Allows gentle pre-molding of connectors<br />
• Components and wires are not<br />
damaged or dislocated in cavities<br />
• Easy to encapsulate fragile components<br />
• No hazardous fumes from<br />
materials or processing<br />
• Short (15-45 seconds) cycle time to<br />
complete part
Headline “Overmolding replaces both the housing<br />
Helvetica and potting Neue in just 75 Bold one operation.”<br />
20pt/25pt - tracking 3<br />
Seal large PC boards with<br />
external connectors<br />
Encapsulation of sensitive<br />
electronics prior to<br />
conventional overmolding<br />
Overmold various<br />
electronic shapes<br />
Packaging of sensitive<br />
high performance electronics
“Adhesive Materials offer<br />
superior strain relief.”<br />
Mold strain relief and grommets<br />
Seal multi-wire connectors<br />
Mold connectors with strain relief<br />
Superior strain relief for<br />
modular connectors without<br />
mechanical crimping<br />
Seal micro-switches
HENKEL MACROME<strong>LT</strong> ® LOW PRESSURE MOLDING MATERIALS<br />
Henkel is the world leader in high performance adhesive materials. The <strong>Macromelt</strong> ® OM line of low pressure molding materials are<br />
innovative, specially-modified thermoplastic polyamide hot melts made especially for low pressure molding.<br />
<strong>Macromelt</strong> ® products melt and flow at low viscosities (1,000 to 10,000 cps), allowing for the low injection pressure process. <strong>Macromelt</strong> ®<br />
offers very good adhesion to various substrates, including PVC, PA6.6, PUR, and PP. Since they are based on adhesive technology, they bond<br />
to form a watertight and chemical seal. These hot melts cure quickly by cooling so there are no toxic fumes and cycle times are short. The<br />
entire line of <strong>Macromelt</strong> ® OM products is UL94-V0 rated. The materials are available in amber, black and custom colors.<br />
MACROME<strong>LT</strong> ® DATA - Based on General Values<br />
Properties Test Method Unit OM 633 / OM 638 OM 641 / OM 646 OM 652 / OM 657 OM 673 / OM 678 MM 6208 / MM 6208S<br />
PHYSICAL<br />
Color amber / black amber / black amber / black amber / black amber / black<br />
Specific gravity DIN 53479, S S.G. 0.98 0.98 0.98 0.98 0.98<br />
Working temperature Henkel Method °C -40 to +130 -40 to +130 -40 to +100 -40 to +140 -40 to +150<br />
Hardness ASTM D 2240-85 Shore A 90 92 77 88 78<br />
Elongation @ rupture ASTM D 638-00 % 400 800 400 500 600<br />
Softening point, ASTM E 28-99 °C 175 175 155 187 / 185 150 – 160<br />
Ball & Ring<br />
Molding temperature Henkel Method °C 200 to 240 210 to 240 180 to 280 210 to 240 190 to 230<br />
Viscosity @ 210°C ASTM D 3236-88 mPas 3700 7000 4100 3400 3600<br />
ELECTRICAL<br />
Dielectric ASTM D150-95 4.5 / 4.7 5.1 / 5.5 6.2 / 6.3 4.9 / 4.9 6.1 / 6.3<br />
constant @ 1 kHz<br />
Volume resistivity D257-93 Ohm cm 1.7E15 / 2.4E13 6.3E12 / 1.7E12 1.0E12 / 7.2E11 1.90E12 / 1.90E12 1.9E11 / 1.6E11<br />
Dielectric strength ASTM D149-97a kV / mm 24 / 19 25 / 22 14 / 15 20 / 20 23 / 23<br />
RATINGS & TEST RESU<strong>LT</strong>S<br />
FDA category FDA Adhesives 175.105 (OM 633) 175.105 (OM 641) 175.105 (OM 652) 175.105 (OM 673) 175.105 (MM 6208)<br />
Flammability rating U/L 94 V-O V-O V-O V-O V-O
Henkel Corporation<br />
Irvine, California<br />
U.S.A.<br />
www.electronics.henkel.com<br />
Henkel –<br />
Your partner worldwide<br />
The Cavist Corporation specializes in low pressure molding. The low<br />
pressure molding system requires careful engineering of the mold-set to<br />
achieve consistent, high volume production. This process allows you to<br />
utilize cost effective aluminum mold-sets. Either single or multi-cavity<br />
mold-sets can be used. Cavist is the low pressure molding supplier of:<br />
• Quality application<br />
engineering<br />
• Mold-set fabrication<br />
or guidance to create<br />
your own mold-sets<br />
• Prototyping<br />
The Moldman Low Pressure Injection Molding Technology is the best<br />
equipment for dispensing <strong>Macromelt</strong> ® quality component.<br />
Molding materials to create a<br />
• High capacity • User friendly and safe<br />
• Small footprint • Injection profiles<br />
• Simple to operate • Made in U.S.A.<br />
• Easy set-up with<br />
touch screen<br />
The Cavist Corporation<br />
3545 Airway Drive #112<br />
Reno, NV 89511 U.S.A.<br />
775-332-1600 • Fax 775-332-1601<br />
www.cavist.com • mail@cavist.com<br />
Henkel Corporation<br />
15350 Barranca Parkway<br />
Irvine, CA 92618<br />
949-789-2500 • Fax 949-789-2595<br />
www.electronics.henkel.com<br />
• Molding equipment<br />
incorporating the latest<br />
Nordson Corporation melt units<br />
• Contract molding services<br />
® and designate trademarks of Henkel Corporation or its Affiliates. ® = registered in the U.S. and elsewhere.<br />
© Henkel Corporation, 2005. All rights reserved. 2894/<strong>LT</strong>-<strong>4182</strong> (4/2005)