in PDF Format - Embedded-Control-Europe.com

More documents

Recommendations

Info

SMALL FORM FACTOR BOARDS Pico-ITX with ARM KTA55/pITX pITX-SP (planned for Q1/2012) Processor platform NVIDIA Tegra 2 AMD Embedded Intel Atom Z5x0 1 GHz dual core G-Series, 1 GHz 1.1 / 1.6 GHz dual core single core Ethernet 1x 10/100 Mbit 1x 10/100/1000 Mbit 1x 10/100/1000 Mbit USB 3x USB 2.0 6x USB 2.0 6x USB 2.0 Graphics DVI-I, 24-bit single DVI-I, 24-bit dual DVI-D, 24-bit single channel LVDS, channel LVDS channel LVDS Display Serial Interface Main memory 512 / 1024 MB DDR2 Max 4 GB DDR3 Max 2 GB DDR2 Storage MicroSD Card Slot, 2x SATA, 2x SATA, 1x PATA Onboard NAND flash MicroSD Card Slot Audio 2ch. In/out, Mic, HD audio HD audio analog / SPDIF SPDIF I/O features 16x GPIO, 2x RS232, 8x GPIO 8-bit GPI/O, SDIO CSI, I2C, SPI, JTAG Table 1. Comparison of the three Pico-ITX feature sets reveals hardly any differences in terms of the most relevant interfaces such as USB, Ethernet and graphics and memory for SFF devices. In general, scalability with expansion into ARM technology is well underway. requirements. Two dimensions are consequently specified: a small 82mm x 50 mm module, and a larger one at 82mm x 80mm primarily intended for future high-performance multicore processors. Kontron has positioned the specification for the low-power performance class, such as ARM-tailored modules, as a platform alternative to existing proprietary custom module implementations that are often tailored to a single ARM processor. The Kontron-driven open COM specification really comes into its own with the latest MXM 3.0 connector, which enables very flat designs and is also available in a shock- and vibration-proof construction suitable for automotive applications. Even more decisive is the fact that the pin allocation and thus the feature set are specifically designed for ARM and SOC processor technologies. The new connector gives rise to new interfaces. Video outputs include LVDS, and in future embedded DisplayPort, 24-bit RGB and HDMI are also possible. For the first time dedicated camera interfaces are also included in the standard. Consequently, users no longer need to compromise or work with inefficient specifications stretched between the x86 feature set and lean ARM I/Os. To enable customers to begin using ARM technology immediately, Kontron will provide its ARM-based building blocks in bundles with extensive custom design services. This means OEM customers can have already integrated application-ready platforms at the board and system levels as standard products, or customized and made to order. In addition to this individual hardware development service at the board and system level, the company will provide extensive services during software development, ranging from driver development and OS code modifications to extensive application porting and validation services, as well as HW/SW bundles and volume licensing. Application developers are able to benefit from efficient migrations, quick time to market, and significantly reduced development costs, because they receive an „application ready platform,“ which if required is already certified. This enables customers to fully concentrate on their core competence: application development. It goes without saying that all ARM-relevant operating systems are supported. In addition to Windows CE 6 and Windows Embedded Compact 7 (WEC7), Linux-based operating systems will be supported as well as Android on ARM products. VxWorks support will be conceived for TI processors. This is of particular interest for applications requiring maximum availability and real time behaviour. As is the case with x86-based products, Kontron ARM products will also support the ARM native version of Windows 8 as per availability on the part of Microsoft. Support for Android, which is still a relatively young OS popular in the smartphone and tablet market, allows it to open up the door to the huge market of networked, multimedia-oriented applications based on ARM technology. BSPs will be validated for the OS right up to the system level. OEMs are therefore able to focus on the application without having to traverse a learning curve. This keeps the time to market and TCO to a minimum. The small form factor Pico-ITX format (100mm x72mm) board, which is currently in development and planned for Q1/2012, is fitted with a 1 GHz NVIDIA Tegra 2 dualcore processor. It offers a completely passive cooling concept and a very low power consumption of 3 watts in addition to an attractive feature set. The ARM Cortex A9 architecture based mini-board includes 10/100Mbit Ethernet, three USB 2.0 ports, 16 freely configurable GPIOs and a slot for Micro SD cards as well as 512MB or 1GB 32-bit DDR-2 RAM. The audiovisual experience is not to be overlooked: the integrated ultra-low power (ULP) NVIDIA GeForce GPU delivers a graphic performance for mobile devices in high play console quality and provides up