Customer Information Manual - Kodak

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CIM — Kodak Thermal Platinum Digital Plates V1.4 DECEMBER 2008 PAGE 10 OF 17 Slight Fog Fogged Fogged No Fog • Verify replenishment rate is at 10-12mls/ft² as per SOP (current settings should suffice) • Verify Anti-Ox is active and set to 5-7mls/ft² or as determined by customer use • If postbake oven is present, temperature and oven speed will need to be adjusted to match the faster processing speeds; a postbake chemical resistance test will need to be done to verify that the product stands up to more than five minutes of chemical attack; 425°F is a good starting point • In some cases, the rinse/gum unit will need a sprocket replacement kit to allow it to run at the faster processing speeds (Quartz Sprocket Kit #MDK0011) Note: Determine the fog point for each plate size. If a number of different plate sizes are being used, knowing the fog point for each size will allow you to determine if one pre-heat oven temperature setting will work for all plate sizes. Follow steps 1 through 5 and record the fog point for each plate size in the following table. Plate Fog Point Temp Operating Temp (fog –20°F) Plate#1 °F °F Plate#2 °F °F Plate#3 °F °F Average °F °F
5.2 Postbake Oven Setup Conventional Oven (Wisconsin) If postbake oven is present, temperature and oven speed will need to be adjusted to match the faster processing speeds; a postbake chemical resistance test will need to be done to verify that the product stands up to more than 10 minutes of chemical attack; 450°F is a good starting point. • Initial set point CIM — Kodak Thermal Platinum Digital Plates V1.4 DECEMBER 2008 PAGE 11 OF 17 o Kodak Q Plate Processor @ 16 sec dip-to-nip 450° F o Kodak Mercury P-HD Plate Processor @ 16 sec dip-to-nip 500° F • If plate is showing signs of too much waviness, drop the temperature in increments of 5°F until waviness is close to being gone • Plate will change to a dark green color when postbaked correctly (not golden brown) • Postbaking will help with not only chemical resistance, but with mechanical wear In some cases, the rinse/gum unit will need a sprocket replacement kit to allow it to run at the faster processing speeds (Sprocket Kit) Infrared Oven (Kodak Quick Bake Oven) If postbake oven is present, temperature and oven speed will need to be adjusted to match the faster processing speeds; a postbake chemical resistance test will need to be done to verify that the product stands up to more than 10 minutes of chemical attack. • Initial set point o Kodak Q Plate Processor @ 22 sec dip-to-nip 45% o Kodak Mercury P-HD Plate Processors @ 22 sec dip-to-nip 55% • If plate is showing signs of too much waviness, drop the temperature in increments of 5% until waviness is close to being gone • Plate will change to a dark green color when postbaked correctly (not golden brown) • Postbaking will help with not only chemical resistance, but with mechanical wear In some cases, the Quickbake will need a speed mod upgrade to allow for faster speed throughput.
Page 1 and 2: CIM — Kodak Thermal Platinum Digi
Page 3 and 4: 1.0 Operating, Handling & Storage C
Page 5 and 6: 3.0 Thermal Platinum Plate Chemistr
Page 7 and 8: Non-Standard Speed Settings Setting
Page 9: CIM — Kodak Thermal Platinum Digi
Page 13 and 14: 6.1 Chemical Compatibility Chemical
Page 15 and 16: Appendix B Processing Line Maintena
Page 17: • Circulate for 30 minutes - Do n

Customer Information Manual - Kodak

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