Intel Atom processor enables low-power IPC for ... - DSM Computer

INDUSTRIAL COMPUTING
Intel Atom processor enables
low-power IPC for mobile applications
By Christian Lang, DSM Computer
The low power consumption
of the Intel Atom processor
enables fanless embedded
PCs in closed housings, suited
to mobile applications, with
battery life extended two to
three times, opening up completely
new possibilities. In
combination with the Intel
82945GME chipset, a wide
variety of important industrial
interfaces can be offered.
■ In recent years, the focus has increasingly
shifted to the energy efficiency of embedded
computing systems, in addition to computing
power. The growing number of industrial applications
in which fanless industrial computers
(IPCs) are realized with corresponding I/O
performance is driving this trend. Low power
consumption reduces the waste heat of the systems
and lowers demands on the cooling concepts.
In this way, completely fanless designs can
be constructed in closed housings. Thanks to
low power consumption, the power-saving
embedded PCs are also suited to mobile applications
and enable an extension of battery life
by two to three times. This opens up a new
range of applications for these IPCs that only a
matter of months ago seemed to be impossible.
A prerequisite for the development of embedded
systems with extreme power savings is the
Atom processor architecture, newly developed
by Intel, with unparalleled performance characteristics.
The processor is manufactured in a
45nm process and is cased in small form factor
housing (SFF). The chip, which is just
13x14mm² or 22x22mm², depending on the
version, takes up very little space on the PCB
and features especially low power dissipation.
The majority of the embedded computing
platforms presented in recent weeks, based on
the power-saving Intel Atom processor archi-
tecture, integrate a CPU from the Z5xx series
and the Intel US15W system controller hub.
The two-chip solution is persuasive as a result
of its high energy efficiency, but does not
however offer the wide range of modern interfaces
required by many applications, in particular
in industrial automation technology.
Therefore, only two PCI Express Lanes are
available, of which one will normally already be
used for the Gigabit LAN interface. Additional
interfaces such as further PCI Express or a PCI
bus can only be realized via special bridge chips.
A solution is offered by the combination of the
power-saving Intel Atom N270 processor, the
82945GME Northbridge and the ICH7 Southbridge.
The Intel 82945GME chipset offers a
wide variety of interfaces important for the industry,
such as a PCI Express x16 interface for
external high-end graphics cards and a dual
DVI/LVDS interface. Additional system expansions
are possible via five PCI Express x1
Lanes. The combination of the Intel Atom CPU
and Intel 945GME chipset makes much more
sense than many of the CPU boards on the
market with the Intel 945GC chipset, which exhibits
8 to 9 times the power dissipation of the
processor. The Intel Atom N270 processor is
clocked with a frequency of 1.6GHz, and with
a thermal design power (TDP) of 2.5W has extremely
low power consumption. The complete
three-chip solution has a theoretical power dis-
February 2009 14
Figure 1. The first
embeddedsysteminthe
NanoServer family based
on the energy-saving
Atom N270 processor
from Intel
sipation of 12.6W. In this way, a range of fanless
applications can be realized that previously only
used the generally expensive low-voltage or
ultra-low-voltage processors. The N270 CPU
supports Intel Enhanced SpeedStep technology.
As a result of the integrated hyper-threading
technology, multiple threads can be executed at
the same time in a single core.
DSM Computer utilizes the advantages of the
high energy efficiency of the Intel Atom processor
technology, and the associated lower system
costs, in its new E3-COM NanoServer embedded
PC. The industry-compatible NanoServers
can be used as distributed and independent
client servers, for example as control unit,
measured value or communications servers.
The core of the E3-COM NanoServer is a COM
Express baseboard, developed for this application,
in MiniITX format with a COM Express
module based on the N270 CPU and the Intel
82945GME chipset. In this way, DSM is placing
emphasis on the long-term use of the globally
recognized COM Express PICMG standard,
which ensures the long availability of the individual
components on the Intel embedded
roadmap. The baseboard and the CPU module
are manufactured in Germany. The scalable
COM Express module utilizes the benefits of
the Intel Atom processor due to its small size of
125mmx95mm (basic format). In addition, the
interfaces can be led to the outside via the in-

Figure 2. Customer-specific basis board with
energy-saving COM Express module
Figure 3. The E3-COM NanoServer has a
wide range of interfaces.
dividual carrier board in the place where they
are required in the housing design. Therefore,
the external connections do not have to be cabled
in a complex way in the housing. COM Express
defines all specifications relevant for the
industrial application such as PCI Express, PCI,
PEG, USB 2.0, Gigabit Ethernet and SATA via
the two pin-out specification types 1 and 2. The
COM Express connector offers high shock
and vibration stability as well as good EMC behavior.
