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Pixel Array Detector for Single Particle Scattering - Gruner Group

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Bump-bonding<br />

●<br />

Typically solder or<br />

indium bumping.<br />

●<br />

Critical step <strong>for</strong> the<br />

detector.<br />

●<br />

There are standard<br />

processes used in<br />

industry.<br />

Above: Bumping test<br />

structures.<br />

●<br />

Difficult <strong>for</strong> small<br />

volume research to do<br />

it <strong>for</strong> reasonable cost.<br />

Hugh Philipp<br />

9. Feb. 2006<br />

LCLS – PAD Talk<br />

9

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