Automatic Print Offset Placement Compensation 01005 Components

Surface Mount Technology System 

Automatic Print Offset Placement 

Compensation 

01005 Component Placement 

2006.03.20 

Sales Engineer Group 

2006.10.03 

Print Offset JISSO rev.13


1( 

PCB Problems 

Printing Problems 

2( 

Real World Production Problem 

Lands stretching and variation from lot to lot occur frequently with flexible PCBs and 

ceramic PCBs 

Pattern misalignment between the PCB lands and stencil apertures occurs due 

to stretched PCB 

Placements out of specifictions'off center, tombstone, etc.(are more 

common when the placements are centered on the pads 

Misalignment of stencil to PCB by screen printer 

Placements shift during reflow 'off center, tombstone, etc.( if 

component is placed centered on pads when the solder paste is shifted 

Component Trends 

3( 

Smaller components and closer component spacing require greater placement precision 

High accuracy placement needed on the placement machine 

2/16


JUKI’s 

Solution 

How It Works 

1( 

2( 

3( 

Correct for fiducials 

Using the local fiducial function, the machine will check the solder paste 

position relative to the pad locations 

Example of 

Component 

Placement 

Traditional 

Placement on 

PCB pads 

Fiducial mark 

Placement of component on 

misaligned stencil or stretched 

PCB 

Corrected placement 

between PCB pads and print misalignment 

Self Contained in Machine 

Components are placed centered on the solder paste print, not the 

pads 

Machine selfcontained 


corrected 

for print 

offset 

1-1 

Solution 

☆ 

Placement centered on 

solder paste print, not pads 

1-2 

2-1 

2-3 

2-1 2-3 

2012 lands 

1608 lands 

Placement centered on paste 

3/16


Rubber 

squeegee 

Printer 

KS-1710 

01005 Placement Experiment Conditions 

Screen Printer 


KE-2060R 

Solder Type 

Solder Name: M705-330F-21-10.5 

Alloy: SN 96.5 

AG 3.0 

Cu 0.5 

Particle size: 15-25mm 

Flux percentage: 10.5% 

Manufacturer: Senju Metal 

Industry Co., Ltd. 

Laser recognition 

Mounting machine 

7 zone atmospheric air specification 

Reflow 

Reflow furnace 

TAP30-407 

Mar.2006 

Stencil Specifications 

Thickness: 70µm 

Production Method: Laser + electro 

polishing 

Mfg.: Sonocom Co., Ltd. 

PWB Specifications 

Thickness: 1.2mm 

Material: glass epoxy 

4/16


Result of Paste Corrected Placement 

☆ Corrected placement has effect depend on component 

01005 Chip 

Placement shift (mm) 

0201 Chip 

Placement Shift(㎜) 

Placement Shift (mm) 

0.20 

0.15 

0.10 

0.05 

0.00 

01005chip 

0.00 0.05 0.10 0.15 0.20 

Print shift(㎜) 

0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

1/3 

1/2 

1/2 

0201 chip 

0.00 

0.00 0.05 0.10 0.15 

Print Shift(㎜) 

0.20 0.25 

Placement shift(㎜) 

JUKI Demo PCB 'Experience.1( 

QFP-p0.4mm-120pin :size16×16mm, 0.7g 

0.30 

0.25 

0.20 

0.15 

0.10 

0.05 

QFP-0.4P-120pin 

0.00 

0.00 0.05 0.10 0.15 0.20 

Print shift (mm) 

0.25 0.30 

2CN-p0.5mm-16pin : size5.4×4.2 2CN-0.5P-16pin mm, 0.025g 

0.30 


0.25 

0.20 

0.15 

0.10 

0.05 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 0.30 

Print shift (㎜) 

Attention( Results of experience have difference by solder variation and figure of PCB land Att(Condition after reflow is good status about ■sign. 

