AMC D0.9 Short Spec - picmg

PICMG AMC.0 

Advanced Mezzanine Card Short Form Specification 

June 15, 2004 

Version D0.9a 

Do Not Specify or Claim Compliance to the Draft Specification

® Copyright 2004, PCI Industrial Computer Manufacturers Group. 

The attention of adopters is directed to the possibility that compliance with or adoption of PICMG ® specifications may require use of an invention 

covered by patent rights. PICMG ® shall not be responsible for identifying patents for which a license may be required by any PICMG ® specification or 

for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG ® specifications are prospective 

and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents. 

NOTICE: 

The information contained in this document is subject to change without notice. The material in this document details a PICMG ® specification in 

accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this 

specification in any company's products. 

WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG ® MAKES NO WARRANTY OF ANY KIND, 

EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP, 

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loss of profits, revenue, data or use, incurred by any user or any third party. 

Compliance with this specification does not absolve manufacturers of AdvancedTCA equipment from the requirements of safety and regulatory 

agencies (UL, CSA, FCC, IEC, etc.). 

The PICMG ® and CompactPCI ® names and the PICMG ® , CompactPCI ® , and AdvancedTCA ® logos are registered trademarks and ATCA is a 

trademark of the PCI Industrial Computer Manufacturers Group. 

All other brand or product names may be trademarks or registered trademarks of their respective holders. 

PICMG AMC.0 Short Form Specification Version D0.9a 

Page 1 of 57

Introduction and objectives 1 

1.1 Overview 

The PICMG ® Advanced Mezzanine Card (AMC) specification defines the base-level requirements for a wide-range 

of high-speed mezzanine cards optimized for, but not limited to, AdvancedTCA ® Carriers. This base specification 

defines the common elements for each implementation including mechanical, management, power, thermal, and 

interconnect. Subsidiary specifications will define the usage requirements for each interface implementation. Target 

interfaces include PCI Express, Advanced Switching, Serial RapidIO, and Gigabit Ethernet. 

1.2 Introduction 

AMC defines a modular add-on or “child” card that extends the functionality of a Carrier board (see Figure 1-1). 

Often referred to as mezzanines, these cards are called “AMC Modules” or “Modules” throughout this document. 

AMC Modules lie parallel to and are integrated onto the Carrier board by plugging into an AMC Connector. Carrier 

boards may range from passive boards with minimal “intelligence” to high performance single board computers. 

Figure 1-1 Four Single-Width AMC Modules on an ATCA Carrier board 


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AMC enables a modular building block design for both industry standard and proprietary Carrier boards. This AMC 

specification enables larger markets with more unique functions and creates economies of scale that lower prices. 

Mezzanines range in terms of their functionality but typically include the following categories: 

• Telecom connectivity (ATM/POS (OC-3/12/48), T1/E1, VoIP, GbE, etc.) 

• Processors (CPUs, DSPs, and FPGAs) 

• Network communication processors (NPUs) 

• Network communications co-processors (Classification, Security or Intrusion Detection) 

• Mass storage 

1.2.1 Next generation mezzanine standard 

AMC represents the industry’s next generation mezzanine standard supporting high-speed interfaces and 

AdvancedTCA optimization. In the early 1990s, another base mezzanine standard was developed to support parallel 

interfaces and was optimized to support PCI and CompactPCI environments. This earlier specification is the IEEE- 

P1386 Common Mezzanine Card (CMC) specification. Many subsidiary specifications to CMC have been developed 

including: 

• IEEE Std P1386.1-2001 PCI Mezzanine Card (PMC) 

• PICMG 2.15 PCI Telecom Mezzanine/Carrier Card (PTMC) 

• ANSI/VITA 32-2003, Processor PMC (PrPMC or PPMC) 

A new mezzanine specification, rather than an extension of the CMC standard, was required to meet the design 

objectives of high-speed LVDS interface support and AdvancedTCA optimization. As such, AMC is not backward 

compatible with mezzanine standards based on the CMC specification. 

AMC is designed to take advantage of the strengths of the PICMG 3.0 ATCA specification and the Carrier grade 

needs of Reliability, Availability, and Serviceability (RAS). These strengths and needs required a new Hot Swappable 

mezzanine that could either maximize density through the use of Stacked Modules or through the use of greater 

surface area and Component height. In addition, the needs of higher electrical power with higher I/O bandwidth were 

also compelling reasons to launch a new mezzanine base specification. 

1.2.2 Scope 

This AMC.0 specification defines the framework or base requirements for a family of anticipated subsidiary 

specifications. The objective of this document is to define the requirements for mechanical, thermal, power, 

interconnect (including I/O), system management (including hot swap), and regulatory guidelines. It includes the 

definitions and requirements for Face Plates with ejectors, defined component spaces, complete mechanical 

dimensions, thermal definitions, mounting, guides, and a connector necessary to interface between the Module and 

the Carrier board will also be defined. 

AMC.0 will not define specific interconnect usage, although it will be optimized for current and emerging High- 

Speed LVDS Interconnect standards, such as PCI Express, Advanced Switching, Serial RapidIO, and Gigabit 

Ethernet. These interconnect definitions will be specified through further subsidiary work. 

1.2.3 Design goals 

This PICMG AMC specification was written with the following design goals in mind: 

• PICMG 3.0 optimized: All elements must work within the bounds of the PICMG 3.0 base specification 

and build upon its strengths of Reliability, Availability, and Serviceability (RAS). The AMC Module will 

not be limited by other chassis standards. 

• System management: System management will be an extension of the PICMG 3.0 Shelf management 

scheme. 


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• Hot Swap support: Hot Swap of AMC Modules will be enabled in support of Availability and 

Serviceability objectives. The focus will be on front loadable Hot Swap Modules with non Hot Swap being 

an optional implementation. 

• Low Voltage Differential Signaling (LVDS) interconnect: AMC will be optimized for High-Speed 

LVDS interconnects. 

• Low pin count: The interconnect will be conservative in its total pin count, thereby reducing the amount 

of space required on both the Module and the Carrier board, yet provide sufficient real estate for intended 

interconnects and usage models. 

• Support for a rich mix of processors: This includes compute processors (CPUs), network processors 

(NPUs), digital signal processors (DSPs), and input/output (I/O). 

• Reduced development time and costs: The reduced total cost of ownership will be accomplished through 

component standardization and by driving economies of scale. 

• Communications and embedded industry focus: Target usage includes support for edge, core, transport, 

data center, wireless, wireline, and optical network design elements. 

• Modularity, flexibility and configurability: Support for a minimum of four Modules across a given 

ATCA Carrier, dual width mezzanines, and stacked mezzanines. 

• Future advances in signal throughput: Anticipate advances in interconnect technologies by supporting a 

minimum of 12.5 Gbps throughput per LVDS signal pair. 

1.2.4 Theory and operation of usage 

Each AMC Module is designed to be Hot Swappable into an AMC Connector, seated parallel to the host Carrier 

board. The Carrier Face Plate is to provide one or more slot openings through which the Modules are inserted into 

AMC Bays. Module Guide Rails support the insertion of the Modules into the AMC Connectors (see Figure 1-2). The 

AMC Bay opening provides mechanical support as well as EMI shielding. 

Connectivity between the AMC and the Carrier is provided via a one-part, replaceable connector that is attached to 

the Carrier board. The connector resides on the Carrier board at the rear of the AMC Module. 

The Module’s I/O can be via the Face Plate or via the AMC Connector. If the I/O is through the Connector, the I/O 

may also be routed to the host’s backplane or RTM (Rear Transition Module), as is commonly done on ATCA 

systems. 

The AMC specification defines usage requirements for a single Carrier board and single ATCA (or proprietary) 

chassis slot implementation. 


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Figure 1-2 General orientation and insertion of AMC Modules 

Single-Width, 

Full-Height 

AMC Module 

AMC Connector 

AMC Guide Rails 

Note: 

Figure 1-2 is shown without the Side 1 Component Cover. 

1.2.4.1 Multi-Width modules 

AMC supports two Module width definitions: Single-Width and Double-Width. 

• Single-Width Modules: The standard width for an AMC Module is approximately 74 mm and is referred 

to as a Single-Width Module. A maximum of four Single-Width Modules fit across an ATCA Carrier board 

as shown in Figure 1-2. (Can be abbreviated as 1x Module.) 

• Double-Width Modules: AMC.0 also supports a Double-Width Module whose width is roughly twice that 

of a Single-Width Module at approximately 149 mm. The wider Module enables designs that would 

otherwise not fit on a Single-Width implementation. Double-Width Modules utilize a single AMC 

Connector. A maximum of two Double-Width Modules are designed to fit across an ATCA Carrier board. 

(Can be abbreviated as 2x Module.) 

A mixture of both Single-Width and Double-Width Modules is permitted (see Figure 1-3). It is important to note that 

while most illustrations demonstrate Carrier boards fully populated with AMCs, this is not a requirement. It is also 

important to note that some designs may only support one or two Single-Width AMC Modules. 


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Figure 1-3 Single-Width and Double-Width Full-Height Module Configuration 

Double-Width, 

Full-Height 

Module 

Single-Width, 

Full-Height 

Modules 

Note: 


1.2.4.2 Multi-height Modules 

AMC defines two standard height configurations: Half-Height Modules and Full-Height Modules. 

Full-Height Modules: Full-Height Modules are defined to maximize the amount of component and thermal space 

available on Component Side 1 of the AMC Module. Full-Height Modules cannot be stacked. (See Figure 1-3, 

Figure 1-6, and Figure 1-9.) 

Half-Height Modules: Half-Height Modules are similar to Full-Height Modules, with the exception of reduced 

component space on the Module’s Component Side 1 (See Figure 1-4, Figure 1-7, and Figure 1-8). The term “Half- 

Height” implies that two Modules equally split the maximum height available in a stacked implementation and 

should not be taken literally as being half of a Full-Height Module. 

Table 1-1 presents a general analysis of the different types of connectors that fit on both Half-Height and Full-Height 

Modules. 