to two simultaneous HD video streams (1080 p). Displays are connected via DVI-I for analog and digital signal transmission as well as via two DSI and a 24-bit LVDS converter. Backlight support is either 5V internal or 12V external. Audio is supported with SPDIF as well as stereo line-in and line-out and MIC. Extensive hardware accelerators for flash, video and audio CODECs provide flowing and brilliant playback of countless multimedia and web contents. The extremely compact (50 mm x 82 mm) ARM computer-on-module, which is currently in development and planned for Q1/2012, is based on the Texas Instruments AM387x single core processor with ARM Cortex A8 and up to 1 GB DDR3 RAM. It integrates the high performance SGX530 3D graphic engine for resolutions up to 1080p at 60Hz and can thus even drive large-sized panels in Full HD. Video interfaces include LVDS, embedded DisplayPort (eDP) as well as HDMI 1.3 via a MXM 3.0 connector. I2S provides a loss-free transmission of digital multi-channel sound, which is important for example in infotainment or multimedia kiosk/POI applications. Its further I/O features predestine the future Kontron module for deployment in vehicles or in the industrial sector: 2x CAN (CAN version 2 Part A, B) as well as Gigabit Ethernet facilitate IT and field integration. Two MIPI- CSI (mobile industry processor interface) conformal camera inputs are also included, which can for example be used in medical applications as well as for optical quality control, gesture-based control for HMIs and for personal identification at kiosk systems. For application-specific extensions, the ARM module includes a PCI Express Gen 2.0 Lane March 2012 22
SMALL FORM FACTOR BOARDS Figure 3. The new COM specification includes an extremely flat MXM 3.0 connector, with a height of only 4.3 mm. With 314 available pins, it offers a multitude of IO functions for SOC and ARM performance class processors and 3x SDIO, which can for example connect WiFi or 3G/4G modules. 2x USB 2.0 and 2x SPI are also included, which can be used to connect a touch screen. As a matter of interest, there is also an option to use the USB as a client. In such applications the module is attached as peripheral device to a host system. Areas of application include anywhere where complex periphery is required with decentralized intelligence, or where system functions are to be read for parametrization via USB. For a quick start in application development, Kontron will provide an appropriate carrier board with two SDIO slots. Kontron also undertakes application-specific carrier board development including all the necessary testing, certification and basic software right up to complete system integration. This enables OEMs to fully concentrate on application development with the new ARM-based modules. n Product News n VIA: Mini-ITX boards feature QuadCore E-Series processor VIA Technologies announced quad core Mini-ITX boards featuring the latest VIA QuadCore E-Series processor. The VIA EPIA-M900 and VIA EPIA-M910 are the first two Mini-ITX boards to feature the 1.2GHz VIA QuadCore E-Series processor, offering enhanced multi-tasking and superb multimedia performance on the lowest quad core power budget for next generation embedded products. The VIA QuadCore E-Series processor features a highly optimized, energy efficient multi-core architecture, which is natively 64-bit compatible and comes with a host of additional performance features including Adaptive Overclocking. Measuring 17 x 17cm the EPIA-M900 Mini-ITX board features the choice of a 1.2GHz VIA QuadCore E-Series processor or a 1.6GHz dual core VIA Nano X2 E-Series processor. News ID 15184 n congatec: COM Express Type 6 module with high graphics performance congatec announces the conga-TS67, a new low-power module for advanced designs. It supports Pin-out Type 6 and provides improved display options along with increased bandwidth thanks to digital display interfaces and additional PCI Express lanes. With new, super low-power Intel processors soldered on in a BGA package, the module is suitable for vibration-resistant applications. News ID 15045 23 March 2012
Page 1: COVER STORY Special Features n Rugg
Page 4 and 5: COVER STORY Want VPX? Try CompactPC
Page 6 and 7: COVER STORY Figure 3. CompactPCI Pl
Page 8 and 9: COVER STORY Figure 5. Airmax connec
Page 10 and 11: EMBEDDED WORLD REVIEW n One Stop Sy
Page 12 and 13: RUGGED EMBEDDED SYSTEMS Small form
Page 14 and 15: RUGGED EMBEDDED SYSTEMS form factor
Page 16 and 17: RUGGED EMBEDDED SYSTEMS High-end hy
Page 18 and 19: RUGGED EMBEDDED SYSTEMS Vehicle com
Page 20 and 21: SMALL FORM FACTOR BOARDS Strategic
Page 24 and 25: AVIONICS Adding MIL-STD-1553 to any
Page 26 and 27: AVIONICS Embedded video takes airbo
Page 28 and 29: PRODUCT NEWS n Kontron announces su
Page 30 and 31: PRODUCT NEWS n BVM: low cost isolat

in PDF Format - Embedded-Control-Europe.com

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?