5/16


Results 1/3 

Small Components (01005 and 0201) 

1( Self-alignment is improved by placing on paste 

→ Results are good up to about 0.1mm (half size of 01005), but neighboring pads can 

affect larger offsets 

print 0.10 / placement 0 

NG 

01005 chip 0201 &0402 chip 

print 0.10 / placement 0.10 

OK 

print 0.16 / placement 0 

NG 

print 0.19 / placement 0.19 

Comparison of Placement Offset Results good even with larger offset 

OK 

6/16


Results 2/3 

Small Component (01005 and 0201) 

2( Standard placement method self-alignment 

→ There are fine results up to about 0.067mm(1/3 of component size) 

01005 print 0.05 / placement 0 

0201 & 0402 print 0.08 / placement 0 

01005 & 0201 print 0.10 / placement 0 

recommend 1/3 

Amount of printing shift is in the rule… 

良好 

OK 

OK 

OK 

7/16


Results 3/3 

Large Component 

3(Placement centered on pads yields better results 

→OPASS function can be selected per part number 

QFP-p0.5mm-48pin :size 9x9mm, 0.2g 

printing 0.15 / placement 0 printing 0.15 / placement 0.15 

GOOD Fair 

0.0041 g/pin 

8/16


Component centered on pads (standard placement) 


0.15 

0.10 

0.05 

1/3 

1/2 

0.00 

0.00 0.05 0.10 0.15 

Component size: 

better up to 1/3 of 

component width shift 

Tested PCB 

JUKI_Demo PCB 

Gap : 0.18mm 

Standard Placement Example'1-1( 

printing 0.05 / placement 0 printing 0.06 / placement 0 printing 0.08 / placement 0 

GOOD 

Fair NG 

9/16


Component centered on paste (corrected placement) 


0.15 

0.10 

0.05 

1/3 

1/2 

0.00 

0.00 0.05 0.10 0.15 



component width shift 

Tested PCB 

JUKI_Demo PCB 

Corrected Placement Example (1-2( 

printing 0 / placement 0 printing 0.10 / placement 0.10 printing 0.12 / placement 0.12 

Gap : 0.18mm GOOD 

Fair 

NG 

10/16


0.25 

0.20 

0.15 

0.10 

0.05 

Component placed centered on pads (standard placement) 

0201 and 0402 

Chips 

1/3 

1/2 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 



component 

Tested PCB 

JUKI_Demo PCB 

Standard Placement Example'1-3( 

printing 0 / placement 0 printing 0.08 / placement 0 printing 0.16 / placement 0 

OK 

OK NG 

11/16


Component Placed Centered on Paste 

0201 and 0402 

Chips 

0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

1/2 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 



component 

Tested PCB 

JUKI_Demo PCB 

Example of OPASS Placement'1-4( 

printing 0.15 / placement 0.15 printing 0.19 / placement 0.19 printing 0.24 / placement 0.24 

OK 

OK NG 

12/16


Standard/OPASS Placement with Rotated Solder Paste 

Angular Misalignment 

printing 0 / placement 2° 

OK 

printing 2°/ placement 0 printing 2°/ placement 2° printing 2°/ placement -2° 

OK 

Two-way connector 16pin 0.025g 

0.00156g / pin 

OK OK 

13/16


Standard Placement with Rotated Placement 

Print OK, Placement Rotated 

printing 0 / placement 2° 

CSP 46ball_0.1g QFP 120pin_0.7g Two-way CN 136pin_0.9g SOP 16pin_0.15g 

0.0021g/pin 0.0058g/pin 0.0066g/pin 

0.0093g/pin 


1° 

Better Better NG 

NG 

0.0100 

0.0080 

0.0060 

0.0040 

0.0020 

0.0000 

Weight per 1 pin 

OK till 0.0021g/pin 

2CN-0.025g CSP-0.1g QFP-0.7g 2CN-0.9g SOP-0.15g 1CN-0.4g 

14/16



Standard Placement 

Centered on pads 

 

0.08mm 

OPASS Placement 

Centered on paste 

 

0.10mm 

Good! 

Print Solder 

0.15 

0.10 

0.05 

1/3 

1/2 

0.00 

0.00 0.05 0.10 0.15 

Placement Reflow 

Paste position 

Paste Position 

⇒STD Position


0201~0402 Chip 



 

0.16mm 



 

0.19mm 

Good! 


