Design of LTCC RF Modules for Communication Systems

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LTCC Considerations -Ground and power planes- ◗ -Ground and power planes shall be a grid pattern of less than 50% conductor coverage. ◗ -The preferred plane uses 250 µm lines and 550 µm spaces. ◗ -The grid pattern of planes on adjacent layers should be offset to provide a uniform substrate thickness. ◗ -Solid conductor areas on the gridded plane can be used locally to improve RF performance ◗ -The grid plane connection to a via can be improved by using a square catch pad that shares the current flow to several grid lines(A) ◗ -A minimum of 300 µm spacing shall separate the plane pattern and ant feed through via. 250µm 300µm 550µm A
◗ Cavities LTCC Considerations -Cavities- ◗ -Cavities or holes are produced in the unfired state by punching the cavity windows to the tape sheets before lamination. ◗ -The cavity walls shall be a minimum of 3.0 mm wide(B) ◗ -Via edge to cavity wall clearance shall be a minimum of 2.5 x via diameter(C) ◗ -The cavity bottom conductor to cavity wall clearance shall be 200 µm (D) ◗ -Buried or exposed conductor to cavity wall clearance shall be a minimum of 250 µm(E) ◗ -Bond shelf minimum width shall be 0.8 mm(F) F B E D C A
Page 1 and 2: Presentation #7 Design of LTCC RF M
Page 3 and 4: LTCC Overview & Solution
Page 5 and 6: Buried Capacitor LTCC Module struct
Page 7 and 8: ◗ Castellated ◗ -Most recent de
Page 9 and 10: LTCC Considerations -Vias- ◗ Via
Page 11: LTCC Considerations ◗ Line width
Page 15 and 16: Multi Layer Technology Embedded L,C
Page 17 and 18: Embedded Passives Modeling & Librar
Page 19 and 20: Embedded Passives HFSS simulation m
Page 21 and 22: Embedded Passives Modeling & Librar
Page 23 and 24: Extracted Capacitor Parameters Para
Page 25 and 26: Embedded Inductors For manufacturin
Page 27 and 28: L : nH C : pF R : O Extracted Induc
Page 29 and 30: Ink A B C D Ohms/Square 28 311 3,48
Page 32 and 33: LTCC RF Module Design Example: Powe
Page 34 and 35: Power Amplifier Specification ◗ B
Page 36 and 37: Unit Cell Parameter ◗ Vcc=3.5V, a
Page 38 and 39: Unit Cell Parameter ◗ From Dynami
Page 40 and 41: Optimize Bias Network Using Current
Page 46 and 47: Power Gain Circle Matching ◗ Powe
Page 48 and 49: Design Matching Network Using Smith
Page 50 and 51: Design Matching Network Using Smith
Page 52 and 53: Harmonic Balance Simulation and Loa
Page 54 and 55: Nyquist Stability Analysis ◗ For
Page 56 and 57: Conversion of Lumped Components to
Page 58 and 59: Coupler Module Application • Intr
Page 60 and 61: Derivation of lumped equivalent cir
Page 62 and 63:
Case 1. Transversal symmetrical pla
Page 64 and 65:
Y Y Y in L Longitudinal symmetrical
Page 66 and 67:
Ce Co/2 LTCC Application Le Lo Le L
Page 68 and 69:
Chip-type LC design process using S
Page 70 and 71:
Simulation Result (Ansoft Designer
Page 72 and 73:
Switch Module Application Triple-Ba
Page 74 and 75:
Diplexer Design Theory ◗ Low Pass
Page 76 and 77:
Prototype Low Pass Filter Design fr
Page 78 and 79:
Impedance Scaling & Frequency Trans
Page 80 and 81:
1 1 −ω1 ': ω' = : ω ω 1 ω ω
Page 82 and 83:
Prototype Diplexer Design GSM/DCS b
Page 84 and 85:
Circuit Simulation Result using Ans
Page 86 and 87:
Conclusion LTCC background and desi
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Design of LTCC RF Modules for Communication Systems

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