Table 1-1 Connectors that fit Half-Height and Full-Height Modules 

Connector types Full-Height Half-Height 

XPAK (low profile) Yes (1 on a 1x; 3 on a 2x) Yes (1 on a 1x; 3 on a 2x) 

XPAK2 (X2 MSA) 

(low profile) 

Yes (1 on a 1x; 3 on a 2x) 

Yes (1 on a 1x; 3 on a 2x) 

(Subject manufacturer 

specified pin length) 

XENPAK Yes (1 on a 1x; 3 on a 2x) No 

SFP (MiniGBIC) Yes (4 max. -1x) Yes - (4 max.-1x) 

RJ-45 Yes (4 max. -1x) Yes - (4 max.-1x) 


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Table 1-2 presents a general assessment of a variety of AMC Modules that would typically be expected to fit on the 

configurations identified. 

Table 1-2 Sample Module configurations and functionality 

AMC Module configurations 

Single-Width, Half-Height 

Single-Width, Half-Height and 

Full-Height 

Double-Width, Half-Height and 

Full-Height 

Example functionality 

Disk Drive, DSP Array, FPGA Array, Encryption Engine, T1/E1/J1 Line 

Cards, T3/E3 Line Cards, OC-3/12/48 Line Cards, GbE WAN Cards, 

10 GbE Optical WAN Card, InfiniBand WAN Card, Memory Arrays 

CPU Boards, DOCSIS Cable Modem, Baseband Modem, Radio Cards 

NPU Boards 

1.2.4.3 Carrier types 

AMC supports three types of Carrier board configurations. 

• Conventional Carriers: The term Conventional Carrier refers to a full Carrier board without any required 

cutouts and allows components to be placed on the Carrier below AMC Modules. Conventional Carriers 

support both Full-Height and Half-Height Modules (see Figure 1-6 and Figure 1-7). Conventional Carriers 

also support up to four Single-Width or two Double-Width Modules across an ATCA Carrier board. 

• Cutaway Carriers: The term Cutaway Carrier is derived from the fact that the Carrier board below the 

AMC Modules must be cut-away to support Stacked Modules (see Figure 1-4). By cutting the Carrier 

Board, this permits the maximum component height possible for Half-Height Modules and ensures the 

needed space for I/O interfaces on the Face Plate (see Figure 1-8). Full-Height Modules can be inserted 

into the upper Bay of a Cutaway Carrier when the lower Bay is unoccupied (see Figure 1-9). Cutaway 

Carriers can support up to eight Single-Width, Half-Height Modules (see Figure 1-4) or four Double- 

Width, Half-Height Modules across an ATCA Carrier board. A maximum stacking of two Modules is 

permitted. 

• Hybrid Carriers. Hybrid Carriers combine both Conventional and Cutaway Carrier sites on a single 

Carrier board. 


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Figure 1-4 Single-Width, Stacked Modules on a Cutaway Carrier 

Note: 


1.2.4.4 Connector types 

AMC.0 defines two fundamental Connector types to support Single-Layer and Stacked Module implementations: B 

and AB. 

• B Connector:The B Connector is used in association with Conventional Carriers and can support a Single- 

Layer Module implementation. Both Full-Height and Half-Height Modules are supported (see Figure 1-6 

and Figure 1-7). 

• AB Connector:The AB Connector is used in association with Cutaway Carriers and supports up to two 

Stacked Half-Height Modules or one Single-Layer Full-Height Module in the upper Bay when the lower 

Bay is not occupied. (See Figure 1-8 and Figure 1-9). 

Figure 1-5 Overview of AMC Connector housings 

86 

85 

86 

Slot B 

85 

86 

Slot A 

85 

170 

1 

170 

85 

85 

1 

1 

170 

1 

Style B/B+ 

1 

Style AB 

Style A+B+ 


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1.2.4.4.1 Basic and Extended Connectors 

AMC Modules use a card-edge connection style, which consists of conductive traces at the edge of the Module PCB. 

The conductive traces at the edge of the AMC act as male pins, which mate to a female connector mounted on the 


AMC supports two Connector styles in association with the B and AB Connectors: Basic and Extended. 

• Basic Connector: The term “Basic” is associated with AMC Connectors that are equipped with 

conductive traces on only one side of the Connector. This provides cost and real estate savings for designs 

that do not need a large amount of I/O connectivity. The mating Connector for the single-sided design 

contains 85 pins and is designated simply as either B or AB. (See Figure 1-5.) 

• Extended Connector: The Extended Connector is equipped with conductive traces on both sides of the 

Module edge. The mating connector for the two-sided design contains 170 pins per AMC Connector and is 

designated with a “+” following the connector type (e.g., B+ and A+B+). 

1.2.4.5 Module Orientation on a Conventional Carrier 

AMC Modules on a Conventional Carrier are placed such that Component Side (B1) of the Module faces the Carrier 

board (see Figure 1-6). The mechanical envelope is optimized for Single-Layer Full-Height Modules, which allow 

for taller components towards the front portion of the Module. This mechanical envelope is maintained for both Full- 

Height and Half-Height Modules so as to encourage industry interoperability (see Figure 1-7). Additional 

components may be placed on Component Side 2 (B2) of the Module. 

Figure 1-6 Full-Height Module orientation in a Conventional Carrier 

Module B 

Component Side B1 


B/B+ 

Connector 

Conventional Carrier 

Carrier Board Components 

Figure 1-7 Half-Height Module orientation in a Conventional Carrier 

Module B 



B/B+ 

Connector 

Conventional Carrier 

Carrier Board Components 

1.2.4.6 Module orientation on a Cutaway Carrier 

Cutaway Carriers are designed to enable Stacked Half-Height Modules. The Stacked Modules are oriented such that 

Component Side 1 of each AMC Module faces in the same direction towards where the Carrier board would be. 

Additional Components may be placed on Component Side 2 (A2 or B2) of each AMC Module (see Figure 1-8). 

Cutaway Carriers also may support a Single-Layer Full-Height Module in the B/B+ layer only (see Figure 1-9). 


Page 9 of 57

Figure 1-8 Stacked, Half-Height Module orientation in a Cutaway Carrier 

Modules 

A B 


Component Side A1 


Component Side A2 

AB/A+B+ 

Connector 

Cutaway Carrier 

Figure 1-9 Single-Layer, Full-Height Module in Cutaway Carrier 


AB/A+B+ 

Connector 

Module B 



1.2.4.7 Component Covers 

A metal encasement above (Side 1 Component Cover) and below (Side 2 Component Cover) the AMC configuration 

provides the additional strength and rigidity needed, as well as support for AMC Guide Rails (see Figure 1-1.) These 

plates are required for both Conventional and Cutaway Carrier configurations wherever AMC Bays are located. 

1.2.4.8 Module management 

Module management is optimized for an ATCA environment. Other platforms may require extensions to 

accommodate the AMC Modules. A management controller is located on every mezzanine which supports a minimal 

subset of IPMI commands. The intent of this subset of commands is to minimize both the size and the cost of the onboard 

controller. This specification also provides unique geographical address lines for each Module’s IPMI address. 

The Module’s management controller communicates with the Carrier board using IPMB. 

1.3 Conformance 

Do not specify or claim compliance with this Short Form version of the AMC.0 D0.9a Specification. See the 

complete specification for guidelines regarding any statement of compliance. 

1.4 Unit measurements 

1.4.1 Dimensions 

All dimensions in this standard are in millimeters (mm) unless otherwise specified. Drawings are not to scale. 

1.4.2 Pressures and airflows 

Pressures and airflows are in English units 


Page 10 of 57

1.5 Reference specifications 

The following publications are used in conjunction with this standard. When any of the referenced specifications are 

superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective 

organizations. 

• AdvancedTCA Base Specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001 

• ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) 

Interface Circuits, January 1, 2001 

• IPMI – Intelligent Platform Management Bus Communications Protocol Specification V1.0 Document 

Revision 1.0, November 15, 1999 Copyright © 1998, 1999 Intel Corporation, Hewlett-Packard Company, 

NEC Corporation, Dell Computer Corporation. All rights reserved. 

• IPMI – Intelligent Platform Management Interface Specification, v1.5. Document Revision 1.1, February 

20, 2002. Copyright © 1999,2000, 2001, 2002 Intel Corporation, Hewlett-Packard Company, NEC 

Corporation, Dell Computer Corporation. All rights reserved. 

• IPMI – Platform Event Trap Format Specification V1.0 Document Revision 1.0, December 7, 1998 

Copyright © 1998, Intel Corporation, Hewlett-Packard Company, NEC Corporation, Dell Computer 

Corporation. All rights reserved. 

• IPMI – Platform Management FRU Information Storage Definition, V1.0 Document Revision 1.1, 

September 27, 1999 Copyright © 1998, 1999 Intel Corporation, Hewlett-Packard Company, NEC 

Corporation, Dell Computer Corporation. All rights reserved. 

• IPMI – Wired for Management Baseline, Version 2.0. 

• PICMG ® Policies and Procedures for Specification Development, Revision 1.5, October 5, 2001, PCI 

Industrial Computer Manufacturers Group (PICMG ® ), 401 Edgewater Place, Suite 500, Wakefield, MA 

01880 USA, Tel: 781.224.1100, Fax: 781.224.1239, www.picmg.org 

1.6 Special word usage 

This document uses the following key words: 

may:Indicates the flexibility of choice with no implied preference. 

should:Indicates flexibility of choice with a strongly preferred implementation. The use of should not (in bold text) 

indicates flexibility of choice with a strong preference that the choice or implementation be prohibited. 

shall:Indicates a mandatory requirement. Designers shall implement such mandatory requirements to ensure 

interoperability and to claim conformance with this specification. The use of shall not (in bold text) indicates an 

action or implementation that is prohibited. 

1.7 Intellectual property 

Lucent Technologies has a patent, US #6646890, referring to “Mounting of mezzanine circuit boards to a base 

board.” This patent, filed on 9/4/02 and issued on 11/11/03, may cover aspects of the guide mechanisms that are 

detailed in the AMC.0 specification. 

1.8 Glossary 

Definitions of terms and acronyms as they are used in this document have been grouped as follows: 

• Table 1-3, “AMC Carrier specific terms” 

• Table 1-4, “AMC Module specific terms” 


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• Table 1-5, “AMC Connector or Interface specific terms” 

Table 1-3 AMC Carrier specific terms 

Term or acronym 

AMC Carrier or 

Carrier 

AMC Bay or Bay 

Component Cover 

Conventional 

Carrier 


Hybrid Carrier 

Partial Carrier 

Description 

“AMC Carrier” is used to describe Carrier boards that support AMC Modules. The 

abbreviated “Carrier” may optionally be used when the context of AMC is well 

understood. 

