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Simultaneous Switching Output (SSO) Analysis Using Xilinx Virtex-4 ...

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1 mm<br />

Ball Pitch<br />

o o o o o o o o o o o o o o o o o<br />

Ref: BGA Crosstalk by Howard Johnson, March 1, 2005<br />

Die and Package Scale<br />

FPGA Die<br />

775um<br />

Bump<br />

75um<br />

Pkg (10L)<br />

1068um<br />

Ball<br />

500um height<br />

700 um width<br />

PCB<br />

(22Layer)<br />

3125um

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