Customer Information Manual - Kodak

4.0 Processor Set-Up and Configuration
Ensure that your processor is installed and set up correctly. Incorrect processor installation or set-up can
compromise imaging quality. The developer anti-oxidation cover and processor lids are to be in place at
all times during operation to reduce the oxidation of the developer that could lead to shifts in developer
conductivity and activity.
System latitude
Higher-throughput platesetter devices image the media at a faster surface speed. Frequency Modulated
(FM) screening also places extra demands on the plate making system (plate, imaging, and processing
line). Consideration of these two scenarios needs to be made as they can reduce the overall latitude of
the plate making system. It is important to ensure each part of the system is optimized and maintained
to give the widest possible latitude.
4.1 Processor Configuration
Standard Speed Settings
Settings Processor
Dwell time (Dip To Nip) 16 seconds (+/-1 second)
Brush developer rollers speed and
configuration
Developer exit configuration Developer
Developer temperature Aim 24°C
CIM — Kodak Thermal Platinum Digital Plates V1.4
DECEMBER 2008
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Maximum speed setting
Two developer brush rollers in developer section
Range 23°C to 25°C
Replenisher Kodak MX-1919 Plate Regenerator, CCU setup remains
the same
Developer replenishment rate 10-12 ml/ft², select per plate if using the QDM
Anti-Oxidation replenishment Every hour @ 5-7ml/ft²
Developer cycle 1500ft²/gallon
Expected developer life 6 Weeks
Prebake solution life 7 working days. Replenish with full strength as needed.
Finisher solution life 7 working days. Replenish with full strength as needed.
Dual processing Yes