An AMC Bay is a single AMC site on an AMC Carrier and can support either Stacked 

or Single-Layer Modules. 

Board Covers provide mechanical rigidity for the Carrier boards as well as a place to 

mount the Module Guide Rails and the AMC connector body. Conductive board 

covers are required on both sides of all AMC Carrier board configurations and are 

referred to as Side 1 Component Cover and Side 2 Component Cover. 

The term Conventional Carrier refers to a full Carrier board without any required 

cutouts and allows components to be placed on the Carrier below AMC Modules. 

Conventional Carriers support both Full-Height and Half-Height Modules (see 

Figure 1-5 and Figure 1-6). Conventional Carriers also support up to four Single- 

Width or two Double-Width Modules across an ATCA Carrier board. 

The term Cutaway Carrier is derived from the fact that the Carrier board below the 

AMC Modules must be cut away to support Stacked Modules (see Figure 1-4). 

Cutting the Carrier Board permits the maximum component height possible for Half- 

Height Modules and ensures the needed space for I/O interfaces on the Face Plate 

(see Figure 1-7). Full-height Modules can be inserted into the upper Bay of a 

Cutaway Carrier when the lower Bay is unoccupied (see Figure 1-8). Cutaway 

Carriers can support up to eight Single-Width, Half-Height Modules (as shown in 

Figure 1-4) or four Double-Width, Half-Height Modules across an ATCA Carrier 

board. A maximum stacking of two Modules is permitted. 

An AMC Carrier that has both Conventional and Cutaway sites and includes both 

B/B+ and AB/A+B+ connector types. Assumes the Carrier board is fully populated 

with AMC Modules. (Also, see Partial Carrier.) 

Any AMC Carrier that is not fully populated with AMC Modules (e.g., a Carrier that 

includes only two AMC Bays). The following Partial Carrier types are possible: Partial 

Conventional Carrier, Partial Cutaway Carrier, and Partial Hybrid Carrier. 

. 

Table 1-4 AMC Module specific terms 


AMC Module or 

Module 

Double-Width 

Module 

Full-Height 

Module 

Half-Height 

Module 

Module Guide Rail 

Single-Layer 

Module 

Description 

An AMC Module (or Module) is a modular add-on or “child” card that extends the 

functionality of a Carrier board. An AMC Module can also be referred to as a 

mezzanine. The term is also used to generically refer to the different varieties of 

Multi-Width and Multi-Height Modules. 

A Module that is roughly twice the width of a Single-Width AMC Module and requires 

two AMC Bays. A maximum of two Double-Width Modules are designed to fit across 

an ATCA Carrier. 

Full-Height Modules allow for taller components on Component Side 1 of the Module 

but otherwise are identical to Half-Height Modules. 

The component height on Component Side 1 of Half-Height Modules is optimized to 

allow for two Stacked Modules to equally split the maximum height (ATCA pitch) 

available. The term Half-Height should not be taken literally as being half of a Full- 

Height Module. 

Guide Rail utilized by AMC Modules to facilitate insertion into the AMC Bay and to 

help facilitate Hot Swap of Modules. 

Used to describe the presence of a single AMC Module in an AMC Bay and is always 

used in connection with Full-Height Modules. 


Page 12 of 57

Table 1-4 AMC Module specific terms (Continued) 


Single-Width 

Module 

Stacked 

Modules 

Description 

The standard (1x) width of an AMC Module that fits into a single AMC Bay. 

Used to describe two Half-Height Modules that are “stacked” one above another 

using an AB/A+B+ Connector. 

. 

Table 1-5 AMC Connector or Interface specific terms 


A Layer 

AB/A+B+ 

Connector 

AMC Connector or 

Connector 

B Layer 

Basic Connector 

Basic Side 

B/B+ Connector 

Contact List 

Connector Brace 

Extended 

Connector 

Extended Side 

LVDS or 

High-Speed LVDS 

Link 

M-LVDS 

Port 

Description 

Module orientation when inserted into the lower Bay of an AB/A+B+ Connector. It is 

located in the cutout section of a Cutaway Carrier and is utilized by Half-Height 

Modules only. 

An AMC Connector that supports two AMC Bays. The AB designation indicates 

support as Basic Connectors. The “+” designation indicates support as Extended 

Connectors. 

Used to generically refer to AMC defined connectors including B/B+ and AB/A+B+. 

Module orientation when inserted into B/B+ Connector or into the upper Bay of an 

AB/A+B+ Connector. 

Requires conductive traces on only one side of the connector and supports all the 

mandatory aspects of the connector definition including AMC power and 

management. The mating connector for the single-sided design contains 85 contacts 

per Bay and is designated simply as B or AB. The Basic Connector supports 8 ports. 

Refers to the side of the AMC Connector that supports a Basic Connector. 

An AMC Connector that supports a single AMC Bay. The B designation indicates 

support as a Basic Connector. The “+” designation indicates support as an Extended 

Connector. 

Defines the use of each contact and is identical for both the AMC Module and 

Connector. 

A stiffener that is mounted on Component Side 2 of the Carrier board, opposite the 

AMC Connector and used to help prevent the Carrier board from bending. 

Requires conductive traces on each side of the Connector and includes the Basic 

Connector definition. The mating connector for the two-sided design contains 170 

contacts per Bay and is designated with the “+” designation (i.e., B+ and A+B+). 

Refers to the side of the AMC Connector associated with the additional support 

provided by an Extended Connector. 

Refers to Low Voltage Differential Signaling and defined in ANSI/EIA-644-A. 

One or more Ports aggregated under a common protocol. Links are groups of Ports 

that are enabled and disabled by Electronic Keying operations. A xN Link 

(pronounced “by-N link”) is composed of N Ports. 

A later development of LVDS defined in ANSI/TIA/EIA-644. It is specifically designed 

for multi-drop and multi-sourced signaling. 

A set of differential signal pairs, one pair for transmission and one pair for reception. 

(Note: The PCI Express term “Lane” is equivalent to the AMC.0 term “Port”.) 


Page 13 of 57

Mechanical 2 

2.1 Modules 

2.1.1 Module PCB dimensions 

Modules shall have all 170 gold plated pads and pre-pads regardless of whether they are electrically required or not in 

order to protect the contacts of the connectors. 

The Module contacts shall be electroplated 0.4 µm hard gold over 1.3 µm nickel. 

The Module keepout areas shall exclude all components, traces, test points, vias, and features that can form a 

mechanical impediment or provide an electrical conduction including traces protected by solder mask. 

2.1.1.1 Single-Width Module PCB dimensions 

Figure 2-1 Single-Width Module PCB dimensions 


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2.1.1.2 Double-Width Module PCB dimensions 

Figure 2-2 Double-Width Module PCB dimensions 


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2.1.1.3 Module Connector interface dimensions 

Figure 2-3 Module Connector interface dimensions 


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Figure 2-4 Module edge contact detail 

2.1.2 Module component height requirements 

The maximum Module component heights shall not exceed those shown in the profiles in Figure 2-5 and Figure 2-6; 

these show Half-Height Modules with a total component envelope of 11.58 mm and Full-Height Modules with a total 

component envelope of 17.91 mm for the front 100 mm and 15.85 mm for the rear 73 mm. 

Full-Height Modules shall be supported in the B-Layer only. 


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2.1.3 Module Face Plate 

Module Face Plates fulfill a series of tasks: 

• Support for the latch mechanism 

• Mounting surface for I/O connectors 

• EMC containment 

• Mounting and mating of EMC gasket surfaces 

• Mechanical interface to the AMC PCB 

• ESD shield 

• Mounting for LED displays 

• Mounting and display of product information 

2.1.4 Module Face Plate labels 

Figure 2-5 Vendor and PICMG label dimensioning and positioning 


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2.1.5 Carrier PCB dimensions 

2.1.5.1 Cutaway Carrier board dimensions 

Figure 2-6 Cutaway Carrier using AB Connector dimensions 


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2.1.5.2 Conventional Carrier board dimensions 

Figure 2-7 Conventional Carrier board dimensions 

2.1.6 Carrier component height requirements 

All component heights that are not below the Module, with the exception of the AMC Connector, shall conform to all 

PICMG 3.0 specifications or the relevant requirements for other form factors. 


Page 20 of 57

2.1.6.1 Conventional Carriers 

These dimensions are also applicable to the Conventional Carrier portion of Hybrid Carriers. See relevant 

requirements for other form factors. 

Figure 2-8 Conventional Carrier component heights 

2.1.6.2 Cutaway Carriers 

Cutaway Carriers mandate that the Carrier board PCB be removed below the AMC Module sites. Therefore, there are 

no AMC-controlled Carrier board component heights. 

2.1.7 Card guides and struts 

The component covers provide a means of mounting removable and non-removable channels on which the edges of 

Module PCB boards ride in or ride out. These are known as AMC card guides. 


Page 21 of 57

2.1.7.1 A Layer 

Figure 2-9 Card guide A Layer assembly dimensions 


Page 22 of 57

Figure 2-10 A Layer card guide and strut parts dimensions 


Page 23 of 57

2.1.7.2 B Layer 

Figure 2-11 Card guide B Layer assembly dimensions 


Page 24 of 57

Figure 2-12 B Layer card guide and strut parts dimensions 


Page 25 of 57

Module management 3 

3.1 Overview 

The management aspects of Modules are intended to be platform agnostic. Although the Module specification is 

developed with ATCA in mind, it is the intent of the management architecture to support Modules in ATCA-based 

Carrier cards as well as platforms that might be exclusively Module-based or platforms that mix Modules with other 

form factors. In defining the role of the Module in system management it has been the intent of this section to 

minimize the management burden on the Module where space is a premium. Modules are controlled by a 

management controller with minimal functionality called the Module Management Controller or MMC. The 

commands that the MMC must support are intended to be a bare minimum in order to lower the cost of the MMC and 

save space on the Module. The Carrier IPMC communicates with a Module’s MMC using IPMI messages over 

IPMB. This specification provides unique geographical address lines for each Module’s IPMB-L address. 

