comparison report - setron

台 灣 半 導 體 股 份 有 限 公 司
TAIWAN SEMICONDUCTOR CO., LTD.
231 台 北 縣 新 店 市 北 新 路 三 段 205 號 11 樓 11F, No. 205 Sec. 3, Beishin RD.
電 話 :886-2-8913-1588 Shindian Dist., New Taipei City, Taiwan, R.O.C. 231
傳 真 :886-2-8913-1788
Tel:886-2-8913-1588 Fax:886-2-8913-1788
MBS (STD GPP) bridge rectifiers(MBS6)
comparison report
Prepared by Owen Wang
Checked by Owen Wang
Approved by Quayer Chen
Issued date at 25 th Sep, 2012
Reversion for A
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Page 1 of 3

台 灣 半 導 體 股 份 有 限 公 司
TAIWAN SEMICONDUCTOR CO., LTD.
231 台 北 縣 新 店 市 北 新 路 三 段 205 號 11 樓 11F, No. 205 Sec. 3, Beishin RD.
電 話 :886-2-8913-1588
Shindian Dist., New Taipei City, Taiwan, R.O.C.
231
傳 真 :886-2-8913-1788
Tel:886-2-8913-1588 Fax:886-2-8913-1788
Material information summary:
Comparison report (MBS6)
Mold compound material type(Non-Green)
Mold compound material type(Halogen Free)
Old
EME-1100SA
EME-EK110G
New
Cancel
EME-EK110G
EME-EK1800G
Result
****** The copyright of document and business secret belong to TSC, and no copies should be made without any permission ******
Page 2 of 3

台 灣 半 導 體 股 份 有 限 公 司
TAIWAN SEMICONDUCTOR CO., LTD.
231 台 北 縣 新 店 市 北 新 路 三 段 205 號 11 樓 11F, No. 205 Sec. 3, Beishin RD.
電 話 :886-2-8913-1588 Shindian Dist., New Taipen City, Taiwan, R.O.C. 231
傳 真 :886-2-8913-1788
Tel:886-2-8913-1588 Fax:886-2-8913-1788
Production Part Approval - Material, Performance Test Results
Discrete Semiconductor Component Qualification Plan
Customer P/N: MBS6 Product Engineer: Reyn
Customer Spec. #:
N/A
General Specification:
Supplier Name:
Taiwan Semiconductor Corp.
Supplier Manufacturing Site:
Supplier Generic P/N: MBS 0.8Amps bridge rectifiers
Required PPAP Submission Date:
Supplier Internal P/N: MBS2 thru MBS10
Family Type: STD GPP
Reason for Qual.:
Add second source with molding compound
YEW
18-Jul-12
Item Test Test Condition Exceptions Est. Start Est. Comp. # Lots S.S. Remarks
1 Electrical Test Electrical characterization @25℃ 17-Jul-12 17-Jul-12 ALL 616 ACC
2 External Visual
Inspect device construction, marking
and workmanship
N/A 18-Jul-12 18-Jul-12 ALL 616 ACC
3 Parametric Verification Electrical characterization @25/150℃ 19-Jul-12 19-Jul-12 1 25 ACC
4 Pre-conditioning Per specification N/A 19-Jul-12 28-Jul-12 1 231 ACC
5 Intermittent Operating Life On/5min, Off/5min 2520cycles 26-Jul-12 3-Aug-12 1 77 ACC
6 H.T.R.B. 80% Rated VR (T=150℃) 168hrs 18-Jul-12 26-Jul-12 1 77 ACC
7 Autoclave Ta = 121 ± 2℃ 15Psig 96hrs 18-Jul-12 22-Jul-12 1 77 ACC
8 Moisture Resistance Ta = 85 ± 2℃, R.H = 85 ± 5% 168hrs 23-Jul-12 31-Jul-12 1 77 ACC
9 Low Temperature Storage Ta = -55 ± 3℃ 168hrs 23-Jul-12 31-Jul-12 1 77 ACC
10 High Temperature Storage Ta = 150(+10/-0)℃ 168hrs 23-Jul-12 31-Jul-12 1 77 ACC
11 Soldering Heat Ta = 260 ± 5℃ 10secs 23-Jul-12 23-Jul-12 1 30 ACC
12 Temperature Cycle
13 Forward Surge Test
-55°C/15Min, 150°C/15Min, 25°C/5Min
(Transfer)
8.3ms Single Half sine-wave
Superimposed on Rated Load
100cycles 18-Jul-12 25-Jul-12 1 77 ACC
@25℃ 23-Jul-12 23-Jul-12 1 10 ACC
14 Solderability Ta = 245 ± 5℃ 5secs 23-Jul-12 23-Jul-12 1 10 ACC
15 DPA Per specification N/A 31-Jul-12 1-Aug-12 1 2 ACC
16
17
Comment:
Prepared by:
Haiyen Liu
Approved by:
Hejun Cui
Date: 2-Aug-12
Date: 3-Aug-12
Title:
Hi-rel supervisor
Title:
QA leader
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