The E3-COM NanoServer is accommodated in
a high-quality industrial housing with compact
dimensions of 220x220x110mm³. There are
four USB 2.0 ports for the flexible connection
of various peripheral devices and high-speed
Gigabit Ethernet. There are four further USB
2.0 ports on the baseboard and these can be led
out of the housing if required. The required
audio functionality can be ensured via the Intel
high definition or the AC'97 audio interface. A
fast PCI Express 1x Lane as well as a PCI bus
(3.3V / 5V) and a MiniPCI bus complete the
picture. Additional interfaces can be realized on
a customer-specific basis via the I/O shield of
the embedded system.
Thanks to the 950 Graphics Media Accelerator
integrated into the Intel 945 chipset, the IPC offers
excellent 3D graphics features. The VGA
memory has a capacity of 224 Mbytes (shared).
The internal graphics supports dual independent
displays. If required, the graphics capability
can be expanded via the PCI Express Graphics
(PEG) port. A backlight interface can also be
led to the outside in addition to the VGA, DVI-
INDUSTRIAL COMPUTING
D and LVDS interfaces. With the assistance of
the backlight control, the light intensity for the
backlighting of the LCD display module of a flat
screen can be controlled. In order to ensure that
the panel can be operated in energy-saving
mode, the backlight is switched off after a prescribed
interval of time. Displays that are
equipped with a continuously working backlight
control provide constant grayscale display.
This function is on the baseboard and can also
be led to the outside in a customer-specific variant.
For data storage, there is space in the solid PC
housing for a rugged 2.5 inch hard disk, which
is suited to the temperature range of -20°C to
+75°C and therefore works reliably at low external
temperatures. The robust 80 Gbyte hard
disk can run round the clock without interruption,
reaching an MTBF of 750,000 hours.
As an option, connection of a disk-onmodule
or compact flash is possible.
The IPC runs on the Windows XP operating
system (embedded). The TrustedCore BIOS
from Phoenix Technologies is implemented on
the COM Express module, which includes security
functions corresponding to the Trusted
Computing Group (TCG). This means that the
copying and modification of customer knowhow
is prevented. For the optimization of the
BIOS, DSM has full access to the Phoenix
source code. In addition, the Computer-on-
Module integrates the Infineon Trusted Platform
Module TPM 1.2 SLB 9635.
The target market of the E3-COM embedded
system from the NanoServer family, based on
the Intel Atom processor, is mainly mobile applications,
for example in the areas of industrial
automation technology, transport and logistics,
medicinal devices and POS & POI systems. A
new application of the compact computer is
digital signage, which identifies a networked audiovisual
marketing and information system,
the content of which can be very rapidly programmed
in a targeted way using software. Digital
signage is used for example at rail stations
and airports in order to show departure and arrival
times on a large-scale display. News and
advertising are also targeted to specific groups
in large hotels, clinics and well-visited shopping
malls. Combining these with, for example,
event details and local weather information assures
that more customer attention is secured
than in the case of pure marketing displays. The
task of the NanoServer in this application is primarily
to control the marketing display with the
representation of the contents. For applications
requiring very high computing power, the E3-
COM NanoServer with Intel Core 2 L7400 duoprocessor
is also supplied. This system can be
operated in the extended operating temperature
range of -10°C to 50°C. ■
15 February 2009
Embedded Computers
Made in Germany.
www.ekf.com
CompactPCI ®
(Express and more …)
with CCM-BOOGIE
• Intel ® Core 2 Duo up to 2.26 GHz
• Up to 8 GB DDR3 RAM (4 GB soldered)
• Dual Screen Graphics
• 6 x SATA, 11 x USB 2.0
• Versatile Mass Storage Options
(CF, HDD, SSD)
• Rear I/O and Mezzanine Expansion
via PCI Express
• Customized Expansion Boards
• Ruggedized and long time available
Besuchen Sie uns:
Embedded World
03.–05. Feb. 2009
Halle 12, Stand 313