Figure 3-1 Module Management Infrastructure 

Shelf External System 

Manager 

Shelf 

Manager 

Active 

ShMC 

Shelf 

Manager 

Standby 

ShMC 

ATCA Board 

2x Redundant, Bussed or Radial, IPMB-0 

ATCA Carrier Board 

IPMC 

IPMC 

Bussed or Radial, IPMB-L 

isolator 

isolator 

isolator 

isolator 

MMC 

MMC 

MMC 

MMC 

AMC 




3.1.1 IPMI and IPMB architecture overview 

The Carrier and Module communicate through a limited set of IPMI commands. The intent is to allow the use of 

inexpensive single chip microcontrollers on the Module. This specification requires that the Carrier provide ways to 

isolate the IPMB to each Module. This was done to prevent a Module from bringing down the IPMB. The 

specification also envisions that the Carrier might have multiple IPMBs. For clarity, the term IPMB-0 refers to the 

AdvancedTCA IPMB and the term IPMB-L refers to the IPMB between the Carrier and Module. The IPMB-L could 

either be radial or bussed as desired by the Carrier board designer. The IPMB-0 and IPMB-L are physically separate 

busses and in general the Carrier is responsible for bridging the two as necessary. 


Page 26 of 57

Note: 

Intelligent controllers are referred to as an MMC on an AMC and as an IPMC on Carriers. 

3.1.2 Module and Carrier power architecture overview 

The Carrier provides management and payload power to a Module. Management power is used to power the 

management circuitry in the Module. The management circuitry includes the MMC, and pullups for IPMB-L and 

ENABLE#. Management power is current-limited by the Carrier. An MMC reset is provided from the Carrier. The 

Carrier will hold the MMC in reset until the Module is fully inserted. The MMC reset can also be controlled by the 

Carrier in the event that it becomes necessary to reset the MMC. Payload power (PWR) is the power provided to the 

Module from the Carrier for the main function of the Module. The Module FRU information contains records that 

define the PWR requirements for the payload. A Carrier will enable PWR if it determines that enough power and 

cooling exist to support the Module. 

3.2 Module management interconnects 

Figure 3-2 shows the interconnections between the Module and Carrier. Note that active low signals are denoted with 

a trailing #. All logic levels are assumed to be 3.3 V compatible unless noted. 

Figure 3-2 Interconnections between Carrier and Module 

GA_PULLUP 

Module 

MP 

Carrier 

Module 

Management 

Pow er 

MMC 

3.3K 33K 

10K 

GA[2..0] 

IPMB-L 

2.2K 

IPMB-L_Isolator 

RESET# 

ENABLE# 

Reset_MMC# 

From IPMC 

PS1# 

PS0# 

3.2.1 Geographic address [2..0] (GA[2..0]) 

There are three geographic address pins which are used to assign the address of the Module on the local IPMB-L. 

Each of the GA pins can encode three different levels. The GA (Geographic Address) lines can be connected to 

ground, to management power, or left unconnected on the Carrier to define the geographic address of the Module. 

This scheme requires that the Module be able to distinguish between the three states. The states of the GA bits can be 

G (grounded), U (unconnected), and P (pulled up to management power). 


Page 27 of 57

3.2.2 PS0# and PS1# 

PS0# and PS1# pins are used to detect the presence of a Module in a Carrier. The PS pins are last mate pins located on 

opposite sides of the connector. These pins are used to de-skew the connector and provide an indication that all pins 

on the Module connector have mated. The Carrier connects PS0# to GND and PS1# to a management power pullup 

resistor. The Module provides a low resistance path between PS0# and PS1#. The Carrier can detect the presence of a 

Module by a low on PS1#.The Module can determine insertion into a Carrier by the Carrier’s feedback of PS0# and 

PS1# on ENABLE# as well as current flowing through the PS0# - PS1# connection. 

3.2.3 ENABLE# 

The Enable pin is an active low input to the Module pulled up on the Module to management power. This signal is 

inverted on the Module to create an MMC RESET# signal. This input indicates to the Module that the Module is fully 

inserted and valid states exist on all inputs to the Module. The MMC is not allowed to read the GA inputs or use the 

IPMB-L while ENABLE# is inactive. Note that the payload power decisions are made by the higher level entity and 

the Carrier executes that decision. 

3.2.4 IPMB-L 

The IPMB-L is made up of clock (SCL_L) and data (SDA_L) signals. These signals are to be considered valid by the 

Module when ENABLE# is active. Each Module receives an isolated copy of the IPMB-L. This isolated IPMB can be 

provided using FET type switches or I 2 C buffers. 

3.2.5 BLUE LED 

The BLUE LED is local to the Module. The BLUE LED is mounted on the front of the Module and is used to provide 

basic feedback to the user on the Hot Swap state of the Module. The BLUE LED states are off, short blink, long blink, 

and on. Once management power is available to the Module, the BLUE LED is turned 100% on as soon as possible. 

3.2.6 LED 1 (mandatory) 

LED 1 typically provides basic feedback about failures and out of service. 

3.2.7 Hot Swap switch 

The Hot Swap switch input connects to the mechanical latching mechanism. This switch is used to indicate a request 

for a pending extraction. This switch is pulled up to management power so that it can be read when payload power is 

not applied. The Module sends an IPMI platform event message to the Carrier when the Hot Swap switch changes 

state. 

3.2.8 Payload reset 

The payload reset is local to the Module. This signal is used by the MMC to reset the payload when a FRU Control 

command is issued by the Carrier IPMC. 

3.2.9 Watchdog timer 

A watchdog timer is provided to reset the MMC in the event that the MMC is unresponsive. The watchdog could be 

integrated into the MMC. This specification does not mandate what the watchdog checks; just that a watchdog be 

provided to reset an unresponsive MMC. Note that the state of the payload cannot be impacted if an MMC watchdog 

timer reset occurs. 


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3.3 Module management-hardware requirements 

This section defines the requirements for the interconnects as seen by the Module. Figure 3-3 presents a simplified 

block diagram showing the Module interconnects for clarity. 

Figure 3-3 Module to Carrier hardware 

Module 

GA_PULLUP 

Carrier 

MP 

Hot Swap Switch 

300 Ohm 10 K 

MMC 

3.3 K 

33 K 

10 K 

GA[2..0] 

IPMB-L 

Blue LED 

RESET# 

ENABLE# 

PS1# 

PS0# 

3.4 Carrier management-hardware requirements 

This section defines the interconnect requirements for the Carrier. Figure 3-4 shows a simplified version of the 

interconnects on a Carrier for clarity. 

Figure 3-4 Carrier and Module interconnects 

Module 

Carrier 

MP 

GA[2..0] 

IPMB-L 

2.2K 

Module 

Management 

Power Control 

3.3K 

3.3 V 

IPMB-L Enable 

IPMB 

Isolator 

IPMB-L 

IPMC 

ENABLE# 

Reset_MMC# 

PS1# 

PS0# 


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3.5 Power management 

This specification insists that the power needs of the Module are not part of the Carrier’s power budget and that the 

Modules be treated as separate FRUs and represent their power budget as such. The intelligent power management 

decisions for the Modules are made by the Shelf Manager and the Carrier plays the role of a facilitator cum executor 

of that decision. A converter is viewed as part of the Carrier’s power budget. An additional criteria is the amount of 

power that can be delivered to an AMC site. This is typically limited by the trace width. 

The final criteria in power management is the amount of power that the Module can consume. As explained in the 

AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001, in order to 

make intelligent decisions about when the FRUs (in this case, AMCs) are powered up or down and what power levels 

to assign for each FRU (in this case, AMC), the Shelf Manager must collect several pieces of data. 

• The Carrier data (provided by the Carrier manufacturer) 

–Maximum PWR Current (number 5 in Figure 3-5) that could be that can be delivered to all of the AMC 

sites. This is typically the power rating of the DC-DC converter that generates PWR. 

–Maximum FRU Current (number 6 in Figure 3-5) that could be delivered to a particular Module. This is 

the maximum amount of current that can be delivered to an AMC site in Amps at 12 V. 

• The Module power consumption (provided by the Module manufacturer). 

–The Power consumed by a Module in Amps (number 7 in Figure 3-5). 

Figure 3-5 Power distribution management architecture 

4 

5 

6 

7 

1 

2 

3 

3 

1 Power supplied to the Shelf Power Feed; entered during Shelf installation 

2 Power that can be handled by this Feed; entered by Shelf manufacturer 

3 Max. Power that can be routed to an ATCA Board; entered by Shelf manufacturer 

4 Power required by the ATCA Board; entered by ATCA Board manufacturer 

5 Power available to all AMC sites; entered by ATCA Board manufacturer 

6 Max. Current that can be routed to an AMC site; entered by ATCA Board manufacturer 

7 Power required by the AMC; entered by AMC Board manufacturer 

Shelf 

ATCA Board 


Defined in 

ATCA Spec. 

Defined in 

AMC Spec. 

3.6 Cooling management 

To support a higher level managing entity to appropriately manage the cooling resources, the Module has to provide 

reports of abnormal temperature in its environment. Every Module has to have a temperature sensor to enable the 

Module to report the temperature and this temperature sensor is monitored by the MMC. When an MMC detects that 


Page 30 of 57

a monitored temperature sensor exceeds one or more thresholds or returns to normal, The MMC raises a standard 

IPMI temperature event message and sends it to the event receiver (the Carrier). The Carrier, or a higher level 

managing entity, uses this information to manage the cooling. 

Every Module must contain at least one temperature sensor and an appropriate Sensor Data Record (SDR) to describe 

the sensor. 

3.7 E-Keying 

Electronic Keying is the mechanism by which the mandatory AMC.0 Management infrastructure is used to 

dynamically satisfy the needs that had traditionally been satisfied by various mechanical connector keying solutions: 

• Prevent mis-operation 

• Verify fabric compatibility 

Since the AMC.0 specification does not allow a direct connection between Modules and the Carrier backplane, the 

Carrier must provide one or more switch(es) between the Carrier backplane and the Modules. The IPMC on the 

Carrier is responsible for E-Keying between the Modules and switch(es). E-Keying between switch(es) and the 

Carrier backplane is out of scope of the AMC.0 specification and is covered by PICMG 3.0. 

