Design of LTCC RF Modules for Communication Systems
Design of LTCC RF Modules for Communication Systems
Design of LTCC RF Modules for Communication Systems
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<strong>LTCC</strong> Considerations<br />
-Ground and power planes-<br />
◗ -Ground and power planes shall be a grid pattern <strong>of</strong> less than 50% conductor<br />
coverage.<br />
◗ -The preferred plane uses 250 µm lines and 550 µm spaces.<br />
◗ -The grid pattern <strong>of</strong> planes on adjacent layers should be <strong>of</strong>fset to provide a<br />
uni<strong>for</strong>m substrate thickness.<br />
◗ -Solid conductor areas on the gridded plane can be used locally to improve<br />
<strong>RF</strong> per<strong>for</strong>mance<br />
◗ -The grid plane connection to a via can be improved by using a square catch<br />
pad that shares the current flow to several grid lines(A)<br />
◗ -A minimum <strong>of</strong> 300 µm spacing shall separate the plane pattern and ant feed<br />
through via. 250µm 300µm 550µm<br />
A
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