0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

1/2 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 

Part Reflow 

Paste position 

Paste Position 

⇒ STD Position


Placement Test 

Standard 


Unstable 

0402-1.mpg 0402-2.mpg 

OPASS 

Placement




0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

1/2 

PCB Position Placement Test 

0201 chip 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 

Print shift(㎜) 

PCB Pads 

Gap:0.18mm 

→ STD Position 

0201 chip 

0402 chip 

0603 chip 

Solder Print Part Reflow




0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

1/2 

PCB Position Placement Test 

0201 chip 

Gap:0.18mm 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 


PCB Pads 

→ STD Position 

Auto mode 

0201 chip 

0402 chip 

0603 chip 

Solder Print Part Reflow

Placement shift (㎜) 


0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

Print Position Placement Test 

OPASS placement 

1/2 

0201 chip 

Paste Position / 

Gap:0.18mm 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 

Print shift (mm) 

Solder Position 

0201 chip 

0402 chip 

0603 chip 

PCB Pads Solder Print Part Reflow



0.25 

0.20 

0.15 

0.10 

0.05 

1/3 

Print Position Placement Test 


1/2 

0201 chip 

Paste Position / 

Gap:0.18mm 

0.00 

0.00 0.05 0.10 0.15 

Print (㎜) 

0.20 0.25 

Auto mode 

0201 chip 

0402 chip 

0603 chip 

PCB Pads Solder Print Part Reflow


2 Part Component 

Solder position shift 

200μ 



 

24.2%, 30/124 



< Reject > 

0%, 0/124 

Good! 

Solder Print 

Placement faliures (%) 

120 

100 

80 

60 

40 

20 

0 

Part Reflow 

Print position 

Standard 

OPASS 

4 pn NR 

0 

8.00 

15.30 

24.20 

50 80 110 150 200 

Print shift (um) 

98.40


4-Part Component 

Solder position shift 

200μ 



< Reject > 

87.7%, 93/124 



< Reject > 

0%, 0/124 

Good! 


Placement failures 

(%) 

100 

80 

60 

40 

20 

0 

Standard 

OPASS 

8 pin NR 

2.80 

0 0.00 0.00 

50 80 110 150 200 

Print shift (um) 

Part Reflow 

Print position 

87.70


Result JUKI_DemoPCB 'Test1( 

☆ Effect varies by component type 


01005 chip 

0.20 

0.15 

0.10 

0.05 

0.00 

0201 Chip 


1/3 

0.00 0.05 0.10 0.15 0.20 


1/3 

1/2 

1/2 

QFP-p0.4mm-120pin :size16×16mm、0.7g 

Placement shjft (mm) 

0.30 

0.25 

0.20 

0.15 

0.10 

0.05 

0.00 

QFP-0.4P-120pin 

0.00 0.05 0.10 0.15 0.20 0.25 0.30 


2CN-p0.5mm-16pin : size5.4×4.2 mm、0.025g 

2CN-0.5P-16pin 

0.30 

Note: Results vary depending on pad geometry and paste type/volume ■= good reflow results 


0.25 

0.20 

0.15 

0.10 

0.05 

0.00 

0.00 0.05 0.10 0.15 0.20 0.25 0.30 

Print shift (㎜)


Print Screen position JISSO 

Conditions 

・Stencil thick.:70μ 

・Chip:0805 

・Reflow:Air 

OffsetPrint 07.mpg


Behavior of solder 

Tombstone Self Alignment 

TombStone C.mpg Self R.mpg 

supplementation


RDT_QFP.mpg 

Test 

QFP BGA 

Solder Melt Point 

BGA01.mpg


JUKI’s 

solution 

Placements aligned to Solder Paste 

☆Recognize paste offset and place components centered on print, not pads 

→ Selectable for each component 

Solution 

☆ Chips : Placement centered on paste 

☆ Others: Standard Placements 

Attention) 

2-1 0603 pads 

2-1 

2-3 

2-3 

0805 pads 

Placements aligned with paste 

This function is possible to mount component to the part of printed solder. Machine performance and product quality aren’t 

guaranteed by this function. 

15/16


For High Quality Assembly… 

Components 

Reflow Performance 

Room environment 

Keyword 

Mounter 

Performance 

PCB 

Stable manufacturing is possible 

by completing these things 

Screen Printer 

Performance 

high-density placement of 01005 component 

Solder Paste 

Stencil 

16/16


Special Lighting for Solder Paste Recognition 

Solder Light '2( 

New 

Standard Light '1( 

Solder Light – Automatic Parameter Acquisition 

Parameter 

Default:100 

Initial check 

OK 

Parameter 

Default 100 

Acquisition start 

Checking… 

New Solder Light 

OK 

Acquisition Complete

Automatic Print Offset Placement Compensation 01005 Components

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