This section uses the terms Control Interface and Data Fabric Interface. These interfaces are made up of a number of 

ports. The ports allocated to the Control Interface on a Module or Carrier are typically connected to the ATCA base 

interface through an on-Carrier switch. The ports allocated for the Data Fabric Interface would typically connect to 

the ATCA fabric. 

3.7.1 E-Keying process 

The basis for the E-Keying process is the E-Keying entries present as FRU information in the Carrier and all 

Modules. Those E-Keying entries describe the Control Interface, and the Data Fabric Interface implemented by the 

Carrier and Modules. 

3.7.2 Point-to-point E-Keying 

Point-to-point E-Keying covers the Control Interface and Data Fabric Interface. In the Data Fabric, the primary unit 

of point-to-point connectivity is a Port. A Port is two differential pairs (one transmit and one receive). One to four 

Ports can be grouped into a logical AMC Channel that is similar to an AdvancedTCA Channel. An AMC Channel is 

composed of an arbitrary (not necessarily numerically or physically contiguous) set of up to four Ports. In contrast, 

any given AdvancedTCA Channel involves a specific set of contiguous zone 2 connector pins. 

AMC Channels are identified by AMC Channel IDs. In the data structures and commands defined in this section, 

AMC Channel IDs play essentially the same role as Channel numbers in AdvancedTCA E-Keying. AMC Channel 

IDs start at 0 and are numbered sequentially on a given Carrier or Module. In this specification, each Link is mapped 

to a specific AMC Channel and an associated protocol. As in AdvancedTCA, a Link can be composed of several 

AMC Channels (say, to create a x16 PCI Express Link that combines four AMC Channels, each representing a x4 

connection). 

Point-to-Point E-Keying supports two Data Fabric AMC Carrier routing models: the centralized AMC switch model 

and the AMC direct connectivity model. The point-to-point connectivity provided in a Carrier is described in the 

Carrier FRU information. The capabilities of an AMC Module to communicate over point-to-point connections are 

described in the Module’s FRU information. Similar information for the links supported by the on-Carrier switch(es) 

is provided in the Carrier FRU information. In this topic there are references to Switch ID; these refer to the ID 

(number) assigned to an on-Carrier switch. The assignment of the number is arbitrary. 


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3.7.2.1 AMC point-to-point interface information 

One or more AMC point-to-point connectivity records are included in the AMC FRU information and describe the 

connections to the Control and Data Fabric Interfaces that are implemented on the AMC Module. Similarly, one or 

more such records are included in the Carrier FRU information to describe the connections to the Control and Data 

Fabric Interfaces that are implemented by on-Carrier switch(es). These connections, each consisting of some subset 

of the Ports associated with one or more AMC Channels, are generically referred to as “Links”. 

Each AMC point-to-point connectivity record contains AMC Link Descriptors, each of which identifies a Link and an 

associated protocol. 

3.8 Module payload control 

The “FRU Control” command provides base level control over the Module’s payload to the Carrier IPMC. Through 

this command, the Module’s payload can be reset, rebooted, instructed to attain quiescence, or have its diagnostics 

initiated. The exact implementation of these commands will vary according to individual requirements, and all 

command variants with the exception of the “FRU Control (Cold Reset)” and “FRU Control (Attain Quiescence” are 

optional. The “FRU Control” command does not directly change the operational state of the Module as represented 

by the Carrier IPMC (which is typically M4 or FRU Active). 

3.9 Module sensor management 

MMCs have the capability of supporting any of the IPMI or OEM sensor types (analogous to an IPMC on an ATCA 

board). The MMC’s sensors on IPMB-L are visible to the ShMC through the IPMC over IPMB-0. Since the IPMC 

must present unique sensor numbers and sensor LUNs over IPMB-0, it is necessary for the IPMC to translate the 

MMC’s sensor number and sensor LUN to IPMC-wide unique numbers. The IPMC device SDR repository holds a 

combination of its own SDRs and SDRs from MMCs installed on the Carrier. The IPMC adds the MMC’s SDRs into 

its SDR Repository after management power has been enabled to the MMC. Conversely, the MMC’s SDRs are 

removed from the IPMC’s SDR repository after management power has been removed from an MMC. As mentioned 

previously, when an IPMC adds the MMC’s SDRs into its SDR repository, it needs to ensure that the sensor number 

and sensor LUN assigned are unique for the IPMC. 

The IPMC will also need to provide unique FRU IDs for all MMCs on a Carrier. The local FRU ID for an MMC is 

always 0; the IPMC will need to assign unique FRU IDs to all MMCs. MMC SDRs are linked with a Module using 

the entity fields of the SDR; the entity ID identifies that SDR as coming from a Module FRU and the entity instance 

is set to the Module site number to identify the Module on the Carrier. Also refer to Section 3.4.3 in the 

AdvancedTCA base specification document (PICMG 3.0 R1.0) and as amended by ECN 3.0-1.0-001 and to IPMI 1.5 

Chapter 33.1 for more information on IPMI entities. 

The IPMC will need to maintain a table that would be used to translate the IPMC-wide unique sensor number, sensor 

LUN, and FRU ID to the MMC’s sensor number, sensor LUN, and FRU ID. When an IPMC receives a request over 

IPMB-0 for an MMC’s sensor or FRU data, the IPMC substitutes the received sensor number, sensor LUN, or FRU 

ID with the target MMC’s sensor number, sensor LUN, or FRU ID and sends the request over the IPMB-L to the 

MMC. The IPMC then returns the requested data substituting the MMC’s identifying data with the IPMC’s 

identifying data. The IPMC is also responsible for redirecting events generated on IPMB-L to the system event 

receiver on IPMB-0. In doing so, the IPMC substitutes the event generator ID with its own ID and substitutes the 

sensor number and sensor LUN from the received message with the IPMC-wide unique sensor number and sensor 

LUN. The message is then transmitted over IPMB-0. 


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3.10 FRU information 

All Carriers and Modules must contain a FRU information storage device (for instance, an SEEPROM) that contains 

basic information about them. The format of the FRU information follows the requirements set forth in Section 3.6.3, 

IPM Controller FRU Information, in the AdvancedTCA base specification document (PICMG 3.0 R1.0) and as 

amended by ECN 3.0-1.0-001. In addition to this basic information, additional fields are required to support functions 

unique to the Modules. 

An early and important feature of system management is its inventory management capability. Sections 1.6.11 

through 1.6.14 of the IPMI specification provide an overview of FRU information principles and implementations. 

While the IPMI specification highly recommends that each IPMC implement the “FRU Inventory Device” 

commands, this document makes that a requirement of each MMC. 

The term Field Replaceable Unit (FRU) is used to reference a unit that can be replaced by customers in the field. All 

Modules are FRUs. 

The term FRU information refers to information stored within the Module in some non-volatile storage location. For 

instance, it could be contained in a SEEPROM within the unit. In all cases, the FRU information is accessed through 

a controller that knows how to talk to the non-volatile storage within the Module. 

3.10.1 FRU information access commands 

Access to read or write the FRU information is provided by three IPMI commands directed at the MMC that hosts the 

FRU information. FRU device IDs corresponding to particular Module sites can be identified by scanning the Carrier 

IPMC device SDR repository for device locator records (Type 11h) with entity ID fields set to C1h (Advanced 

Mezzanine Carrier [AMC]). These records represent Modules and their entity instance fields identify the site number 

in which they are installed. 

3.11 Bridging 

The Carrier IPMC manages the Module using a minimal set of IPMI commands. This minimal set of commands are 

the mandatory ones that the Module must support. For Module management purposes, there is no means and no need 

for an external entity (application in the Carrier, or Shelf Manager) to execute an IPMI command directly on the 

MMC. But if there are proprietary IPMI-based commands or optional IPMI 1.5 commands implemented in the MMC 

that the applications in the Carrier (or other entity that can talk to the IPMC on the Carrier) have to execute, the way 

to do it is by utilizing the Send Message command in the IPMC. For this reason all Carriers that host one or more 

Modules must support the Send Message IPMI command. 


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Power distribution 4 

The purpose of this section is to describe the specifications for features and components required to support the 

Advanced Mezzanine Card (AMC), such as: 

• Payload current limiting 

• Payload power 

• Management power 

• AMC Module power interface 

• AMC Connector 

• AMC Module power distribution 

• Fault tolerant payload operation 

Standard Carrier board features outside the scope of this document include power source isolation, safety grounding, 

backplane interface, limiting inrush current, providing over-current protection, and steady state operational current. 

4.1 Overview 

The power distribution required to support AMCs on the Carrier includes power sources for both payload power and 

management power. Hence, AMC power distribution requirements include both payload and management power. 

Figure 4-1 shows the major components comprising the power distribution system. 

Figure 4-1 Power distribution block diagram 

AMC Payload 

Power Source 

PWR (8) 

Payload 

Power 


Power 

Interface(s) 

MP (1) 


Connector(s) 

Basic side 

Management 

Power 

AMC Module(s) 

Power 

Distribution 

GND (28) 

Ground 

GND (27) 

Extended side 

Ground 

Carrier side 

Carrier/Module 

Boundary 

Module side 

The AMC payload power source can be at any voltage derived from the supplied and specified 12 V and a single 

payload power voltage helps minimize the number of power pins. This also accounts for the supply voltages changing 

constantly, as they migrate to lower and lower voltages. This approach has the additional advantage of lending itself 


Page 34 of 57

to a point of load (POL) regulated power distribution strategy (to all payload circuits on the Module), which is 

believed to be a superior design technique. AMC payload power distribution is variable and determined by the 

Module design, as long as it conforms to the requirements of this section. 

The AMC management power source can be at any voltage that is convenient to the design and is derived from the 

specified Carrier. The Module management source can either be Carrier management power or Carrier payload 

power. The AMC Module power distribution will mostly provide isolated management power for the Module 

Management Controller (MMC). 

4.1.1 Power interface 

Module power interface presented in Figure 4-2 includes management and payload power current limiters; these two 

supply voltages need to have power-good indicators so that the system management can detect boot sequence events 

and nominal operating conditions. 

PS0# and PS1# provide for AMC presence detection. Two signals are used to ensure that the Module is fully seated 

even if rotated slightly. Also, the interface circuitry presented in Figure 4-2 recurs for every Module-Carrier 

combination. The power interface also provides an ENABLE# signal which is an open drain signal, driven by the 

Carrier and pulled up to MP on the Module. This signal is asserted when the Carrier detects that the Module is not 

fully inserted. The Carrier may additionally assert ENABLE# to restart the MMC if needed. The MMC is supposed to 

not execute a payload reset on the Module in this case. 

The CMC can sense the actual amount of Module current flow for any given site. This will allow the CMC to 

dynamically respond to any Module site if the site begins to draw more current than the stored value on the FRU 

ROM. The response of the CMC could be to inform the Shelf Manager of this condition or to immediately shut down 

the offending Module site’s power supply. 

Figure 4-2 Module power interface 

Carrier 

(non-recurring circuit) 

AMC Power Interface 

(recurring circuit for each bay) 


Connector 

AMC Module Power 

Distribution 

Module 

Management 

Power 

Source 

Module 

Management Power 

Current Limit 

MP 

Module 

Management 

Power 

Carrier 

Management 

Power 

2.2K 

PG 

10K 

MP Good 

Presence 

ENABLE# 

MMC 

IPMC 

PS0# 

PP Enable 

Payload 

Pwr Good 

PS1# 

470 

Note 1 

220 

2.7K 

Option surprise extraction 

detection circuit 

MPP 

Enable 

Current 

Limit 

2.7K 

Payload 

Power Source 

Note 1 - If surprise extraction circuit 

not used replace 470 with 0 ohms 

Carrier side 

PWR 

Module side 

Module 

Payload 

Power 


Page 35 of 57

Thermal 5 

Thermal design requirements of this sort are relatively new to specifications such as PICMG 3.0 and PICMG.AMC. 

They are included here because of the experiences of the committee members in the market. Printed circuit board 

manufacturers have not been able to create designs with clearly defined capabilities, to dissipate heat. And system 

integrators have not had the necessary thermal data to design a system, mandated by the specifications. This portion 

of this specification is an attempt to bring a new level of understanding and information exchange to meet this market 

need. 

Being in compliance with the “shall” requirements in this section will not guarantee complete compatibility of 

Modules and Carriers. The system integrator will be required to evaluate the compatibility/ interoperability of 

Modules and Carriers involved. Also, in this section alone, compliance with the “should” provisions is intended to 

provide good evidence of interoperability, but not a guarantee. The committee felt that it was too restrictive of a 

Module originally designed for unique specific applications to match the features of a general-purpose Module. 

Carriers with mezzanine cards are in fact the most challenging thermal design applications and some issues that cause 

them to be so are: 

• Multiple Carrier form factors 

• Wide range of Module types 

• Higher airflow resistance 

• Varying power levels 

There are at least two approaches to obtaining the thermal data required in this section: 1) Thermal analysis using 

Computational Fluid Dynamics modeling tools such as ICEPAK from Fluent or Flotherm from Flomerics, and 2) 

Empirical measurement using a wind tunnel. The analysis approach requires specified pressure gradients across 

Modules or Carriers. Knowing the design pressure will enable the ability to calculate volumetric airflow based on 

impedance curves of the individual components. Then having determined airflow, heat dissipation and temperature 

rise can be calculated. 


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Interconnect 6 

The AMC.0 interconnect framework comprises the physical Connector used to mate the AMC with its Carrier board, 

the mapping of signals to that Connector, and the routing of those signals among the AMCs across the Carrier, and 

also to the Carrier based switching elements. The performance headroom in the Connector will allow future 

interconnect technologies with higher signal rates to be accommodated within the framework. The generic signal 

mapping across the AMC Connector supports a variety of system fabric topologies for connecting AMCs together. 

The Interconnect interfaces are divided into six functional groups: 

• Fabric Interface 

• Control Interface 

• System Management Interface 

• Synchronization Clock Interface 

• JTAG Test Interface 

• Power 

These interfaces are connected between each AMC Carrier and the AMC Module across the Connector. 

AMC Carrier and Module compatibility guidelines are defined within this section for the following functional 

groups: Fabric Interface, Control Interface, Synchronization Clocks and JTAG. System Management and Power 

Interconnect specifics are covered in Sections 3 and 4 respectively. 

The AMC.0 base specification provides a physical framework for the Fabric Interface. AMC.0 subsidiary 

specifications define how to overlay a specific switching interconnect technology onto the AMC.0 Fabric Interface 

physical framework. 

Governance of AMC Module and Carrier board compatibility for the Interconnect interfaces, including the Fabric 

Interface, is provided by an Electronic Keying mechanism that is an integral part of the AMC.0 Module Management 

architecture. 

The ability to deploy interconnect technologies to the Fabric Interface (through subsidiary specifications) is limited 

by the number of assigned Fabric ports on the AMC Connector and the signal rate capacity defined by that Connector. 

6.1 Connector pin allocation 

The AMC Connector supports 170 pins, the Connector and pin definition are optimized around supporting high speed 

interconnects. The AMC Carrier can be optionally fitted with either a full connectivity 170 pin Connector, or with an 

85 pin version to reduce cost where less Fabric connectivity can be accepted. 

The AMC Connector array optimally supports five separate interfaces to the AMC Carrier to utilize: 

• 2 pins allocated to the Control Interface 

• 42 signal pairs allocated to the Fabric Interface 

• 3 pin pairs allocated to the Synchronization Clock Interface 

• 5 pins allocated to the JTAG Test Interface 

• 9 pins allocated to the System Management Interface 

Four levels of sequential mating (first mate, second mate, third mate, and last mate) are provided to ensure a correct 

electrical connection sequence is followed during insertion and extraction of the Module. 


Page 37 of 57

Table 6-1 AMC Connector A+B+ footprint pin assignments 

Slot Layer A 

Slot Layer B 

Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal 

A85 GND A86 GND B85 GND B86 GND 

A84 MA_PWR A87 MA_Tx8- B84 MB_PWR B87 MB_Tx8- 

A83 MA_PS0# A88 MA_Tx8+ B83 MB_PS0# B88 MB_Tx8+ 


A81 MA_CLK3- A90 MA_Rx8- B81 MB_CLK3- B90 MB_Rx8- 

A80 MA_CLK3+ A91 MA_Rx8+ B80 MB_CLK3+ B91 MB_Rx8+ 


A78 MA_CLK2- A93 MA_Tx9- B78 MB_CLK2- B93 MB_Tx9- 

A77 MA_CLK2+ A94 MA_Tx9+ B77 MB_CLK2+ B94 MB_Tx9+ 


A75 MA_CLK1- A96 MA_Rx9- B75 MB_CLK1- B96 MB_Rx9- 

A74 MA_CLK1+ A97 MA_Rx9+ B74 MB_CLK1+ B97 MB_Rx9+ 



A71 MA_SDA_L A100 MA_Tx10+ B71 MB_SDA_L B100 MB_Tx10+ 


A69 MA_Tx7- A102 MA_Rx10- B69 MB_Tx7- B102 MB_Rx10- 

A68 MA_Tx7+ A103 MA_Rx10+ B68 MB_Tx7+ B103 MB_Rx10+ 


A66 MA_Rx7- A105 MA_Tx11- B66 MB_Rx7- B105 MB_Tx11- 

A65 MA_Rx7+ A106 MA_Tx11+ B65 MB_Rx7+ B106 MB_Tx11+ 








A57 MA_PWR A114 MA_Rx12- B57 MB_PWR B114 MB_Rx12- 

A56 MA_SCL_L A115 MA_Rx12+ B56 MB_SCL_L B115 MB_Rx12+ 


A54 MA_Tx5- A117 MA_Tx13- B54 MB_Tx5- B117 MB_Tx13- 

A53 MA_Tx5+ A118 MA_Tx13+ B53 MB_Tx5+ B118 MB_Tx13+ 


A51 MA_Rx5- A120 MA_Rx13- B51 MB_Rx5- B120 MB_Rx13- 

A50 MA_Rx5+ A121 MA_Rx13+ B50 MB_Rx5+ B121 MB_Rx13+ 









A41 MA_ENABLE# A130 MA_Tx15+ B41 MB_ENABLE# B130 MB_Tx15+ 



Page 38 of 57

Table 6-2 Table 6-4. AMC Connector A+B+ footprint pin assignments (continued) 

Slot Layer A 

Slot Layer B 

Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal Pin Nr. Signal 














A26 MA_GA2 A145 MA_Rx17+ B26 MB_GA2 B145 MB_Rx17+ 









A17 MA_GA1 A154 MA_Tx19+ B17 MB_GA1 B154 MB_Tx19+ 









A8 MA_ETH100T A163 MA_Rx20+ B8 MB_ETH100T B163 MB_Rx20+ 


A6 MA_ETH100R A165 MB_TCLK B6 MB_ETH100R B165 MB_TCLK 

A5 MA_GA0 A166 MB_TMS B5 MB_GA0 B166 MB_TMS 

A4 MA_MP A167 MB_TRST# B4 MB_MP B167 MB_TRST# 

A3 MA_PS1# A168 MB_TDO B3 MB_PS1# B168 MB_TDO 

A2 MA_PWR A169 MB_TDI B2 MB_PWR B169 MB_TDI 


6.2 Fabric Interface 

The Fabric Interface is comprised of up to 21 ports providing point-to-point connectivity for Module-to-Carrier and 

Module-to-Module implementations. The Fabric Interface can be used in a variety of ways by AMCs and AMC 

Carrier boards to meet the needs of many applications. There are two usage models: 

• Transport types covered by the AMC subsidiary specifications, i.e., Ethernet, PCI-Express, etc. 

• Vendor-specific mappings named within this specification as General Purpose Input/ Output. GPIO still 

adheres to the Fabric Interface electrical specifications. 


Page 39 of 57

6.2.1 Fabric Interface electrical requirements for LVDS 

Independent of Electronic Keying (E-Keying), the receiver hardware must not be damaged during inadvertent 

interconnects of incompatible interfaces; therefore, the following requirements have to be followed. Figure 6-1 shows 

one mode of operation where two Modules are directly connected via a passive AMC Carrier. The example shows the 

case where optional receive interface capacitors are required. 

Figure 6-1 Channel test points - Module to Module routing model 


AMC Carrier 


Tx 

Rx 

TP-1 

(BGA Pads) 

TP-4 

(BGA Pads) 

AMC Connectors 

6.2.2 Fabric Interface electrical requirements for non-LVDS 

Due to the fine pitch of the connector and the 0.1 mm isolation distances between conductive areas in the connector 

area, the voltage range of the signaling needs to be restricted. The potential difference between adjacent connection 

areas is limited accordingly by the following requirements: 

6.3 Control Interface 

A dedicated control Port is provided to allow for the initialization and Control of the AMC Module before Fabric 

ports are enabled. This allows for components on the Module to be initialized at startup. This also allows software 

uploads which may include FPGA code to initialize programmable logic devices, or runtime images to be retrieved 

from networked storage devices for example. This provides the ability to see the AMC as a logical IP endpoint for 

control purposes. AMC Modules supporting the Control Interface may also support the Fabric Interface. The Control 

Interface supports 100 Mbit Ethernet operating in a single ended mode. Figure 6-2 shows the interconnect detail for 

this interface. 


Page 40 of 57

Figure 6-2 Control Interface 

Transmitter Portion 

3V3 

Receiver Portion 

49.9 R 

49.9 R 

0.1uF 

Tx+ 

Rx+ 

PHY-Transmit 

(100Base-FX) 

3V3 

49.9 R 

49.9 R 

49.9 R 

1V8 

PHY-Receive 

(100Base-FX) 

Tx- 

Rx- 

6.3.1 Control Interface model 

The Control Interface is based on a single ended Ethernet model capable of supporting 100 Mbps. Control Interface 

support is governed by the system management Electronic Keying mechanism; however, only a subset of 

requirements apply due to the deterministic nature of the interface. In particular, the Control Interface drivers do not 

need to be electrically isolated either from the AMC Module or the Carrier perspective. 

6.3.2 Control Interface E-Keying requirements 

Because the Control Interface signaling has only one configuration, Electronic Keying is not required to resolve 

potential signaling conflicts. However, boards are required to support E-Keying entries in the AMC FRU 

information. 

6.4 Synchronization Clock Interface 

This section defines the clock interface requirements to ensure interoperability between the AMC Module and the 

Carrier card that may be supplied by multiple vendors. 

Many telecommunications applications using the AdvancedTCA and Advanced Mezzanine Card architectures need 

to interface to external networks that require strict timing relationships between multiple interfaces and the external 

network, such as PDH networks and SONET/SDH networks.Such Interfaces typically require the AMC Module to 

receive frame and bit rate clocks from the Carrier, also to transmit a bit rate clock to the Carrier. 

The Synchronization Clock Interface provides three differential pairs for clock distribution to enable applications that 

require the exchange of synchronous timing information among Modules and consequently multiple boards in a 

Shelf. This allows Modules to source clock(s) to the system in the case where it provides a Network Interface 

function, or conversely to receive timing information from another Carrier board or Module within the system. 


Page 41 of 57

6.5 JTAG Interface 

JTAG IEEE 1149.1 support is provided on the AMC Connector. This provides an industry standard method of 

performing manufacturing test and verification and is critical to the test of today's complex and often exclusively 

BGA device products. The JTAG Interface is supported for vendor product test primarily to increase product test 

throughput and hence reduce manufacturing cost. The optional JTAG support is provided via the extended half of the 

Connector, which is available in the B+ or A+B+ Connectors. 

The Module may support JTAG as required by the vendor. The Carrier may provide JTAG chain support for Modules 

and should allow the chain to be kept intact in the absence of an empty Module site. The JTAG capable Module shall 

function correctly on a non-JTAG supporting Carrier by providing applicable pullup/pulldown resistors. 

6.6 System integration guidelines 

The design flexibility offered by the Fabric Interface requires some guidelines to ensure proper interoperability 

between compatible AMC Modules and their Carrier boards. This section describes the minimum compatibility 

requirements for Carrier boards and Modules to ensure interoperability. 

The AMC Electronic Keying mechanism will confirm compatible connections exist prior to interface drivers being 

enabled. This ensures incompatible Module/Carrier combinations do not damage one another; however, 

interoperability of compatible boards can only be obtained when they are installed correctly. The AMC subsidiary 

specifications detail the Fabric Port usage specific requirements to ensure interoperability. 

6.7 AMC Carrier fabric topologies 

The AMC Connector provides up to 21 ports of fabric connectivity. This gives the flexibility to support a variety of 

fabric topologies. The following sections describe two fabric topologies that are expected to cover many of the 

application requirements and can be supported with AMC Carrier applications. 

Supporting multiple fabrics and/or topologies within a single system environment can be advantageous both for: 

• Communications applications that require high speed, low latency data-plane interconnects. 

• Control-plane interconnects with less stringent latency and jitter requirements. 


Page 42 of 57

AMC Connector 7 

AMC Connector manufacturers shall comply with Performance Level 3, System Quality Requirements Level III and 

Quality Level III according to GR-1217-CORE. 

AMC Connector manufacturers shall state the Performance Level, the System Quality Requirements, Level, and the 

Quality Level according to GR-1217-CORE of their products. 

The AMC Connector is a single-part Z-Pluggable Connector. It contains groups of contacts for power, for general 

purpose connections, and for very high speed transmissions. 

The general contact pitch is 0.75 mm at the Module side and at the Carrier side. 

The AMC Connector makes pluggable card edge connections to the contact fingers on the AMC Module PCB and 

solderless compression connections to the conductive pads on the Carrier board. It is mounted on the Carrier by 

means of two screws through the Carrier board onto a steel Connector Brace. 

7.1 AMC Connectors - Basic and Extended 

The Basic Connector only connects to contact fingers on Component Side 1; the Extended AMC Connector connects 

to both sides of the AMC Module PCB. Compared to the Extended Connector, the Basic Connector provides a cost 

advantage for the connector and saves real estate on the Carrier board. 

AMC Connector contact definitions have been made such that the indispensable connections are implemented in the 

Basic Side. Connections for additional differential pair signals have been implemented in the Extended Side, they are 

only available in the Extended Connectors. 

The Basic Connectors have been designated as B and AB, while the Extended Connectors have been designated as 

B+ and A+B+. 

Table 7-1 Functional contact list: Basic Side 

Basic Side (AMC Module Component Side 1) 

Power 2, 9, 18, 27, 42, 57, 72, 84 

Ground 

1, 7, 10, 13, 16, 19, 22, 25, 28, 31, 34, 37, 40, 43, 46, 49, 52, 55, 58, 61, 

64, 67, 70, 73, 76, 79, 82, 85 

General purpose 3, 4, 5, 6, 8, 17, 26, 41, 56, 71, 83 

Differential pairs 

11/12, 14/15, 20/21, 23/24, 29/30, 32/33, 35/36, 38/39, 44/45, 47/48, 50/51, 

53/54, 59/60, 62/63, 65/66, 68/69, 74/75, 77/78, 80/81 

Table 7-2 Functional contact list: Extended Side 

Extended Side (AMC Module Component Side 2) 

Power 

Ground 

none 

86, 89, 92, 95, 98, 101, 104, 107, 110, 113, 116, 119, 122, 125, 128, 131, 

134, 137, 140, 143, 146, 149, 152, 155, 158, 161, 164, 170 

General purpose 165, 166, 167, 168, 169 

Differential pairs 

87/88, 90/91, 93/94, 96/97, 99/100, 102/103, 105/106, 108/109, 111/112, 

114/115, 117/118, 120/121, 123/124, 126/127, 129/130, 132/133, 135/136, 

138/139, 141/142, 144/145, 147/148, 150/151, 153/154, 156/157, 159/160, 

162/163 


Page 43 of 57

7.1.1 Family of AMC Connector styles 

The AMC Connector family consists of four different connector styles, with three different housings. 

Table 7-3 Number of contacts in the fixed connector 

Connector 

Style 

Interface 

to AMC 

Module 

Number 

of Module 

Slots 

Number 

of contact 

positions 

to Carrier 

Number 

of contact 

rows on 

Carrier 

Differential 

pairs 

General 

purpose 

contacts 

Power 

contacts 

Ground 

contacts 

B Basic 1 85 1 19 11 8 28 

B+ Extended 1 170 2 45 16 8 56 

AB Basic 2 170 2 38 22 16 56 

A+B+ Extended 2 340 4 90 32 16 112 

Figure 7-1 Overview of AMC Connector housings 

86 

85 

86 

Slot B 

85 

86 

Slot A 

85 

170 

1 

170 

85 

85 

1 

1 

170 

1 

Style B/B+ 

1 

Style AB 

Style A+B+ 

When the Carrier is equipped with a Cutaway Carrier board, two layers of Half-Height AMC Modules may be used. 

AMC Connectors AB and A+B+ provide the interconnections between both AMC Module layers and the Cutaway 


When the Carrier is equipped with a Conventional Carrier board (no cut-out), only AMC Module Layer B can be 

used. AMC Connectors B and B+ provide the connections between Module Layer B and the Conventional Carrier 

board. 

The AMC Connector styles shall provide alignment posts, distance pillars, and passages for mounting screws to 

assure proper alignment of the Carrier Component Covers. 

The lead-in chamfers of the plug-in slots of the AMC Connector shall be able to correct a maximum misalignment of 

the AMC Module PCB of ± 1 mm in the height and width directions, taking the lead-in features of the AMC Module 

PCB into account. 

7.1.2 Contact protection mechanism (optional) 

The AMC Connector may contain an optional feature to protect the contact beams from damage during insertion over 

the card edge. The mechanism prevents the contacts from scraping over the milled chamfers, where potentially 

exposed copper layers and glass fibers cause wear and eventual contamination to the contact surface. 

A mechanical device hovers the contacts over the AMC Module PCB edge, and lets them land on auxiliary pads in 

front of the actual contact pads. 


Page 44 of 57

7.2 Dimensions 

7.2.1 Dimensions of AMC Connectors 

For dimensional drawings of other connector styles see the full AMC Specification. 

Figure 7-2 Overall dimensions of AMC Connector style A+B+ 


Page 45 of 57

Figure 7-3 View on compression mounted bottom of AMC Connector style A+B+ 

7.2.2 Connector Braces for the Carrier board 

On Component Side 2 of the Carrier board, opposite the AMC Connector, a Connector Brace shall be mounted to 

exert a homogeneously spread force of 0.5 N per contact, to compensate for the compression force and prevent the 

Carrier board from bending after time and temperature exposure. 


Page 46 of 57

7.3 Electrical characteristics 

7.3.1 Current carrying capacity 

All power and ground conductors inside the AMC Connector shall be able to carry 1.0 A minimum, simultaneously 

driven, at an ambient temperature of 70 C. 

7.3.2 Line resistance 

Table 7-4 Maximum line resistances 

Maximum initial line 

resistance 

Maximum change in 

relation to initial value 

Differential pair conductors 375 mΩ max ±15 mΩ 

Ground conductors 60 mΩ max ±15 mΩ 

General purpose conductors 90 mΩ max ±15 mΩ 

Power conductors 90 mΩ max ±15 mΩ 

In order to avoid excessive current in the lower resistance lines, the difference in line resistance between conductors 

belonging to the same group of power conductors shall not exceed ± 20% of the average line resistance in the group 

during all test sequences. 

7.4 High-speed characteristics 

Conditions:Specimen environment impedance = 100 Ω differential 

Measured step rise time (10% – 90%) throughout the AMC Connector 30 ps maximum 

Adjacent lines terminated at both ends 

7.4.1 Differential impedance 

Under the conditions stated above, the impedance profile of the AMC Connector together with its connections to the 

AMC Module PCB and the Carrier board shall show an average value of 100 Ω ± 5 Ω. 

Under the conditions stated above, the differential impedance peak values of the AMC Connector together with its 

connections to the AMC Module PCB and the Carrier board shall stay within a tolerance band of 100 Ω ± 10 Ω. 

7.4.2 Differential return loss 

Under the conditions stated above, the differential loss profile of the AMC Connector together with its connections to 

the AMC Module PCB and the Carrier board shall be better than 20 dB at 5 GHz, better than 15 dB at 8 GHz, and 

better than 8 dB at 18 GHz. 


Page 47 of 57

7.4.3 Differential attenuation 

Under the conditions stated above, the differential attenuation profile of the AMC Connector together with its 

connections to the AMC Module PCB and the Carrier board shall be less than 1 dB at 8 GHz, less than 2 dB at 

12 GHz, and less than 4 dB at 18 GHz. 

7.4.4 Differential pair cross talk 

Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair by 

two driven adjacent differential pairs in the AMC Connector, together with their connections to the AMC Module 

PCB and the Carrier board, shall be less than 2%. 

Under the conditions stated above, the differential cross talk amplitude induced at the far end to a differential pair on 

the Extended Side by an opposite differential pair on the Basic Side in the AMC Connector, together with their 

connections to the AMC Module PCB and the Carrier board, shall be less than 2%. 

7.4.5 Propagation characteristics 

The propagation characteristics are measured in transmission lines including traces and contact pads on the AMC 

Module PCB and the Carrier board. 

Transmission lines coming from the Basic Side have a shorter propagation time compared to the lines coming from 

the Extended Side. The time difference between Basic and Extended Side is identical for connectors coming from 

different sources. This difference can be compensated by adding 30 ps of propagation time in the layout of the traces 

on the Carrier board for the lines coming from the Basic Side. 

The propagation delay skew within each differential pair including traces and contact pads on the AMC Module PCB 

and the Carrier board shall be 2 ps maximum. 

The propagation delay skew between differential pairs including traces and contact pads on the AMC Module PCB 

and the Carrier board and belonging to the same side of the Module interface shall be 20 ps maximum. 

The average propagation delay shall be 30 ps greater on the Extended side of the connector than on the Basic side. 

7.5 Mechanical characteristics 

7.5.1 Mechanical operation 

The AMC Module PCB shall withstand 50 mating cycles with one AMC Connector under the above stated 

conditions, without damage that would impair normal operation. 

The AMC Connector shall withstand 250 mating cycles with five AMC Module PCBs in sequence, each of them 

serving 50 cycles under the above stated conditions, without damage that would impair normal operation. 

7.5.2 Engaging and separating forces 

Table 7-5 Engaging and separating forces 

Mating sides Single-sided Double-sided 

Maximum engaging force 100 N 100 N 

Maximum separating force 65 N 65 N 

Maximum bottoming force 200 N 200 N 


Page 48 of 57

7.5.3 Compression connection - remounting operation 

Conditions:Use three times the same connector and the same connector location on the same Carrier board 

After successfully mounting and connecting the AMC Connector, it shall be possible to perform at least three 

remounting operations without damaging the AMC Carrier board in a way that would impair normal operation. 


Page 49 of 57

AMC mating conditions 

A 

A.1 Alignment in width direction (parallel to the plane of 

the Module PCB) 

Table A-1 Width dimensions and tolerances 

Nominal 

dimension 

Tolerance 

± 

Position 

tolerance 

Guide Rail width (from pitch-line) Gw 0,50 0,030 0,08 

Guide Rail slot depth Sd 1,70 0,08 

Connector slot width Cw 65,15 0,05 0,03 

Connector centering holes Cc 0,03 

Module PCB width Bw 73,50 0,10 

Module PCB interface width Bi 65,00 0,10 

Width of non-insulated components CNw 70,10 max. 

Milling symmetry on Module PCB Msym 0,03 

Etching symmetry on Module PCB Esym 0.05 

Pitch on cover plates P 75,00 0.08 

Figure A-1 Dimensions in width direction 


Page 50 of 57

The given dimensions assure that in mated condition there is no constraint in width direction between the Connector 

and the Guide Rails. As a result, the back end of the Module PCB will be solely supported by the Connector, not by 

the Guide Rails. 

The lead-in chamfers of the plug-in aperture of the Connector are designed to correct a maximum misalignment of ± 

1 mm in width direction, taking the chamfers of the Module PCB into account. 

In worst case conditions the Module PCB keeps an overlap with the Guide Rails of at least 0.7 mm under all 

insertion/withdrawal and mating circumstances. 

The space between the Guide Rails permits the use of non-insulated components with a maximum width of 70.10 mm 

without interference with the Guide Rails. 

During insertion of the AMC Module the inclination in width direction is limited to ± 1° by the Guide Rails of the 

Carrier, in mated and locked condition it is reduced to ± 0°20'. 

A.2 Alignment in height direction (perpendicular to the 

plane of the Module PCB) 

Table A-2 Height dimensions and tolerances 

Module Layer A 

Module Layer B 

Nominal 

dimension 

Tolerance 

± 

Nominal 

dimension 

Tolerance 

± 

Centre of Guide Rail slot/cover 

plate 

Ga 8.68 00.8 Gb 3.90 00.8 

Guide Rail slot height Sh 2.10 00.8 

Module PCB thickness Bt 1.60 0.16 

Centre of Connector slot/cover 

plate 

Ca 8.68 00.8 Cb 3.90 00.8 

Connector slot height Co 1.90 00.8 

Figure A-2 Dimensions in height direction 

The given dimensions assure that in mated condition there is no constraint in height direction between the Connector 

and the Guide Rails. As a result, the back end of the Module PCB will be solely supported by the Connector, not by 

the Guide Rails. 

The lead-in chamfers of the plug-in aperture of the Connector are designed to correct a maximum misalignment of ± 

1 mm in height direction, taking the chamfers of the Module PCB into account. 


Page 51 of 57

A.3 Mating depth conditions 

The Module Locking Latch mechanism applies a constant force on the Module PCB in engaging direction, to keep it 

bottomed to the Connector slot, at all times and under all possible operating conditions. 


Page 52 of 57

AMC Module Face Plates - 

implementation example 

B 

B.1 Purpose 

In Section 2 of the AMC Specification some features concerning the Module Face Plate assembly are left open for 

various design solutions: 

• The shape and manufacturing technology of the Face Plate may be different from the sheet metal 

construction. 

• The fixation of the Face Plate to the Module PCB is implementation dependent. 

• The location of the LED’s may vary in a small range at the top of the Face Plate. 

• The extraction lever and the locking mechanism may adopt different solutions. 

• The location and choice of the Hot Swap microswitch depends on the choice of the locking mechanism. 

• The purpose of Appendix B is to show different examples of mechanical implementations, including 

specific board layouts and keepout areas. 

B.2 Schroff’s implementation 

Schroff’s example is a AMC Module Face Plate unit, consisting of a U-shaped profile with two die-cast flanges and a 

rotating locking latch. 


Page 53 of 57

Figure B-1 Overview of Schroff’s Implementation 

B.3 Front of the Face Plate unit 

Schroff’s implementation specifies fixed dimesnions for: 

• The location of the LEDs 

• The location and front dimensions of the extraction lever 

• The available area for Cable Connector arrangements 


Page 54 of 57

B.4 Fixation to the Module PCB 

The following figure shows the specific method of mounting and the layout of the Module PCB with the milled 

contours, the mounting holes and the keepout areas. 

Figure B-2 Layout of the mounting features on a Single-Width Module PCB 

View on Component Side 2 

View on Component Side 1 

B.5 Cross section through the Face Plate unit 

Schroff's implementation also specifies the space for components inside the faceplate unit, on both sides of the 

Module PCB. It defines how the return flanges of the Faceplate Unit fit into the cutouts of the Carrier Board and their 

position versus the Carrier Struts and Card Guides. It clarifies the maximum dimensions of a faceplate cutout for the 

implementation of Cable Connectors. 


Page 55 of 57

B.6 Locking mechanism 

Figure B-3 AMC Module in position for normal operation 

Module Face Plate 

Rotating locking latch 

Carrier strut with catch 

Hot Swap microswitch 

Carrier Card Guide 

B.7 Locking latch and its catch in the Carrier strut 

Figure B-4 Compensation for 1 mm insertion depth tolerance 

Three situations in case the Module PCB bottoms in the AMC Connector 0.5 mm before it reaches its nominal 

position, in its nominal position, and 0.5 mm beyond its nominal position 

B.8 Extraction lever 

Shape and dimensions of the Knob and the Extraction Lever, including hole for extraction tool. 

Travel of the Extraction Lever during the unlocking sequence. 

Actuating forces during the unlocking and extraction sequence. 

Figure B-5 Dimensions of extraction lever 


Page 56 of 57

Under preparation 

B.9 Other implementations 


Page 57 of 57

AMC D0.9 Short Spec - picmg

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